JPH06104305A - 半導体実装装置または実装ライン - Google Patents

半導体実装装置または実装ライン

Info

Publication number
JPH06104305A
JPH06104305A JP4250222A JP25022292A JPH06104305A JP H06104305 A JPH06104305 A JP H06104305A JP 4250222 A JP4250222 A JP 4250222A JP 25022292 A JP25022292 A JP 25022292A JP H06104305 A JPH06104305 A JP H06104305A
Authority
JP
Japan
Prior art keywords
wire
loop
mounting
bonding
height
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP4250222A
Other languages
English (en)
Inventor
Norio Nitta
法生 新田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Steel Corp
Original Assignee
Nippon Steel Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Steel Corp filed Critical Nippon Steel Corp
Priority to JP4250222A priority Critical patent/JPH06104305A/ja
Publication of JPH06104305A publication Critical patent/JPH06104305A/ja
Withdrawn legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/4501—Shape
    • H01L2224/45012—Cross-sectional shape
    • H01L2224/45015—Cross-sectional shape being circular
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/4554—Coating
    • H01L2224/45565—Single coating layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/4554—Coating
    • H01L2224/45599—Material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7855—Mechanical means, e.g. for severing, pressing, stamping
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85909—Post-treatment of the connector or wire bonding area
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85909—Post-treatment of the connector or wire bonding area
    • H01L2224/8593—Reshaping, e.g. for severing the wire, modifying the wedge or ball or the loop shape
    • H01L2224/85947—Reshaping, e.g. for severing the wire, modifying the wedge or ball or the loop shape by mechanical means, e.g. "pull-and-cut", pressing, stamping
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/20—Parameters
    • H01L2924/207—Diameter ranges
    • H01L2924/20753—Diameter ranges larger or equal to 30 microns less than 40 microns

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Abstract

(57)【要約】 【目的】 ループ高さを押えつけることによって実装高
さを低減させる装置を組み込んだ半導体実装装置または
実装ラインを提供する。 【構成】 通常のワイヤーボンディング箇所に機械的に
ループを押えつけてワイヤーを塑性変形させる装置を組
み込んだ半導体実装装置をボンディングライン直後に配
置する。 【効果】 ループ高さをボンディング後に低減すること
ができ、薄型パッケージの半導体装置を簡単に実現する
ことができる。

Description

【発明の詳細な説明】
【０００１】
【産業上の利用分野】本発明は半導体ボンディング実装
装置または実装ラインに関する。
【０００２】
【従来の技術】従来、集積回路チップから電気信号を取
り出すワイヤーボンディング法の一つであるボールボン
ディング法は、パッド直上にワイヤーを取り出すため、
全方向へルーピングできる自由度の高い汎用的なボンデ
ィング法である。しかし、近年の集積回路パッケージの
薄型化によりループ高さの低減が求められており、ボン
ディング法やワイヤー材によって低ループワイヤリング
への努力がなされてきている。
【０００３】
【発明が解決しようとする課題】本発明は、上記した従
来のボンディングやワイヤー材における低ループ化の努
力ではなく、ボンディング後に外部の力により機械的に
既にあるボンディング形状を変化させ、絶縁被覆ワイヤ
ーや従来ベアワイヤーによって作られたループ形状を低
くして実装高さを低減させようというもので、通常のワ
イヤーボンディングした後にワイヤーを損傷しないよう
な治具を使用してワイヤー変形のための押えを行う装置
を設けた半導体実装装置または実装ラインを提供するこ
とを目的とする。
【０００４】
【課題を解決するための手段】本発明は、ループ高さを
低減するためにワイヤーループを機械的に押えつけ、塑
性変形させる装置を半導体実装装置または実装ラインに
設けることを骨子とする。その実施の態様としては、リ
ードフレーム、ＴＡＢテープ、プリント配線板等の実装
ライン上にあるボンディング装置に、ボンディング後ア
クチュエーターにより押え用の板をワイヤーループ上に
移動させて押えつけるアームを組み込む。押え用の板は
ワイヤーループ全体が一度に押えられるように実装ライ
ン幅のセラミックスや金属、プラスチック製の板を用い
る。また、インラインでボンディング装置から実装済み
のワイヤーが送られてきた直後に上部より押え板が下降
しループを変形させる装置（図４参照）でも本発明の目
的を達成できる。押えはワイヤーの塑性変形に伴う強度
劣化を防ぐためにボンディングステージ温度と同等の１
００〜３５０℃程度で加熱して行う。押え板は変形して
いくワイヤーを押していくのでワイヤーを傷つけず、ト
ライボロジーの良好な材料を使用する。
【０００５】
【作用・効果】本発明の実施装置は、ワイヤーボンディ
ングが行われている実装箇所にボンディング後に押え板
等で垂直方向より押えてループ高さを低減するように構
成される。押えはボンディング工程直後、ボンダー上あ
るいは実装ライン上で行う。従来、集積回路パッケージ
の薄型化にループの高さが問題になってきたが、本発明
は簡単に半導体回路の小型薄型化に貢献するものであ
る。
【０００６】
【実施例】以下本発明を実施例に基づいて説明する。 実施例１ ループ高さ２５０μｍの３０μｍφで０．４６μｍ被覆
した絶縁被覆ワイヤーによるルーピング（図１）に、ボ
ンディング装置上に組み込んだ押え装置のループ変形用
押え板１４によりワイヤーを塑性変形させ（図２）、同
押え板を取り去った後のループ高さが１６０μｍの、従
来よりも薄型化したワイヤーボンディング実装箇所をも
つ集積回路パッケージを作製した（図３）。
【０００７】実施例２ ワイヤーによるループ高さ２５０μｍのルーピングをも
つ実装箇所にインライン型のワイヤーループ変形装置に
よりセラミックス板をワイヤー高さ１５０μｍになるよ
うに接近させた。塑性変形後のループ高さは１８０μｍ
になり、薄型パッケージを実現した。
【０００８】
【発明の効果】以上説明したように本発明による実装装
置により従来のワイヤーボンディング上に簡単な工程に
よって集積回路の配線実装における薄型パッケージ化が
可能となる。
【図面の簡単な説明】
【図１】通常のボンディングワイヤー実装部の断面概略
図である。
【図２】押えによりワイヤーループを変形させている状
態の概略図である。
【図３】変形後のワイヤーループ高さが低くなった実装
箇所の概略図である。
【図４】実装ライン上にループ変形用押え板を繰り出し
てワイヤーを変形させる装置の概略図である。
【符号の説明】
１１ ＩＣチップ外部端子パッド面 １２ ボンディングワイヤー １３ リード面（第２ボンディング面） １４ ループ変形用押え板 ４１ 試料基板 ４２ 上下動作方向 ４３ 回転動作方向 ４４ 押え板回転軸 ４５ 実装試料ガイド

Claims (1)

    【特許請求の範囲】
  1. 【請求項１】 半導体にワイヤー実装した後、該ワイヤ
    ーのループ部を機械的に押えつけ、塑性変形させる装置
    を設けた半導体実装装置または実装ライン。
JP4250222A 1992-09-18 1992-09-18 半導体実装装置または実装ライン Withdrawn JPH06104305A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4250222A JPH06104305A (ja) 1992-09-18 1992-09-18 半導体実装装置または実装ライン

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4250222A JPH06104305A (ja) 1992-09-18 1992-09-18 半導体実装装置または実装ライン

Publications (1)

Publication Number Publication Date
JPH06104305A true JPH06104305A (ja) 1994-04-15

Family

ID=17204655

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4250222A Withdrawn JPH06104305A (ja) 1992-09-18 1992-09-18 半導体実装装置または実装ライン

Country Status (1)

Country Link
JP (1) JPH06104305A (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007150103A (ja) * 2005-11-29 2007-06-14 Oki Electric Ind Co Ltd 半導体装置及びその製造方法
WO2016092994A1 (ja) * 2014-12-12 2016-06-16 株式会社日立製作所 半導体モジュールおよび半導体モジュールの製造方法

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007150103A (ja) * 2005-11-29 2007-06-14 Oki Electric Ind Co Ltd 半導体装置及びその製造方法
WO2016092994A1 (ja) * 2014-12-12 2016-06-16 株式会社日立製作所 半導体モジュールおよび半導体モジュールの製造方法
JPWO2016092994A1 (ja) * 2014-12-12 2017-09-28 株式会社日立製作所 半導体モジュールおよび半導体モジュールの製造方法
US10177084B2 (en) 2014-12-12 2019-01-08 Hitachi, Ltd. Semiconductor module and method of manufacturing semiconductor module

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Legal Events

Date Code Title Description
A300 Withdrawal of application because of no request for examination

Free format text: JAPANESE INTERMEDIATE CODE: A300

Effective date: 19991130