TWI264100B - Wire bonding method, wire bonding device and recording medium for recording wire bonding program - Google Patents

Wire bonding method, wire bonding device and recording medium for recording wire bonding program Download PDF

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Publication number
TWI264100B
TWI264100B TW092119116A TW92119116A TWI264100B TW I264100 B TWI264100 B TW I264100B TW 092119116 A TW092119116 A TW 092119116A TW 92119116 A TW92119116 A TW 92119116A TW I264100 B TWI264100 B TW I264100B
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Taiwan
Prior art keywords
lead
line
capillary
wire
arc
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TW092119116A
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English (en)
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TW200403826A (en
Inventor
Toru Mochida
Original Assignee
Shinkawa Kk
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Publication of TW200403826A publication Critical patent/TW200403826A/zh
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Publication of TWI264100B publication Critical patent/TWI264100B/zh

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/85Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • B23K20/004Wire welding
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • B23K20/004Wire welding
    • B23K20/005Capillary welding
    • B23K20/007Ball bonding
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    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/60Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
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  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Wire Bonding (AREA)

Description

1264100 玖、發明說明: 【發明所屬之技術領域】 本發明係關於打線方法、打線裝置以 之記錄媒體’特別係控制在…線點與第2打:=
形成引線弧的打線方法、打線裝置以 B 錄媒體。 T打線私式之記 [先前技術】 子等Γ'裝置:列如,係謂等半導體晶片之輸出入端 m m點與搭料導體W的電路基板端子之第2 “:之:’利用細金屬線連接的裝置。此情況下,第i ,若引線弧高度過高的話,^ p 且容易導致引線下垂。以4大小將變大, 到半導體θ # 心_、。舌’引線恐將接觸 丁十日日片或配線圖案。在此, 故進行打線裝置的動作控制。的引線弧, 在第14圖所示係習知技術之引線弧形成方法的步驟圖。 應給毛細管(cap⑴ary)14。此日Γ^、線軸(Wlresp。01)供 的带士 此日守,利用空氣張力賦予適度 分,毛細管14係筒狀構件,引線12則插通其中空部 二二利用引線夹具(咖Cla_r)16而保持。引線失具 不可抉持或放開引線的構件, 。打線對象18、19係保持於未圖心:…起移動 象! 圖不的載物台上。在打線對 之第1打線點2〇、與打線對象19之第2打線點21 Ϊ264100 之間’形成引線弧之時’藉由以下說明的第4 的步驟,使毛細管14編台上所保持的打線對象進圖 相對移動,俾在引線12形成所需的變形。、象進仃 第4⑷圖所示係將引線12連接於打線對象 驟。將引線夾具1 6呈開放上的步 壬開放狀恶俾使毛細管14下
線I端所預形成的焊球打線於第1打線點2〇± H :…⑻、(C)、⑷圖之步驟’使毛細管14上升, 朝與第2打線點之方向的相 开^ 5干, 。藉此,引線12便形成、° 、'移動,然後再上升 使心成文形部分22、24。 22的理由,係因為在引 /成艾形口刀 α⑴線則端形成焊球之 頗難從第1打線點20進行 "、、泉曰更化, 疋订系乾圍部分的變形 彳:第"T線…變形部分22、24的部二:, 線孤之際於第1打線點附近對應於引線12上升之 頸部」之部分。 上开之所明的「 在第4(d)圖中,於毛細管 所示,朝與第2打線 升後,便如第4(e)圖 形成變形部分iC反方向水平移動。藉此, u上升,-邊广水^ 弟4⑴圖所示,—邊使毛細管 。夢ΓηΓ开/方向移動而到達第1打線點上方 :此’形成㈣部分28。此時毛 打線點20至變形部分μ pq 开里係甶弟 12長度,係設定為相當::第:叫 21的引線弧長度。 攸弟1打線點2〇朝第2打線點 成/第4⑴圖中’若毛細管1“升至既定高度,並形 成爾分軸’弓丨線夹具16便挟持著引線12。亦即 1264100 呷使乇細管1 4移 在此狀態下,將毛細管14藉由如第4(g)圖所示之圓弧運 力或函弧運動後的下降,便移動至打線對象19的第2打線 點21,。此時第2打線點21將位於引線12之變形部分28 處’並在此進行打線。 ,…依此方式’在第1打線點20與第2打線點21之間, ㈣取具有變形部分22、24、26的引線弧3〇。但 :形部分28的變'形声產六弓马 θ ^ . 、 3 乂弱,且為確保某種程度的引線弧30 南度,因此不需將變形部分26與變形部分28間的間隔予 以加長,因而在第2打線點21將呈引線弧3〇下垂狀能。 m f5圖所示係另一習知技術的引線弧形成方法之步驟 圖,相較於第4圖,可在篦9 iT綠g 線·,’,占附近使引線弧上升。 在弟5(a)至(c)圖的步驟係如第4圖所 部之步驟。 〜圾所明的頬 ,在第5(c)圖中,使毛細管14朝與第2打線 的相反方向水平移動之後’在第⑽)圖中的 二 二4圖中所示。然後,如第5(,所示,使毛細管:: 4、: 2打線點之方向的相反方向水平移動的量亦較 4_圖。因此,在此所形成的變形部分36,相較於二:弟 不對應於㈣部分26,位於較偏 口所 近第2打線點的位置。 打線點20、即較接 其次,如第5⑴圖所示,—邊使毛細管14上并 邊沿水平方向移動而到達第】打線點2。上方 升,- 變形部分38。此時毛細管的上升量係由第1打:::成 7 1264100 ’交形部分3 8間,從毛細管1 &所送出的引線1 2長度’係口又 定為相當於從第1打線點2 〇朝第2打線點21的引線弧長 度。在步驟(d)中,因為送出相當量的引線,因此在步驟 (f)中的上升量便較少。所以,變形部分36與變形部分38 之間變短,其間的引線形狀將形成如圖所示弧狀。 在第5(f)圖中,若毛細管14上升至既定高度,並形 成變形部分38的話,引線夾具1 6便挾持著引線1 2,而停 止引線的送出。在此狀態下,將毛細管u藉由如第5(g) 圖所示圓弧運動或圓弧運動後的下降,移動至打線對象工9 的第2打線點2:1。此時第2打線點2][將位於引線12之變 形部分38,並在此進行打線。 ,、此方式在第1打線點2 0與第2打線點21之間, 因::有“刀22、24、36的引線弧40。此情況下, 部二36靠近第2打線點21,且變形部* %與變 2打:瞥4 =狀係呈弧狀,因此相較於第4圖,在第 丁綠點附近可使引線弧呈上升狀態。 利文獻] 第 圖) 本專利特開昭63-421 35號公報(第 頁、第1圖 文獻2 頁、第2圖) 曰本專利特開平31 8943號公報(第 到文獻3
日本專利特開平1 0-1 89641 號公教(第 2〜4頁、第1—7 1264100 【發明内容】 但是,在習知之引線弧形成方法,第 部分變形度較弱,弟2打線點的變形 W線弧在第2 #丁飧&者^ 呈下垂狀態,巩蔣# & 線”,,έ處的上升部分將略 心將接觸到打線對象。♦ 基板等的引腳時, 田 打線點為電路 、 Ρ使在弟 2打線點Ρ/4 Ά立 ,僅接觸到欲打線、、”,、寸、產生引線弧下垂 子丁綠的引腳,所以問 2打線點係尊 ,,±、 。相對於此,第 將產生無法預期::::弟2打線點附近物弧下垂恐 再者若毛細管保持引線並依圓弧運動莖 打綠κ々於,, u 5瓜連動寺移動至第2 打線”、、占之,引線弧下垂而 l A A j、咏對泵的話,此相及 動作曰使引線弧形狀變形的危險性 7丨’在第 2打飧點 附近會引起引線弧倒塌的可能性,而打I.占 丨U丑心將局部分 弧播押入毛細管的中空部内。 再者,當引線送出至與第2打線點對應之變形部分(第 4圖之28、弟5圖之38)之際,因a主a A- ;因為毛細管將停止於既定 高度’利用引線夹具停止引線的送出,並將此作為變形部 分,因此引線弧整體長度及第2打線點附近的上升部分長 度將無法穩定。其理由係因為毛細管的中空部與引線之間 會有摩擦的情況,此外,對引線賦予適度張力的空氣張^ 亦有偏差’即使毛細管停止於既定高度’引線的送出量亦 無法一定之故。 如此’在習知技術的引線弧形成方法中,引線弧恐將接 觸到打線對象’因而無法穩定地形成引線弧的高度或形狀。 1264100 有鐘於斯,夫欢dd ^ 本备明為解決習知技術的問 於提供防止引绩π s J π碭,其目的在 与丨線弧接觸到打線對象的 及打線程式。太鉻RR R万法、打線裝置 ^ 5之另一目的在於提供 a 弧形狀的打線方> ^ /A 了穩疋形成引線 、深方法、打線裝置及打線程式。 為達成上述目❼’本發明的打線方 持引線的毛細管,斜 一 糸使插通並保 ,並將第1打缓點1卜 彡動而使引線變形 亘供 2打線點以引線弧連接,並特徵# 具備以下步驟·· 文弁衍徵你 頸部形成步驟,在將引線連接 第〗::線點使引線上升而形成頸部;H點之後,於 第1變形步驟,—邊送出相當於從 該頸部後之异;^八B 引線弧總長扣除 交I長度知I的引線,一邊# Μ 升,接I< 吏Μ毛細官從該頸部上 升接者使该毛細管朝第2打線點 第?:h·娩抓> Wv々夕勒,而形成位於 弟“丁線點之引線第1變形部分; 第2麦形步驟,使該毛細管下降 打線點處上升部分之…J下降並將相當於在第2 之長度的引線,收入該毛細管中,接荖 使该毛細管朝盘該篦9 4 Μ 2打線…: 打 反側的方向移動,而在第 Ζ打線點的引線上升部 — 刀頂2處形成弟2變形部分;以及 引線弧形成步驟,使芎 便。亥毛細&上升,並送出引線直到 5亥弟1受形部分到達哕本“^ ,, Μ 、、、 S刖而位置,且在此狀態下保 第…:吏該毛細管移動至該第2打線點,俾在引線的該 弟!:形部分連接第2打線點,而形成引線弧。 而^由上述構成’在頸部形成後接著送出既定量的引線 在弟2打線點處預先形成第1變形部分,然後收入既 10 1264100 疋量的引線而形成第2變形部分。因此,由 :處限定上升部的第1變形部分、第2變形部分晴:: =變形狀態’因此可防止引線弧在第2打線點附近產生下 二接觸到打線對象的情形發生。此外,因為用以決定整 二=形狀的頸部、第丨變形部分、第2變形部分的位 王一定’故可穩定形成引線弧形狀。 再者’本發明的打線裝置,係具備: 毛細管,係插通並保持引線; 載物台,係保持打線對象; 、移動機構,係使該毛細管對該載物台進行相 以及 引線弧形成控制機構’係控制該毛細管 辑,且在該打線對象的第1打線點與第2:線 、、、]$成引線弧並加以連接; "亥引線弧形成控制機構係執行以下步驟: ,:Μ鳩理步驟’在將引線連接於第.丨打線點之後 打線點處將引線上升而形成頸部; 扣除m形處理步驟’―邊送出相當於從則線弧總長 部:升:叙長度份量的引線’-邊使該毛細管從該頸 位丄妾:使該毛細綱2打線點方向移動,而形成 弟2打線點之引線第1變形部分; 弟:變形處理步驟’使該毛細管下降’並 弟2打線點處上升部分之長度的引線,收 接著使該毛細管朝遠離兮楚9 ^μ ^乇細官中, 吕朝逖離忒弟2打線點方向移動,而在第2 1264100 1264100 @ ?丨線上升部分頂 線狐… 成弟2變形部分;以及 ;=]變形部分到達該毛細管前端位:;二! 下保持引線’使該毛細管移動至” 9 / 1在此狀恶 的該第1變形部分連接第2_;;打線點,俾在引線 再者, 線.站,而形成引線弧。 式係控制打線裝置的動作;J二,某體,❹ 係插通並保持?丨線;载物衣罝诉具備:毛細管’ ,係使該毛細管對該載物:;:::打線對象’·移動機構 成控制機構,係控制該毛:管以及引線弧形 ,且在該打線對象的第丨; 夕動與㈣線的保持 弧並加以連接; τ線點與第2打線點間形成引線 :亥引線弧形成控制機構係執行以下步驟: 頸部形成處理步驟,, ,於第1打结W 在將引線連接於第Η丁線點之後 f 1打線點處將⑽上升而形成 第1變形處理步驟,_ $、、,& 扣除該頸部後之長度出相當於從該引線弧總長 部上升,接著使該毛 邊使。亥毛細官^頸 位於第2打㈣之^ 弟2打線點方向移動,而形成 丁 I、,,占之引線第1變形部分; :處理步驟’使該毛細管下降,並將相當於在 二打線點處上升部分之長度的引線,收入該毛細管中, 細管朝遠離該第2打線點方向移 打線點的引線上井邱八π t i 升$刀頂點處形成第2變形部分;以及 引線弧形成處理步驟’使該毛細管上升,並送出引線 12 1264100 h亥弟l、㈣部分到達該毛細t前端位置, 下保持引線,使該毛細管移動9 4 & g私動至5亥弟2打線點,俾在引線 的遠弟1變形部分連接第2打線點,而形成引線弧。 【實施方式】 。另^’利用圖式針對本發明之實施形態進行詳細說明 予二:在Γ圖式中’與第4圖15圖相同的元件賦 :相问的兀件符號’並省略詳細說明。第】 爰置50的方塊圖。打線穿 "不” 丁、、、 捲線轴11、插通有引線的羊/〜備··引線12供應源的 12的引線夾且16、伴持Η 14、挾持或開放引線 毛細管14虫引^ 象18、19的載物台17、使 使载物△ 17r#^“ “夕動的毛細管移動機構52、 成要件二=載物台移動機構⑷以及控制該等構 戈仟的動作之控制裝置%。 丹
在第1圖中,引線12将M 。此時,利用空氣張力賦予適”:U供應給毛細管14 直徨25毫米的八属姑 、度張力。引線12可採用如 插通其中,八’ D毛細f 14係筒狀構件,引線則 ,、甲工刀,並利用引線夹且 16係可挾持或放開?丨線的構件,*保持。引線夾具 如此,由於毛細管U與引線夹I;::/ 14 -起移動。 動’因此該區塊例如亦可稱為/ ^動並使引線12移 羞”’僅當毛細管插通並 進::或毛細管部13 義的毛細管(包括狹義的毛細=仃處理時’才指廣 載物台-係可沿水平方向;:線夾具)。 十方向移動的Π台,可在上面配 13 l264l〇〇 置用以保持打線對象u 、]Q υ的冶夏楚 固定於載物台17 h ^ /、寺。在將打線對象18 。 之方面,可採用例如真空吸附 毛細管移動機構52係使 f (離開)方向進行相對移動 ^ μ載物台η朝接 $ 13對载物台17沿垂直的ζ方 例如可採用使毛細管 台移動機構54係使载物”7 ,肖移動之伺服馬達。載物 方向面内進行相對性移動口的機:料毛細管部以,在水平 1 7上面平行的面内呈正交的二方^列如可採用在與載物台 上分別設置i台伺服馬達 方向之X軸方向及Y軸方向 動機構54亦可一體化,:移動機構52與載物台移 沿XYZ二轴方—、隹> 4 °卩1 3可相對於載物台1 7 -軸方向進仃相對移動的機構。 控制裝置56係有關引綠 線對象18的第!打線點广//的形成控制’包含有··在打 部开彡点_ ^控制形成引線上升之頸邱的蜎 Μ成處理部60;在打線對象 升之頭抓員 弓丨線上升部分之變形 手丁線點處’控制 ]弟1交形處理部62盥裳9 " 邛64 ;以及進行使引 ,、艾形處理 ,,. 弟2打線點形成弧狀之控制的孤 的挾持或放開之控制、恭 a 八 ;1'引線 ,± ,, 载物σ 1 7對打線對象18、1 9 持或放開之控制等功能。 1 9的保 [控制裝置56可由電子電路之類的硬體所構成,亦可Α 執行控制程式的電腦所構 /、可由 坏構成。控制程式係例如可包八 述步驟:頸部形成處理步驟、第1變形處理步驟、第;:: 處理步驟、以及弧肤形Λ、占 木Ζ受:形 少成處理步驟等。控制程式可内建於 14 1^54100 控制裝置5 6,式本 次者可藉由記錄有控制浐aa + 的媒體進行讀取、& 2 ^式的電腦從可讀取 相關構成之打JT控制裝置56。 第2圖進行說明。第、5ϋ的引線狐形成控制模式,參照 20、與打線對象19之13中在打線對象18之第1打線點 態,係藉由以下所戈 τ線』21之間形成引線弧之形 广所况明的第2()〜Γ 14對載物台上所伴#6, , g )(i)圖之步驟,使毛細管 汀保狩的打線對象進杆 12形成必要的變形。 了私動,俾使引線 第2⑷〜(C)圖之步驟係在打線對象 20,形成使引線〗2上 之弟1打線點 峻]2、卓接w * 升之,貝^的步驟。第2(a)圖係將弓i 線12連接於打線對象18上的步驟 : 狀態俾使毛細管14下曝^ &火/、仙呈開放 ,, ,:引線前端所預先形成的焊球 打線方;弟1打線點20上。苴 κ 之牛赞,㈣ρ 上其-人,如第2(b)、(〇、⑷圖 二?毛細官14上升少許’朝與第2打線點之方向的 相^向水平移動’然後再上升。藉此引線12便形成變 形部7刀22、24,當形成引線弧後 的引線12上升部分的頸部。便…1打線點20 第2⑷圖的步驟係將在下_步驟第2(e.中㈣^ 第1變形部分之位置設定於引線上。在第2⑹圖中形成頭 部的變形部分24之後’使毛細管U從變形部分24起上升 第1既定量。第1既定量係相當於第!打線點2〇至第2打 線點21形成弧狀而連接的引線弧總長,扣除頸部之引線 長度後的置。即’帛2(d)圖之毛細;f 14最高位置處的毛 細管14前端引線的位置’係對應於形成引線弧之際的第2 1264100 打線點的位置。 …第2(e)圖係在第2打線點處形成第ι變形部分的第工 、义形步驟。使在第2 (d)圖中已t斗笙1日a: 一 m〒已上升弟1既定量的毛細管14 ;月弟2打線點21方向移動。藉此在形成引線弧之際的第 :線點位置處,引線將確實地變形。此經變形之引線的 刀稱為「第1變形部分78」。 :2⑴圖的步驟係將在下一步驟第2(g)圖中所形成之 二2::部分之位置設定於引線上。在第2(e)圖中於引線 旦形成弟i變形部分之後,使毛細管14 —邊下降第2既定 1,-邊沿水平方向移動至第"丁線點2〇上方。因此,引 :係被毛細管14收入第2既定量的長度。第2既定量係相 當於:2打線點21處之上升部分長度的量。即,第2⑴ 圖中最低位置處的毛細管14前妒办φ y ^ , S 4月〇而位置,係對應於形成引 、'友弧之際的第2打線點處上升部分之頂點位置。 第2(g)圖係帛2打線點之上升部分頂點處, 變:部分的第2變形步驟。在第2⑴圖中,經下降第2既 定量的毛細管14,係朝與第2打線點相反側之方向移動。 此移動量係大於步驟(c)、(e)中的移動量。藉此移動,在 形成引線弧之際…打線點處上升部分的項點位置處, 引線將確實地變形。此經變形後之引線的部分 變形部分7 6」。 弟2(h)圖的步驟係將引線的f丨變形部分π位置對 位於毛細管14前端。在第2(g)圖形成第2變形部分Μ之 後,使毛細管14一邊上升一邊沿水平方向移動至第^打線 16 1264100 點20上方。此時,因為⑴ " …、線係攸毛細管送出,因此告镇^ 變形部分78位置到達毛细总u 1 “ 毛'、、田吕14 w端時,便停止毛細管14 的上升,並由引線夾且1 R妯杜4 欠人/、16挾持者引線並停止送出引線。 此日才,藉由毛細管1 4 k伞古 向的移動,弓1線便將第 1變形部分78與第2蠻形都八7C A 1 乂邛刀76作為變形點而確實的變 形。如此,在形成引線弧之 、 ^又丨不方;弟2打線點處的上升 ,便形成第i變形部分78與第 、乐z夂〜邛刀⑺之間的直線 上升部分,俾可防止引線下垂。 第2⑴圖的步驟係將引線連接於第2打線點而 在第⑽圖中將第1變形部分Μ對位於毛細管14 :纟此狀悲下’使毛細f 14經圓弧運動或圓弧 運:後的下降’而移動至打線對象19的第2打線點2卜 此時引線12的第1變形部分78係位於篦9 4 & 刀,0你徂於弟2打線點21,鋏 後進行打線。 如此,在引線上預先形成第2打線點之第】變形部分 的位置’然後將引線收入既定量而形成第"丁線點之引線 t升部分頂點的第2變形部分,藉此第!變形部分、第2 變形部分可在既定位置處確實的變形。因&,可防止引線 弧在第2打線點附近下垂而接觸到打線對象的現象,且: 穩定地形成引線弧形狀。 —另外,亦可按照引線弧長度、打線對象高度等,而在 第1 ^形部分、第2變形部分以外的地方進行適當的變形。 乐3圖所示係採用實施形態之打線裝置,對打線對象 實施打線的例子。帛3(a)圖係設置有第】打線點2。的打 17 1264100 線對象18為電路基板,而設置有第2打線點2丨的打線對 象1 9為LSI晶片(DIE)的例子。此情況下,因為在第2打 線點21附近,引線弧8 0將不致產生下垂現象,因此可防 止LSI晶片與引線弧產生接觸的情形。此外,因為可依較 低線弧高度穩定地形成引線弧形狀,因此可形成更小型、 更薄型的封裝體。 第3 (b)圖係設置著第i打線點2〇的打線對象土 8為電 路基板,而設置著第2打線點21的打線對象19為所謂「 堆疊式晶片」的雙層LSI晶片中,上層側的LSI晶片(ME) 例2。此情況下,第2打線點21處的引線弧下垂現象,雖 幸乂第3 (a)圖之情況,比較可能形成較大的問題。但是,在 本::的實施形態中’因為於第2打線點21附近二弧 見:不致下垂’因此可防止發生⑶晶片與引線弧的接觸 見象H因為能以較低引線弧高度穩定 :狀,因此可提高集積度且可形成更小型、更薄 (發明之效果) 止引:本發明的打線方法、打線裝置、及打線程式,可防 線壯罢 】打線對象。又’依本發明的打線方法、打 、、展衣置、及打線鞋斗、 打 、、' 式’可穩定地形成引線弧形狀。 圖式簡單說 ) 圖式部分 苐1圖係本發明夕每 之貝知形態的打線裝置方塊圖 ]8 1264100 第2(a)〜(Ί)圖係本發明之實施形態的引線弧形成控制 之示意圖。 第3(a)〜(b)圖係本發明之實施形態中,採用打線裝置 對打線對象實施打線的圖例。 第4(a)〜(g)圖係習知技術的引線弧形成方法之步驟圖 〇 第5 (a)〜(g)圖係另一習知技術的引線弧形成方法之步 驟圖。 (二)元件代表符號 11 捲線轴 12 引線 13 毛細管部 14 毛細管 16 引線夾具 17 載物台 1 8、1 9 打線對象 20 第1打線點 21 第2打線點 22、24、26、28、36、38 變形部分 30、40、80 引線弧 50 打線裝置 52 毛細管移動機構 54 載物台移動機構 56 控制裝置 19 1264100 60 頸部形成處理部 62 第 1變形處理部 64 第 2變形處理部 66 弧狀形成處理部 76 第 2變形部分 78 第 1變形部分 20

Claims (1)

1264100 拾、申請專利範圍·· h種打線方法,係使插通並保持引線的毛細管,對 打線對象進行相對移動而使引線變形,並將第!打線點與 “二線點以引線弧連接,其特徵係具備以下步驟 咏、成y驟,在將引線連接於第1打線點之後,於 弟1打線點使引線上升而形成頸部; 弟1變形步驟,—、息、",^ , ^ ¥ 一邊廷出相當於從該引線弧總長扣除 ^ 里的引線,一邊使該毛細管從該頸部上 升,接者使該毛細營朝楚 ne朝弟2打線點方向移動,而形成位於 弟Z打線點之引線第1變形部分; 弟2變形步驟,伸号车 总 使〜毛、、、田s下降,並將相當於在第2 打線點處上升部分之具 ^之長度的引線,收入該毛細管中,接著 使6亥毛細管朝愈兮楚9 4 μ ,, 〃、w弟2打線點相反側的方向移動,而在第 2打線點的引線斗^ Μ八 升邛刀頂點處形成第2變形部分;以及 引線弧形成步驟,佶哕革 哕第〗… 毛細官上升,並送出引線直到 柱心 J達違毛細官別端位置,且在此狀態下保 持引線’使該毛細管移動 ’ 吕:f夕勒主4弟2打線點,俾在| 第1變形部分連接第2打t 4的5亥 乐Z打線,,沾,而形成引線弧。 2· 一種打線裝置,係具備: 毛細管,係插通並保持引線; 載物台,係保持打線對象; 以及私動機構,係使該毛細管對該載物台進行相對移動; 引線弧形成控制機構,係控制該毛細管的相對移動與 21 1264100 6亥引線的保持,在 點間形成引線弧並加以=象的第1打線點與第2打線 該引線弧形成控制機構係執行以下步驟· 頸部形成處理步驟,在 ’於第1打線點處將引線… ¥ 1打線點之後 — 处肘線上升而形成頸部; 第1變形處理步驟,—邊送出相 扣除該頸部後之异声,.、日 田、<引線弧虼長 部上升,接:::Γ…引線,一邊使該毛細管從該頸 位二Γ 管㈣2打線點方向移動,而形成 於乐2打線點之引線第1變形部分; 第2變形處理步驟 Μ ? i-Γ ^ ^ 使口亥毛、、、田g下降,並將相當於在 弟2打線點處上升部分 Ά ^ ^ S 、又、、、泉,收入該毛細管中, 按者使该毛細管朝i袁雜# & 吕朝遂離4弟2打線點方向移動, 打線點的引線上升邱八τ¥ Μ + 在弟2 1上升σ卩刀頂點處形成第2變形部分;以及 引線弧形成處理步驟 t ξ»Ι ^ ^ 1 ^ 、、' g上升,並送出引線 直到该弟1變形部分到if兮主“其I 下伴…… 則端位置’且在此狀態 下保持引線,使該毛細管移動至該 的該第1變形部分連接第2 τ、、、點,俾在引線 刀連接弟2打線點,而形成引線弧。 3· 一種記錄打線程式之記錄媒體,該打線程式係巧制 打線裝置的動作;該打線裝 /σ α ^ 1角.七細$ ,係插通並 保持引線;載物台,係保持打線對象;移動機 毛細管對該載物台進行相對移動;以及引線弧形成控制; 構’係控制該毛細管的相對移動與該引線的保持,且在該 打線對象的弟1打線點與第2打線點間形成引線弧並加以 連接; 22 1264100 該弓丨線狐形成控制機構係執 頌部形成處理步驟, …· ,於第1打線% # @ , 、'、乳連接於第1打線點之後 =處將引線上升而形成頸部; 又形處理步驟,—、套、、, 、, 扣除該頸部徭夕且 ^ 相當於從該引線弧總長 長度份量的引始 部上升,接著使 j、[-邊使該毛細管從該頸 百1文毛細官朝第2打 位於第2打線點之引 了 I占方向私動’而形成 ^ Ή線弟1變形部分; 第2變形處理步驟 第2打線點處上升1八 〆、、田吕下降’並將相當於在 接著#兮立 升⑷刀之長度的引線,收入該毛細管中, 妾者使4毛細管朝遠離該第 打線點的引線上升部八… I、占方向私動,而在第2 σ頁點處形成第2變形部分;以及 引線弧形成處理步驟,使該 、,, 直到該第1變形部分 V、、",亚运出引線 下保持引線,使該二=毛細管前端位置,且在此狀態 毛g移動至該第2打線點,俾在引線 的该第1變形部分連接裳 千社深 刀運接弟2打線點,而形成引線弧。 拾壹、圖式·· 如次頁。 23
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JP2883463B2 (ja) 1991-04-17 1999-04-19 株式会社東芝 ワイヤボンディング装置
JP3333413B2 (ja) * 1996-12-27 2002-10-15 株式会社新川 ワイヤボンディング方法
JP3189115B2 (ja) * 1996-12-27 2001-07-16 株式会社新川 半導体装置及びワイヤボンディング方法
JP3455092B2 (ja) * 1997-10-27 2003-10-06 株式会社新川 半導体装置及びワイヤボンディング方法
JP3377747B2 (ja) * 1998-06-23 2003-02-17 株式会社新川 ワイヤボンディング方法
US6176416B1 (en) * 1999-07-02 2001-01-23 Advanced Semiconductor Engineering, Inc. Method of making low-profile wire connection
US6391759B1 (en) * 2000-04-27 2002-05-21 Advanced Semiconductor Engineering, Inc. Bonding method which prevents wire sweep and the wire structure thereof
JP2002280414A (ja) * 2001-03-22 2002-09-27 Mitsubishi Electric Corp 半導体装置およびその製造方法

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TW200403826A (en) 2004-03-01
US20040041008A1 (en) 2004-03-04
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JP3685779B2 (ja) 2005-08-24
JP2004087747A (ja) 2004-03-18
US7014095B2 (en) 2006-03-21

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