KR20030086894A - 리드 프레임 조립체 - Google Patents

리드 프레임 조립체 Download PDF

Info

Publication number
KR20030086894A
KR20030086894A KR10-2003-0023792A KR20030023792A KR20030086894A KR 20030086894 A KR20030086894 A KR 20030086894A KR 20030023792 A KR20030023792 A KR 20030023792A KR 20030086894 A KR20030086894 A KR 20030086894A
Authority
KR
South Korea
Prior art keywords
lead frame
biasing member
protrusion
frame
component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
KR10-2003-0023792A
Other languages
English (en)
Korean (ko)
Inventor
로버트제이. 쿡
로날드엠. 스미스
스티븐알. 벤슨
Original Assignee
일리노이즈 툴 워크스 인코포레이티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 일리노이즈 툴 워크스 인코포레이티드 filed Critical 일리노이즈 툴 워크스 인코포레이티드
Publication of KR20030086894A publication Critical patent/KR20030086894A/ko
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/20—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for assembling or disassembling contact members with insulating base, case or sleeve
    • H01R43/24—Assembling by moulding on contact members
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/66—Structural association with built-in electrical component
    • H01R13/719—Structural association with built-in electrical component specially adapted for high frequency, e.g. with filters
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/16—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for manufacturing contact members, e.g. by punching and by bending

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Coils Or Transformers For Communication (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Control Of Motors That Do Not Use Commutators (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Details Of Connecting Devices For Male And Female Coupling (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
KR10-2003-0023792A 2002-05-03 2003-04-15 리드 프레임 조립체 Withdrawn KR20030086894A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/139,007 US6657287B2 (en) 2002-05-03 2002-05-03 Leadframe assembly
US10/139,007 2002-05-03

Publications (1)

Publication Number Publication Date
KR20030086894A true KR20030086894A (ko) 2003-11-12

Family

ID=29215725

Family Applications (1)

Application Number Title Priority Date Filing Date
KR10-2003-0023792A Withdrawn KR20030086894A (ko) 2002-05-03 2003-04-15 리드 프레임 조립체

Country Status (7)

Country Link
US (1) US6657287B2 (https=)
EP (1) EP1359644A3 (https=)
JP (1) JP4430328B2 (https=)
KR (1) KR20030086894A (https=)
BR (1) BR0301022A (https=)
CA (1) CA2422609A1 (https=)
MX (1) MXPA03003998A (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7162388B2 (en) * 2004-06-17 2007-01-09 Fci Americas Technology, Inc. Vehicle air bag electrical system
US7808074B2 (en) * 2005-07-08 2010-10-05 Infineon Technologies Ag Advanced leadframe having predefined bases for attaching passive components
DE102006028815B3 (de) 2006-06-21 2007-08-30 Hansa Tronic Gmbh Verfahren zur Herstellung eines elektrischen Hybridbauteils
DE602007004950D1 (de) * 2007-04-27 2010-04-08 Tyco Electronics Nederland Bv Herstellungsverfahren eines elektrischen Verbinders

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4376922A (en) * 1980-10-23 1983-03-15 Itt Filter connector
US4699445A (en) * 1986-07-28 1987-10-13 Amp Incorporated Electrical terminal assembly for thermistors
US5541376A (en) * 1994-03-28 1996-07-30 Valleylab Inc Switch and connector
US5954842A (en) * 1996-01-26 1999-09-21 Micron Technology, Inc. Lead finger clamp assembly
AU3965599A (en) * 1998-04-20 1999-11-08 Pulse Engineering, Inc. Simplified microelectronic connector and method of manufacturing

Also Published As

Publication number Publication date
US20030205788A1 (en) 2003-11-06
BR0301022A (pt) 2004-08-17
JP2003332498A (ja) 2003-11-21
EP1359644A3 (en) 2004-08-18
CA2422609A1 (en) 2003-11-03
EP1359644A2 (en) 2003-11-05
US6657287B2 (en) 2003-12-02
MXPA03003998A (es) 2004-10-15
JP4430328B2 (ja) 2010-03-10

Similar Documents

Publication Publication Date Title
AU2014386957B2 (en) Metal ear tag with overmoulded cover for transponder housing, and method of assembling the same
JP4826037B2 (ja) 電子タグの製造方法。
JP5286374B2 (ja) モールドコイルおよびモールドコイルを用いた電磁弁
JPH08112824A (ja) 電気的構成要素を関連したプラスチック製ハウジング内に成形して一体的な完成部品を形成する方法
WO2001033950A1 (en) Ear tag
KR20030086894A (ko) 리드 프레임 조립체
KR102005605B1 (ko) 차량 부품 지지체 및 그 제조 방법
US10111324B2 (en) Electrical component
KR20150012259A (ko) 반도체 칩을 수용하는 스마트 카드 바디 및 그 제조 방법
JP2001085120A (ja) コネクタ
JP2005513463A (ja) センサ、複数のセンサ及びセンサを製造するための方法
KR101948101B1 (ko) 전자 제어 장치
JPH09115370A (ja) グロメット
US11611176B2 (en) Structure for preventing connector from being detached from electronic components in vehicles
KR100680124B1 (ko) 조립식 플러그의 내부 프레임 구조체
US6830481B1 (en) Fuse connection box and method for producing the same
JP2003198159A (ja) 車両用制御ユニットの組立方法
MX2007014008A (es) Componente electronico y metodo para fijarlo.
KR101552177B1 (ko) 차량용 lf 안테나
JPH07282912A (ja) 端子列体およびその製造方法
US20170234939A1 (en) Magnetic field sensor, module with a magnetic field sensor and method to manufacture a module with a magnetic field sensor
JP2008215291A (ja) 圧縮機の電装品カバー固定装置
KR100698694B1 (ko) 에어백 모듈의 커버 마운팅 구조
JPH1026115A (ja) 配線用止め具
JP3274636B2 (ja) レセプタクルコネクタ

Legal Events

Date Code Title Description
PA0109 Patent application

St.27 status event code: A-0-1-A10-A12-nap-PA0109

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

R18-X000 Changes to party contact information recorded

St.27 status event code: A-3-3-R10-R18-oth-X000

PC1203 Withdrawal of no request for examination

St.27 status event code: N-1-6-B10-B12-nap-PC1203

WITN Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid
R18-X000 Changes to party contact information recorded

St.27 status event code: A-3-3-R10-R18-oth-X000

P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000