KR20030051197A - 포지티브 레지스트 조성물 - Google Patents
포지티브 레지스트 조성물 Download PDFInfo
- Publication number
- KR20030051197A KR20030051197A KR1020020058670A KR20020058670A KR20030051197A KR 20030051197 A KR20030051197 A KR 20030051197A KR 1020020058670 A KR1020020058670 A KR 1020020058670A KR 20020058670 A KR20020058670 A KR 20020058670A KR 20030051197 A KR20030051197 A KR 20030051197A
- Authority
- KR
- South Korea
- Prior art keywords
- group
- general formula
- repeating unit
- alicyclic hydrocarbon
- resist composition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
- G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
- G03F7/0397—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition the macromolecular compound having an alicyclic moiety in a side chain
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0046—Photosensitive materials with perfluoro compounds, e.g. for dry lithography
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/075—Silicon-containing compounds
- G03F7/0757—Macromolecular compounds containing Si-O, Si-C or Si-N bonds
- G03F7/0758—Macromolecular compounds containing Si-O, Si-C or Si-N bonds with silicon- containing groups in the side chains
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/30—Imagewise removal using liquid means
Landscapes
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- General Physics & Mathematics (AREA)
- Materials For Photolithography (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JPJP-P-2001-00300944 | 2001-09-28 | ||
| JP2001300944A JP4149153B2 (ja) | 2001-09-28 | 2001-09-28 | ポジ型レジスト組成物 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20030051197A true KR20030051197A (ko) | 2003-06-25 |
Family
ID=19121434
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020020058670A Ceased KR20030051197A (ko) | 2001-09-28 | 2002-09-27 | 포지티브 레지스트 조성물 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP4149153B2 (enExample) |
| KR (1) | KR20030051197A (enExample) |
| TW (1) | TWI261147B (enExample) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100613851B1 (ko) * | 2004-06-03 | 2006-08-18 | 윤미숙 | 네트워크 기반의 근막마사지를 이용한 성형 서비스 시스템및 그 방법 |
| KR100904068B1 (ko) * | 2007-09-04 | 2009-06-23 | 제일모직주식회사 | 컬러필터용 감광성 수지 조성물 및 이를 이용한 컬러필터 |
Families Citing this family (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3890989B2 (ja) | 2002-01-25 | 2007-03-07 | 住友化学株式会社 | レジスト組成物 |
| CN1603957A (zh) * | 2003-10-03 | 2005-04-06 | 住友化学工业株式会社 | 化学放大型正光刻胶组合物及其树脂 |
| JP2005234015A (ja) * | 2004-02-17 | 2005-09-02 | Fuji Photo Film Co Ltd | 液浸露光用ポジ型レジスト組成物及びそれを用いたパターン形成方法 |
| JP4622579B2 (ja) * | 2004-04-23 | 2011-02-02 | 住友化学株式会社 | 化学増幅型ポジ型レジスト組成物及び(メタ)アクリル酸誘導体とその製法 |
| EP2046714B1 (en) | 2006-06-20 | 2015-12-09 | Allergan, Inc. | Cyclopentane derivatives as antiglaucoma agents |
| CA2657625C (en) * | 2006-07-10 | 2016-06-21 | Allergan, Inc. | Therapeutic compounds |
| JP5205027B2 (ja) * | 2007-07-18 | 2013-06-05 | 東京応化工業株式会社 | 化合物の製造方法 |
| JP5806800B2 (ja) | 2008-03-28 | 2015-11-10 | 富士フイルム株式会社 | ポジ型レジスト組成物およびそれを用いたパターン形成方法 |
| JP5862657B2 (ja) * | 2011-03-31 | 2016-02-16 | Jsr株式会社 | フォトレジスト組成物 |
| JP5967082B2 (ja) * | 2011-05-19 | 2016-08-10 | Jsr株式会社 | フォトレジスト組成物 |
| JP5954332B2 (ja) * | 2011-09-29 | 2016-07-20 | Jsr株式会社 | フォトレジスト組成物及びレジストパターン形成方法 |
| JP6007913B2 (ja) * | 2011-09-30 | 2016-10-19 | Jsr株式会社 | フォトレジスト組成物及びレジストパターン形成方法 |
| JP5783111B2 (ja) * | 2012-03-29 | 2015-09-24 | Jsr株式会社 | フォトレジスト組成物及びレジストパターン形成方法 |
| JP6019677B2 (ja) * | 2012-04-02 | 2016-11-02 | Jsr株式会社 | フォトレジスト組成物及びレジストパターン形成方法 |
| KR20140055050A (ko) * | 2012-10-30 | 2014-05-09 | 제일모직주식회사 | 레지스트 하층막용 조성물 및 상기 레지스트 하층막용 조성물을 사용한 패턴 형성 방법 |
| JP6131793B2 (ja) * | 2013-09-09 | 2017-05-24 | Jsr株式会社 | 感放射線性樹脂組成物、レジストパターン形成方法、重合体及び化合物 |
| JP6571177B2 (ja) * | 2015-05-14 | 2019-09-04 | 富士フイルム株式会社 | パターン形成方法、電子デバイスの製造方法、及び、感活性光線性又は感放射線性樹脂組成物 |
| JP7101773B2 (ja) * | 2018-06-28 | 2022-07-15 | 富士フイルム株式会社 | 感活性光線性又は感放射線性樹脂組成物、パターン形成方法、電子デバイスの製造方法、樹脂 |
| US12282254B2 (en) | 2021-09-30 | 2025-04-22 | Dupont Electronic Materials International, Llc | Photoresist compositions and pattern formation methods |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10239846A (ja) * | 1997-02-27 | 1998-09-11 | Fuji Photo Film Co Ltd | ポジ型フォトレジスト組成物 |
| JPH10274852A (ja) * | 1997-01-29 | 1998-10-13 | Sumitomo Chem Co Ltd | 化学増幅型ポジ型レジスト組成物 |
| JP2000347408A (ja) * | 1999-06-04 | 2000-12-15 | Fuji Photo Film Co Ltd | 遠紫外線露光用ポジ型フォトレジスト組成物 |
-
2001
- 2001-09-28 JP JP2001300944A patent/JP4149153B2/ja not_active Expired - Fee Related
-
2002
- 2002-07-23 TW TW091116333A patent/TWI261147B/zh not_active IP Right Cessation
- 2002-09-27 KR KR1020020058670A patent/KR20030051197A/ko not_active Ceased
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10274852A (ja) * | 1997-01-29 | 1998-10-13 | Sumitomo Chem Co Ltd | 化学増幅型ポジ型レジスト組成物 |
| JPH10239846A (ja) * | 1997-02-27 | 1998-09-11 | Fuji Photo Film Co Ltd | ポジ型フォトレジスト組成物 |
| JP2000347408A (ja) * | 1999-06-04 | 2000-12-15 | Fuji Photo Film Co Ltd | 遠紫外線露光用ポジ型フォトレジスト組成物 |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100613851B1 (ko) * | 2004-06-03 | 2006-08-18 | 윤미숙 | 네트워크 기반의 근막마사지를 이용한 성형 서비스 시스템및 그 방법 |
| KR100904068B1 (ko) * | 2007-09-04 | 2009-06-23 | 제일모직주식회사 | 컬러필터용 감광성 수지 조성물 및 이를 이용한 컬러필터 |
| US8263675B2 (en) | 2007-09-04 | 2012-09-11 | Cheil Industries Inc. | Photosensitive resin composition for color filter and color filter made using the same |
Also Published As
| Publication number | Publication date |
|---|---|
| JP4149153B2 (ja) | 2008-09-10 |
| TWI261147B (en) | 2006-09-01 |
| JP2003107709A (ja) | 2003-04-09 |
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Legal Events
| Date | Code | Title | Description |
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| PA0109 | Patent application |
St.27 status event code: A-0-1-A10-A12-nap-PA0109 |
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| PG1501 | Laying open of application |
St.27 status event code: A-1-1-Q10-Q12-nap-PG1501 |
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| R18-X000 | Changes to party contact information recorded |
St.27 status event code: A-3-3-R10-R18-oth-X000 |
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| N231 | Notification of change of applicant | ||
| PN2301 | Change of applicant |
St.27 status event code: A-3-3-R10-R13-asn-PN2301 St.27 status event code: A-3-3-R10-R11-asn-PN2301 |
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| P11-X000 | Amendment of application requested |
St.27 status event code: A-2-2-P10-P11-nap-X000 |
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| P13-X000 | Application amended |
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| P11-X000 | Amendment of application requested |
St.27 status event code: A-2-2-P10-P11-nap-X000 |
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| PN2301 | Change of applicant |
St.27 status event code: A-3-3-R10-R13-asn-PN2301 St.27 status event code: A-3-3-R10-R11-asn-PN2301 |
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