KR20030022291A - 고분자 망상구조를 지닌 저유전율 물질 - Google Patents
고분자 망상구조를 지닌 저유전율 물질 Download PDFInfo
- Publication number
- KR20030022291A KR20030022291A KR10-2003-7000741A KR20037000741A KR20030022291A KR 20030022291 A KR20030022291 A KR 20030022291A KR 20037000741 A KR20037000741 A KR 20037000741A KR 20030022291 A KR20030022291 A KR 20030022291A
- Authority
- KR
- South Korea
- Prior art keywords
- dielectric constant
- low dielectric
- constant material
- component
- poly
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
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- 239000000463 material Substances 0.000 title claims abstract description 45
- 229920000642 polymer Polymers 0.000 claims abstract description 38
- 238000006243 chemical reaction Methods 0.000 claims abstract description 18
- ORILYTVJVMAKLC-UHFFFAOYSA-N adamantane Chemical compound C1C(C2)CC3CC1CC2C3 ORILYTVJVMAKLC-UHFFFAOYSA-N 0.000 claims description 22
- 238000000034 method Methods 0.000 claims description 20
- 238000004132 cross linking Methods 0.000 claims description 15
- 125000003118 aryl group Chemical group 0.000 claims description 12
- 125000000732 arylene group Chemical group 0.000 claims description 12
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims description 12
- -1 poly (arylene ether Chemical compound 0.000 claims description 12
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 11
- XMWRBQBLMFGWIX-UHFFFAOYSA-N C60 fullerene Chemical compound C12=C3C(C4=C56)=C7C8=C5C5=C9C%10=C6C6=C4C1=C1C4=C6C6=C%10C%10=C9C9=C%11C5=C8C5=C8C7=C3C3=C7C2=C1C1=C2C4=C6C4=C%10C6=C9C9=C%11C5=C5C8=C3C3=C7C1=C1C2=C4C6=C2C9=C5C3=C12 XMWRBQBLMFGWIX-UHFFFAOYSA-N 0.000 claims description 8
- 150000001875 compounds Chemical class 0.000 claims description 8
- 229910003472 fullerene Inorganic materials 0.000 claims description 8
- 125000000524 functional group Chemical group 0.000 claims description 6
- 229920000412 polyarylene Polymers 0.000 claims description 6
- 239000000126 substance Substances 0.000 claims description 6
- 238000010438 heat treatment Methods 0.000 claims description 5
- 238000006352 cycloaddition reaction Methods 0.000 claims description 4
- ZICQBHNGXDOVJF-UHFFFAOYSA-N diamantane Chemical compound C1C2C3CC(C4)CC2C2C4C3CC1C2 ZICQBHNGXDOVJF-UHFFFAOYSA-N 0.000 claims description 4
- 125000002534 ethynyl group Chemical group [H]C#C* 0.000 claims description 4
- 230000009477 glass transition Effects 0.000 claims description 4
- 238000007725 thermal activation Methods 0.000 claims description 4
- ZISJRLFUNCQBBU-UHFFFAOYSA-N 1-phenyl-4-(2-phenylethynyl)benzene Chemical group C1=CC=CC=C1C#CC1=CC=C(C=2C=CC=CC=2)C=C1 ZISJRLFUNCQBBU-UHFFFAOYSA-N 0.000 claims description 3
- 239000004952 Polyamide Substances 0.000 claims description 3
- 239000004642 Polyimide Substances 0.000 claims description 3
- 229920002647 polyamide Polymers 0.000 claims description 3
- 229920001721 polyimide Polymers 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 3
- 239000000178 monomer Substances 0.000 description 20
- 239000000203 mixture Substances 0.000 description 13
- 239000011148 porous material Substances 0.000 description 11
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 9
- 239000003431 cross linking reagent Substances 0.000 description 9
- 230000015572 biosynthetic process Effects 0.000 description 7
- QXJJQWWVWRCVQT-UHFFFAOYSA-K calcium;sodium;phosphate Chemical compound [Na+].[Ca+2].[O-]P([O-])([O-])=O QXJJQWWVWRCVQT-UHFFFAOYSA-K 0.000 description 7
- 229920001577 copolymer Polymers 0.000 description 7
- NFHFRUOZVGFOOS-UHFFFAOYSA-N palladium;triphenylphosphane Chemical group [Pd].C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 NFHFRUOZVGFOOS-UHFFFAOYSA-N 0.000 description 7
- 239000002904 solvent Substances 0.000 description 7
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 6
- RDOXTESZEPMUJZ-UHFFFAOYSA-N anisole Chemical compound COC1=CC=CC=C1 RDOXTESZEPMUJZ-UHFFFAOYSA-N 0.000 description 5
- 229920001400 block copolymer Polymers 0.000 description 5
- 229920006037 cross link polymer Polymers 0.000 description 5
- 238000006116 polymerization reaction Methods 0.000 description 5
- 238000003786 synthesis reaction Methods 0.000 description 5
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 description 4
- QARVLSVVCXYDNA-UHFFFAOYSA-N bromobenzene Chemical compound BrC1=CC=CC=C1 QARVLSVVCXYDNA-UHFFFAOYSA-N 0.000 description 4
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 4
- 239000007783 nanoporous material Substances 0.000 description 4
- IXCOKTMGCRJMDR-UHFFFAOYSA-N 9h-fluorene;phenol Chemical compound OC1=CC=CC=C1.OC1=CC=CC=C1.C1=CC=C2CC3=CC=CC=C3C2=C1 IXCOKTMGCRJMDR-UHFFFAOYSA-N 0.000 description 3
- 230000008859 change Effects 0.000 description 3
- 239000003989 dielectric material Substances 0.000 description 3
- 239000002105 nanoparticle Substances 0.000 description 3
- 230000001737 promoting effect Effects 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 125000004800 4-bromophenyl group Chemical group [H]C1=C([H])C(*)=C([H])C([H])=C1Br 0.000 description 2
- UEXCJVNBTNXOEH-UHFFFAOYSA-N Ethynylbenzene Chemical group C#CC1=CC=CC=C1 UEXCJVNBTNXOEH-UHFFFAOYSA-N 0.000 description 2
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 239000012190 activator Substances 0.000 description 2
- JRXXLCKWQFKACW-UHFFFAOYSA-N biphenylacetylene Chemical group C1=CC=CC=C1C#CC1=CC=CC=C1 JRXXLCKWQFKACW-UHFFFAOYSA-N 0.000 description 2
- 239000000969 carrier Substances 0.000 description 2
- 239000012876 carrier material Substances 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 239000003623 enhancer Substances 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 230000007246 mechanism Effects 0.000 description 2
- UZKWTJUDCOPSNM-UHFFFAOYSA-N methoxybenzene Substances CCCCOC=C UZKWTJUDCOPSNM-UHFFFAOYSA-N 0.000 description 2
- 230000000269 nucleophilic effect Effects 0.000 description 2
- 229920000620 organic polymer Polymers 0.000 description 2
- 229920002959 polymer blend Polymers 0.000 description 2
- BWHMMNNQKKPAPP-UHFFFAOYSA-L potassium carbonate Chemical compound [K+].[K+].[O-]C([O-])=O BWHMMNNQKKPAPP-UHFFFAOYSA-L 0.000 description 2
- 230000009257 reactivity Effects 0.000 description 2
- 229910000077 silane Inorganic materials 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 239000003381 stabilizer Substances 0.000 description 2
- HXJUTPCZVOIRIF-UHFFFAOYSA-N sulfolane Chemical compound O=S1(=O)CCCC1 HXJUTPCZVOIRIF-UHFFFAOYSA-N 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- QIUQHTVENGSBOO-UHFFFAOYSA-N (4-fluorophenyl)-[3-[2-(4-fluorophenyl)ethynyl]phenyl]methanone Chemical compound C1=CC(F)=CC=C1C#CC1=CC=CC(C(=O)C=2C=CC(F)=CC=2)=C1 QIUQHTVENGSBOO-UHFFFAOYSA-N 0.000 description 1
- OGTSHGYHILFRHD-UHFFFAOYSA-N (4-fluorophenyl)-phenylmethanone Chemical compound C1=CC(F)=CC=C1C(=O)C1=CC=CC=C1 OGTSHGYHILFRHD-UHFFFAOYSA-N 0.000 description 1
- FWMRWIMEUYMFOX-UHFFFAOYSA-N 1,3,5,7-tetrakis[2-(2-phenylethynyl)phenyl]adamantane Chemical compound C1C(C2)(C=3C(=CC=CC=3)C#CC=3C=CC=CC=3)CC(C3)(C=4C(=CC=CC=4)C#CC=4C=CC=CC=4)CC1(C=1C(=CC=CC=1)C#CC=1C=CC=CC=1)CC23C1=CC=CC=C1C#CC1=CC=CC=C1 FWMRWIMEUYMFOX-UHFFFAOYSA-N 0.000 description 1
- 125000004860 4-ethylphenyl group Chemical group [H]C1=C([H])C(=C([H])C([H])=C1*)C([H])([H])C([H])([H])[H] 0.000 description 1
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical compound [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 description 1
- 239000004971 Cross linker Substances 0.000 description 1
- 238000005033 Fourier transform infrared spectroscopy Methods 0.000 description 1
- JPYHHZQJCSQRJY-UHFFFAOYSA-N Phloroglucinol Natural products CCC=CCC=CCC=CCC=CCCCCC(=O)C1=C(O)C=C(O)C=C1O JPYHHZQJCSQRJY-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 238000001994 activation Methods 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- 150000001266 acyl halides Chemical class 0.000 description 1
- 238000007259 addition reaction Methods 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
- 238000007080 aromatic substitution reaction Methods 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 1
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 description 1
- 229910052794 bromium Inorganic materials 0.000 description 1
- 239000006227 byproduct Substances 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 125000004122 cyclic group Chemical group 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 150000001993 dienes Chemical class 0.000 description 1
- 238000011143 downstream manufacturing Methods 0.000 description 1
- 150000002170 ethers Chemical class 0.000 description 1
- 230000007717 exclusion Effects 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 150000004820 halides Chemical class 0.000 description 1
- 239000003999 initiator Substances 0.000 description 1
- 229920002521 macromolecule Polymers 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 125000002524 organometallic group Chemical group 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- QCDYQQDYXPDABM-UHFFFAOYSA-N phloroglucinol Chemical compound OC1=CC(O)=CC(O)=C1 QCDYQQDYXPDABM-UHFFFAOYSA-N 0.000 description 1
- 229960001553 phloroglucinol Drugs 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 239000000906 photoactive agent Substances 0.000 description 1
- 229920000090 poly(aryl ether) Polymers 0.000 description 1
- 229920000548 poly(silane) polymer Polymers 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229910000027 potassium carbonate Inorganic materials 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 238000000197 pyrolysis Methods 0.000 description 1
- 238000010526 radical polymerization reaction Methods 0.000 description 1
- 150000003254 radicals Chemical class 0.000 description 1
- 238000010992 reflux Methods 0.000 description 1
- 239000013557 residual solvent Substances 0.000 description 1
- 229920003252 rigid-rod polymer Polymers 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 230000002194 synthesizing effect Effects 0.000 description 1
- MLDBDNOEQLMDFK-UHFFFAOYSA-N tetrakis[2-(2-phenylethynyl)phenyl]silane Chemical compound C1=CC=CC=C1C#CC1=CC=CC=C1[Si](C=1C(=CC=CC=1)C#CC=1C=CC=CC=1)(C=1C(=CC=CC=1)C#CC=1C=CC=CC=1)C1=CC=CC=C1C#CC1=CC=CC=C1 MLDBDNOEQLMDFK-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G83/00—Macromolecular compounds not provided for in groups C08G2/00 - C08G81/00
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G69/00—Macromolecular compounds obtained by reactions forming a carboxylic amide link in the main chain of the macromolecule
- C08G69/48—Polymers modified by chemical after-treatment
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G61/00—Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
- C08G61/02—Macromolecular compounds containing only carbon atoms in the main chain of the macromolecule, e.g. polyxylylenes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G61/00—Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
- C08G61/12—Macromolecular compounds containing atoms other than carbon in the main chain of the macromolecule
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
- C08G65/34—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from hydroxy compounds or their metallic derivatives
- C08G65/38—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from hydroxy compounds or their metallic derivatives derived from phenols
- C08G65/40—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from hydroxy compounds or their metallic derivatives derived from phenols from phenols (I) and other compounds (II), e.g. OH-Ar-OH + X-Ar-X, where X is halogen atom, i.e. leaving group
- C08G65/4012—Other compound (II) containing a ketone group, e.g. X-Ar-C(=O)-Ar-X for polyetherketones
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G2650/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
- C08G2650/02—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule characterized by the type of post-polymerisation functionalisation
- C08G2650/20—Cross-linking
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G2650/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
- C08G2650/28—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule characterised by the polymer type
- C08G2650/60—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule characterised by the polymer type containing acetylenic group
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2312/00—Crosslinking
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Formation Of Insulating Films (AREA)
- Other Resins Obtained By Reactions Not Involving Carbon-To-Carbon Unsaturated Bonds (AREA)
- Polyethers (AREA)
- Organic Insulating Materials (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US09/619,237 | 2000-07-19 | ||
| US09/619,237 US6423811B1 (en) | 2000-07-19 | 2000-07-19 | Low dielectric constant materials with polymeric networks |
| PCT/US2001/022213 WO2002006366A1 (en) | 2000-07-19 | 2001-07-12 | Low dielectric constant materials with polymeric networks |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20030022291A true KR20030022291A (ko) | 2003-03-15 |
Family
ID=24481046
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR10-2003-7000741A Withdrawn KR20030022291A (ko) | 2000-07-19 | 2001-07-12 | 고분자 망상구조를 지닌 저유전율 물질 |
Country Status (8)
| Country | Link |
|---|---|
| US (2) | US6423811B1 (enExample) |
| EP (1) | EP1303550A4 (enExample) |
| JP (1) | JP2004504424A (enExample) |
| KR (1) | KR20030022291A (enExample) |
| CN (1) | CN1455789A (enExample) |
| AU (1) | AU2001273464A1 (enExample) |
| TW (1) | TW553967B (enExample) |
| WO (1) | WO2002006366A1 (enExample) |
Families Citing this family (36)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20020022708A1 (en) * | 2000-07-19 | 2002-02-21 | Honeywell International Inc. | Compositions and methods for thermosetting molecules in organic compositions |
| US6423811B1 (en) * | 2000-07-19 | 2002-07-23 | Honeywell International Inc. | Low dielectric constant materials with polymeric networks |
| US6783589B2 (en) * | 2001-01-19 | 2004-08-31 | Chevron U.S.A. Inc. | Diamondoid-containing materials in microelectronics |
| US7141188B2 (en) * | 2001-05-30 | 2006-11-28 | Honeywell International Inc. | Organic compositions |
| US6740685B2 (en) * | 2001-05-30 | 2004-05-25 | Honeywell International Inc. | Organic compositions |
| CA2443846A1 (en) * | 2001-12-31 | 2003-07-17 | Honeywell International Inc. | Organic compositions |
| US20030143332A1 (en) * | 2002-01-31 | 2003-07-31 | Sumitomo Chemical Company, Limited | Coating solution for forming insulating film |
| JP2003268101A (ja) | 2002-03-15 | 2003-09-25 | Sumitomo Chem Co Ltd | ポリエーテル樹脂及びその製造方法 |
| US7060204B2 (en) * | 2002-04-29 | 2006-06-13 | Honeywell International Inc. | Organic compositions |
| TW200416131A (en) * | 2002-06-03 | 2004-09-01 | Honeywell Int Inc | Layered components, materials, methods of production and uses thereof |
| US7368483B2 (en) * | 2002-12-31 | 2008-05-06 | International Business Machines Corporation | Porous composition of matter, and method of making same |
| JP2004307828A (ja) * | 2003-03-27 | 2004-11-04 | Sumitomo Chem Co Ltd | 絶縁膜形成用塗布液、絶縁膜の製造方法および絶縁膜 |
| JP2006104375A (ja) * | 2004-10-07 | 2006-04-20 | Sumitomo Chemical Co Ltd | 絶縁膜形成用塗布液、絶縁膜の製造方法および絶縁膜 |
| US7732496B1 (en) | 2004-11-03 | 2010-06-08 | Ohio Aerospace Institute | Highly porous and mechanically strong ceramic oxide aerogels |
| US7531209B2 (en) * | 2005-02-24 | 2009-05-12 | Michael Raymond Ayers | Porous films and bodies with enhanced mechanical strength |
| US7432133B2 (en) * | 2005-10-24 | 2008-10-07 | Freescale Semiconductor, Inc. | Plastic packaged device with die interface layer |
| US7435625B2 (en) * | 2005-10-24 | 2008-10-14 | Freescale Semiconductor, Inc. | Semiconductor device with reduced package cross-talk and loss |
| US20070090545A1 (en) * | 2005-10-24 | 2007-04-26 | Condie Brian W | Semiconductor device with improved encapsulation |
| WO2007143028A2 (en) | 2006-05-31 | 2007-12-13 | Roskilde Semiconductor Llc | Low dielectric constant materials prepared from soluble fullerene clusters |
| US7883742B2 (en) * | 2006-05-31 | 2011-02-08 | Roskilde Semiconductor Llc | Porous materials derived from polymer composites |
| US7875315B2 (en) * | 2006-05-31 | 2011-01-25 | Roskilde Semiconductor Llc | Porous inorganic solids for use as low dielectric constant materials |
| WO2007143026A2 (en) | 2006-05-31 | 2007-12-13 | Roskilde Semiconductor Llc | Linked periodic networks of alternating carbon and inorganic clusters for use as low dielectric constant materials |
| US7811499B2 (en) * | 2006-06-26 | 2010-10-12 | International Business Machines Corporation | Method for high density data storage and read-back |
| KR100819760B1 (ko) | 2006-11-06 | 2008-04-07 | (주)파인켐 | 테트라키스페닐계 유기발광화합물 및 이를 이용한유기전계발광소자 |
| US7558186B2 (en) * | 2007-01-02 | 2009-07-07 | International Business Machines Corporation | High density data storage medium, method and device |
| US20080159114A1 (en) * | 2007-01-02 | 2008-07-03 | Dipietro Richard Anthony | High density data storage medium, method and device |
| US20080173541A1 (en) * | 2007-01-22 | 2008-07-24 | Eal Lee | Target designs and related methods for reduced eddy currents, increased resistance and resistivity, and enhanced cooling |
| US8702919B2 (en) * | 2007-08-13 | 2014-04-22 | Honeywell International Inc. | Target designs and related methods for coupled target assemblies, methods of production and uses thereof |
| US8258251B2 (en) * | 2007-11-30 | 2012-09-04 | The United States Of America, As Represented By The Administrator Of The National Aeronautics And Space Administration | Highly porous ceramic oxide aerogels having improved flexibility |
| US8314201B2 (en) | 2007-11-30 | 2012-11-20 | The United States Of America As Represented By The Administration Of The National Aeronautics And Space Administration | Highly porous ceramic oxide aerogels having improved flexibility |
| CA2733682C (en) * | 2008-08-12 | 2014-10-14 | Air Products And Chemicals, Inc. | Polymeric compositions comprising per(phenylethynyl) arene derivatives |
| US9006353B2 (en) | 2011-11-18 | 2015-04-14 | Delsper LP | Crosslinking compounds for high glass transition temperature polymers |
| CN102848642B (zh) * | 2012-09-11 | 2016-01-13 | 广东生益科技股份有限公司 | 二层法双面挠性覆铜板及其制作方法 |
| WO2014208324A1 (ja) * | 2013-06-24 | 2014-12-31 | Jsr株式会社 | 膜形成用組成物、レジスト下層膜及びその形成方法、パターン形成方法並びに化合物 |
| EP3740188A1 (en) * | 2017-12-18 | 2020-11-25 | Tris Pharma, Inc. | Pharmaceutical compositions comprising a floating interpenetrating polymer network forming system |
| US11337920B2 (en) | 2017-12-18 | 2022-05-24 | Tris Pharma, Inc. | Pharmaceutical composition comprising GHB gastro-retentive raft forming systems having trigger pulse drug release |
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|---|---|---|---|---|
| JP2906282B2 (ja) | 1990-09-20 | 1999-06-14 | 富士通株式会社 | ガラスセラミック・グリーンシートと多層基板、及び、その製造方法 |
| JPH04314394A (ja) | 1991-04-12 | 1992-11-05 | Fujitsu Ltd | ガラスセラミック回路基板とその製造方法 |
| JP2531906B2 (ja) | 1991-09-13 | 1996-09-04 | インターナショナル・ビジネス・マシーンズ・コーポレイション | 発泡重合体 |
| US5177176A (en) | 1991-10-29 | 1993-01-05 | E. I. Du Pont De Nemours And Company | Soluble pseudo rod-like polyimides having low coefficient of thermal expansion |
| US5629353A (en) | 1995-05-22 | 1997-05-13 | The Regents Of The University Of California | Highly cross-linked nanoporous polymers |
| US5744399A (en) | 1995-11-13 | 1998-04-28 | Lsi Logic Corporation | Process for forming low dielectric constant layers using fullerenes |
| US6423811B1 (en) * | 2000-07-19 | 2002-07-23 | Honeywell International Inc. | Low dielectric constant materials with polymeric networks |
| US6451712B1 (en) | 2000-12-18 | 2002-09-17 | International Business Machines Corporation | Method for forming a porous dielectric material layer in a semiconductor device and device formed |
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2000
- 2000-07-19 US US09/619,237 patent/US6423811B1/en not_active Expired - Fee Related
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2001
- 2001-07-12 JP JP2002512266A patent/JP2004504424A/ja not_active Withdrawn
- 2001-07-12 EP EP01952741A patent/EP1303550A4/en not_active Withdrawn
- 2001-07-12 CN CN01815352A patent/CN1455789A/zh active Pending
- 2001-07-12 WO PCT/US2001/022213 patent/WO2002006366A1/en not_active Ceased
- 2001-07-12 KR KR10-2003-7000741A patent/KR20030022291A/ko not_active Withdrawn
- 2001-07-12 AU AU2001273464A patent/AU2001273464A1/en not_active Abandoned
- 2001-07-19 TW TW090117700A patent/TW553967B/zh not_active IP Right Cessation
- 2001-12-03 US US10/004,584 patent/US6713590B2/en not_active Expired - Fee Related
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| EP1303550A1 (en) | 2003-04-23 |
| US20020037941A1 (en) | 2002-03-28 |
| EP1303550A4 (en) | 2003-07-30 |
| TW553967B (en) | 2003-09-21 |
| AU2001273464A1 (en) | 2002-01-30 |
| CN1455789A (zh) | 2003-11-12 |
| US6423811B1 (en) | 2002-07-23 |
| US6713590B2 (en) | 2004-03-30 |
| JP2004504424A (ja) | 2004-02-12 |
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