KR20030007464A - 전기 도금 장치 및 전기 도금 방법 - Google Patents

전기 도금 장치 및 전기 도금 방법 Download PDF

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Publication number
KR20030007464A
KR20030007464A KR1020027012079A KR20027012079A KR20030007464A KR 20030007464 A KR20030007464 A KR 20030007464A KR 1020027012079 A KR1020027012079 A KR 1020027012079A KR 20027012079 A KR20027012079 A KR 20027012079A KR 20030007464 A KR20030007464 A KR 20030007464A
Authority
KR
South Korea
Prior art keywords
substrate
cathode connector
deposited
cathode
electroplating
Prior art date
Application number
KR1020027012079A
Other languages
English (en)
Korean (ko)
Inventor
존 마이클 로우
Original Assignee
테크놀로지 디벨럽먼트 어쏘시에이트 오퍼레이션 리미티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 테크놀로지 디벨럽먼트 어쏘시에이트 오퍼레이션 리미티드 filed Critical 테크놀로지 디벨럽먼트 어쏘시에이트 오퍼레이션 리미티드
Publication of KR20030007464A publication Critical patent/KR20030007464A/ko

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils
    • C25D7/0657—Conducting rolls
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Manufacturing Of Printed Wiring (AREA)
KR1020027012079A 2000-03-13 2001-03-13 전기 도금 장치 및 전기 도금 방법 KR20030007464A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GBGB0005883.4A GB0005883D0 (en) 2000-03-13 2000-03-13 Electro-plating apparatus and a method of electoplating
GB0005883.4 2000-03-13

Publications (1)

Publication Number Publication Date
KR20030007464A true KR20030007464A (ko) 2003-01-23

Family

ID=9887431

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020027012079A KR20030007464A (ko) 2000-03-13 2001-03-13 전기 도금 장치 및 전기 도금 방법

Country Status (12)

Country Link
EP (1) EP1266052A1 (zh)
JP (1) JP2003527489A (zh)
KR (1) KR20030007464A (zh)
CN (1) CN1425080A (zh)
AU (1) AU775221B2 (zh)
BR (1) BR0109301A (zh)
CA (1) CA2403116A1 (zh)
GB (1) GB0005883D0 (zh)
HK (1) HK1053153A1 (zh)
MX (1) MXPA02008976A (zh)
RU (1) RU2244767C2 (zh)
WO (1) WO2001068951A1 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100760744B1 (ko) * 2005-02-21 2007-09-21 세이코 엡슨 가부시키가이샤 광학 소자의 제조 방법

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103603025A (zh) * 2013-12-02 2014-02-26 昆山亿诚化工容器有限公司 一种金属卷材的电镀装置
CN105603494A (zh) * 2016-01-27 2016-05-25 南通彩都新能源科技有限公司 一种电泳沉积系统及制备锂离子电池硅基负极材料的方法
CN109750281B (zh) * 2017-11-07 2024-04-12 东莞市腾明智能设备有限公司 一种水平沉铜装置
JP7113881B2 (ja) * 2019-12-11 2022-08-05 エスケー ネクシリス カンパニー リミテッド メッキ設備用陰極アセンブリ

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2156981A5 (zh) * 1971-10-13 1973-06-01 Honeywell Bull
DE3603856C2 (de) * 1986-02-07 1994-05-05 Bosch Gmbh Robert Verfahren und Vorrichtung zur Galvanisierung von ebenen Werkstücken wie Leiterplatten
EP0889680A3 (en) * 1997-07-01 2000-07-05 Deutsche Thomson-Brandt Gmbh Method of removing and/or applying conductive material
IT1298150B1 (it) * 1998-01-19 1999-12-20 Occleppo Di Francesco Occleppo Dispositivo per la deposizione elettrolitica su lastre metalliche traslanti in specie per circuiti stampati, mediante la chiusura di un

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100760744B1 (ko) * 2005-02-21 2007-09-21 세이코 엡슨 가부시키가이샤 광학 소자의 제조 방법
US7608474B2 (en) 2005-02-21 2009-10-27 Seiko Epson Corporation Method for manufacturing optical element

Also Published As

Publication number Publication date
AU4080401A (en) 2001-09-24
BR0109301A (pt) 2002-12-24
AU775221B2 (en) 2004-07-22
JP2003527489A (ja) 2003-09-16
WO2001068951A1 (en) 2001-09-20
RU2244767C2 (ru) 2005-01-20
GB0005883D0 (en) 2000-05-03
EP1266052A1 (en) 2002-12-18
CN1425080A (zh) 2003-06-18
MXPA02008976A (es) 2004-10-14
CA2403116A1 (en) 2001-09-20
HK1053153A1 (zh) 2003-10-10

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E902 Notification of reason for refusal
E701 Decision to grant or registration of patent right
NORF Unpaid initial registration fee