MXPA02008976A - Aparato de electrodo chapeado y un metodo de electro chapeado. - Google Patents

Aparato de electrodo chapeado y un metodo de electro chapeado.

Info

Publication number
MXPA02008976A
MXPA02008976A MXPA02008976A MXPA02008976A MXPA02008976A MX PA02008976 A MXPA02008976 A MX PA02008976A MX PA02008976 A MXPA02008976 A MX PA02008976A MX PA02008976 A MXPA02008976 A MX PA02008976A MX PA02008976 A MXPA02008976 A MX PA02008976A
Authority
MX
Mexico
Prior art keywords
substrate
cathode
cathode connector
deposited
contact
Prior art date
Application number
MXPA02008976A
Other languages
English (en)
Spanish (es)
Inventor
John Michael Lowe
Original Assignee
Tdao Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tdao Ltd filed Critical Tdao Ltd
Publication of MXPA02008976A publication Critical patent/MXPA02008976A/es

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils
    • C25D7/0657—Conducting rolls
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Manufacturing Of Printed Wiring (AREA)
MXPA02008976A 2000-03-13 2001-03-13 Aparato de electrodo chapeado y un metodo de electro chapeado. MXPA02008976A (es)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GBGB0005883.4A GB0005883D0 (en) 2000-03-13 2000-03-13 Electro-plating apparatus and a method of electoplating
PCT/GB2001/001086 WO2001068951A1 (en) 2000-03-13 2001-03-13 Electro-plating apparatus and a method of electro-plating

Publications (1)

Publication Number Publication Date
MXPA02008976A true MXPA02008976A (es) 2004-10-14

Family

ID=9887431

Family Applications (1)

Application Number Title Priority Date Filing Date
MXPA02008976A MXPA02008976A (es) 2000-03-13 2001-03-13 Aparato de electrodo chapeado y un metodo de electro chapeado.

Country Status (12)

Country Link
EP (1) EP1266052A1 (zh)
JP (1) JP2003527489A (zh)
KR (1) KR20030007464A (zh)
CN (1) CN1425080A (zh)
AU (1) AU775221B2 (zh)
BR (1) BR0109301A (zh)
CA (1) CA2403116A1 (zh)
GB (1) GB0005883D0 (zh)
HK (1) HK1053153A1 (zh)
MX (1) MXPA02008976A (zh)
RU (1) RU2244767C2 (zh)
WO (1) WO2001068951A1 (zh)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4479535B2 (ja) * 2005-02-21 2010-06-09 セイコーエプソン株式会社 光学素子の製造方法
CN103603025A (zh) * 2013-12-02 2014-02-26 昆山亿诚化工容器有限公司 一种金属卷材的电镀装置
CN105603494A (zh) * 2016-01-27 2016-05-25 南通彩都新能源科技有限公司 一种电泳沉积系统及制备锂离子电池硅基负极材料的方法
CN109750281B (zh) * 2017-11-07 2024-04-12 东莞市腾明智能设备有限公司 一种水平沉铜装置
JP7113881B2 (ja) * 2019-12-11 2022-08-05 エスケー ネクシリス カンパニー リミテッド メッキ設備用陰極アセンブリ

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2156981A5 (zh) * 1971-10-13 1973-06-01 Honeywell Bull
DE3603856C2 (de) * 1986-02-07 1994-05-05 Bosch Gmbh Robert Verfahren und Vorrichtung zur Galvanisierung von ebenen Werkstücken wie Leiterplatten
EP0889680A3 (en) * 1997-07-01 2000-07-05 Deutsche Thomson-Brandt Gmbh Method of removing and/or applying conductive material
IT1298150B1 (it) * 1998-01-19 1999-12-20 Occleppo Di Francesco Occleppo Dispositivo per la deposizione elettrolitica su lastre metalliche traslanti in specie per circuiti stampati, mediante la chiusura di un

Also Published As

Publication number Publication date
KR20030007464A (ko) 2003-01-23
AU4080401A (en) 2001-09-24
BR0109301A (pt) 2002-12-24
AU775221B2 (en) 2004-07-22
JP2003527489A (ja) 2003-09-16
WO2001068951A1 (en) 2001-09-20
RU2244767C2 (ru) 2005-01-20
GB0005883D0 (en) 2000-05-03
EP1266052A1 (en) 2002-12-18
CN1425080A (zh) 2003-06-18
CA2403116A1 (en) 2001-09-20
HK1053153A1 (zh) 2003-10-10

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Legal Events

Date Code Title Description
HC Change of company name or juridical status

Owner name: ASTRAZENECA UK LIMITED

FA Abandonment or withdrawal