KR20010042625A - 주석 또는 주석 합금층으로 구리 또는 구리 합금의 표면을피복하는 방법 - Google Patents

주석 또는 주석 합금층으로 구리 또는 구리 합금의 표면을피복하는 방법 Download PDF

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Publication number
KR20010042625A
KR20010042625A KR1020007011306A KR20007011306A KR20010042625A KR 20010042625 A KR20010042625 A KR 20010042625A KR 1020007011306 A KR1020007011306 A KR 1020007011306A KR 20007011306 A KR20007011306 A KR 20007011306A KR 20010042625 A KR20010042625 A KR 20010042625A
Authority
KR
South Korea
Prior art keywords
tin
copper
solution
layer
alloy
Prior art date
Application number
KR1020007011306A
Other languages
English (en)
Korean (ko)
Inventor
말코우하르트무트
바쿠스페트라
Original Assignee
그레고루 후렝크, 디터 베크베르트
아토테크 도이칠란드 게엠베하
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 그레고루 후렝크, 디터 베크베르트, 아토테크 도이칠란드 게엠베하 filed Critical 그레고루 후렝크, 디터 베크베르트
Publication of KR20010042625A publication Critical patent/KR20010042625A/ko

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/28—Sensitising or activating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/1803—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces
    • C23C18/1824—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces by chemical pretreatment
    • C23C18/1837—Multistep pretreatment
    • C23C18/1844—Multistep pretreatment with use of organic or inorganic compounds other than metals, first
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Inorganic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Manufacturing Of Printed Wiring (AREA)
KR1020007011306A 1998-04-23 1999-04-15 주석 또는 주석 합금층으로 구리 또는 구리 합금의 표면을피복하는 방법 KR20010042625A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE19818910 1998-04-23
DE19818910.9 1998-04-23
PCT/DE1999/001176 WO1999055935A1 (de) 1998-04-23 1999-04-15 Verfahren zum überziehen von oberflächen auf kupfer oder einer kupferlegierung mit einer zinn- oder zinnlegierungsschicht

Publications (1)

Publication Number Publication Date
KR20010042625A true KR20010042625A (ko) 2001-05-25

Family

ID=7866016

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020007011306A KR20010042625A (ko) 1998-04-23 1999-04-15 주석 또는 주석 합금층으로 구리 또는 구리 합금의 표면을피복하는 방법

Country Status (6)

Country Link
EP (1) EP1082471A1 (zh)
JP (1) JP2002513090A (zh)
KR (1) KR20010042625A (zh)
CN (1) CN1297490A (zh)
CA (1) CA2326049A1 (zh)
WO (1) WO1999055935A1 (zh)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10018025A1 (de) 2000-04-04 2001-10-18 Atotech Deutschland Gmbh Verfahren zum Erzeugen von lötfähigen Oberflächen und funktionellen Oberflächen auf Schaltungsträgern
JP4998704B2 (ja) 2007-01-22 2012-08-15 上村工業株式会社 置換錫合金めっき皮膜の形成方法、置換錫合金めっき浴及びめっき性能の維持方法
JP5367271B2 (ja) * 2007-01-26 2013-12-11 古河電気工業株式会社 圧延板材
WO2009142126A1 (ja) * 2008-05-21 2009-11-26 日本高純度化学株式会社 はんだめっき用触媒付与液
JP5522617B2 (ja) * 2008-11-05 2014-06-18 メック株式会社 接着層形成液及び接着層形成方法
JP5954410B2 (ja) * 2012-03-28 2016-07-20 富士電機株式会社 半導体装置
CN103173786B (zh) * 2013-04-02 2015-11-25 吉首大学 一种环保高效生产电解金属锰的方法
CN103938191B (zh) * 2014-05-13 2016-06-01 山西宇达集团有限公司 青铜雕塑表面的富锡方法
CN108326474B (zh) * 2018-02-07 2020-06-23 郑州机械研究所有限公司 一种表层镀锡药芯银钎料的制备方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3011697A1 (de) * 1980-03-26 1981-10-01 Shipley Co., Inc., Newton, Mass. Saures chemisches verzinnungsbad
US4816070A (en) * 1985-08-29 1989-03-28 Techo Instruments Investments Ltd. Use of immersion tin and alloys as a bonding medium for multilayer circuits
US4959278A (en) * 1988-06-16 1990-09-25 Nippon Mining Co., Ltd. Tin whisker-free tin or tin alloy plated article and coating technique thereof

Also Published As

Publication number Publication date
EP1082471A1 (de) 2001-03-14
JP2002513090A (ja) 2002-05-08
WO1999055935A1 (de) 1999-11-04
CN1297490A (zh) 2001-05-30
CA2326049A1 (en) 1999-11-04

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