KR19990071466A - 금속 전자 패키지용 접지 링 - Google Patents

금속 전자 패키지용 접지 링 Download PDF

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Publication number
KR19990071466A
KR19990071466A KR1019980703735A KR19980703735A KR19990071466A KR 19990071466 A KR19990071466 A KR 19990071466A KR 1019980703735 A KR1019980703735 A KR 1019980703735A KR 19980703735 A KR19980703735 A KR 19980703735A KR 19990071466 A KR19990071466 A KR 19990071466A
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KR
South Korea
Prior art keywords
annular channel
side wall
depth
cavity
electronic package
Prior art date
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Withdrawn
Application number
KR1019980703735A
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English (en)
Korean (ko)
Inventor
알. 호프만 폴
케이. 립하르트 마커스
Original Assignee
휴버트 마이어
어드밴스드 테크놀로지스 인터커넥트 인코포레이티드
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Priority claimed from US08/749,259 external-priority patent/US5764484A/en
Application filed by 휴버트 마이어, 어드밴스드 테크놀로지스 인터커넥트 인코포레이티드 filed Critical 휴버트 마이어
Publication of KR19990071466A publication Critical patent/KR19990071466A/ko
Withdrawn legal-status Critical Current

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    • H—ELECTRICITY
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    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
KR1019980703735A 1995-11-20 1996-11-18 금속 전자 패키지용 접지 링 Withdrawn KR19990071466A (ko)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US737495P 1995-11-20 1995-11-20
US60/007,374 1995-11-20
US08/749,259 US5764484A (en) 1996-11-15 1996-11-15 Ground ring for a metal electronic package
US8/749,259 1996-11-15
PCT/US1996/018479 WO1997019470A1 (en) 1995-11-20 1996-11-18 Ground ring for metal electronic package

Publications (1)

Publication Number Publication Date
KR19990071466A true KR19990071466A (ko) 1999-09-27

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019980703735A Withdrawn KR19990071466A (ko) 1995-11-20 1996-11-18 금속 전자 패키지용 접지 링

Country Status (5)

Country Link
EP (1) EP0956589A1 (enrdf_load_stackoverflow)
JP (1) JP2000500619A (enrdf_load_stackoverflow)
KR (1) KR19990071466A (enrdf_load_stackoverflow)
TW (1) TW434870B (enrdf_load_stackoverflow)
WO (1) WO1997019470A1 (enrdf_load_stackoverflow)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6716363B2 (ja) * 2016-06-28 2020-07-01 株式会社アムコー・テクノロジー・ジャパン 半導体パッケージ及びその製造方法

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US3819431A (en) * 1971-10-05 1974-06-25 Kulite Semiconductor Products Method of making transducers employing integral protective coatings and supports
JPS58169943A (ja) * 1982-03-29 1983-10-06 Fujitsu Ltd 半導体装置
US4939316A (en) * 1988-10-05 1990-07-03 Olin Corporation Aluminum alloy semiconductor packages
US5023398A (en) * 1988-10-05 1991-06-11 Olin Corporation Aluminum alloy semiconductor packages
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EP0956589A4 (enrdf_load_stackoverflow) 1999-11-17
WO1997019470A1 (en) 1997-05-29
TW434870B (en) 2001-05-16
EP0956589A1 (en) 1999-11-17
JP2000500619A (ja) 2000-01-18

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