TW434870B - Ground ring for metal electronic package - Google Patents
Ground ring for metal electronic package Download PDFInfo
- Publication number
- TW434870B TW434870B TW086102000A TW86102000A TW434870B TW 434870 B TW434870 B TW 434870B TW 086102000 A TW086102000 A TW 086102000A TW 86102000 A TW86102000 A TW 86102000A TW 434870 B TW434870 B TW 434870B
- Authority
- TW
- Taiwan
- Prior art keywords
- annular channel
- side wall
- depth
- groove
- separated
- Prior art date
Links
- 229910052751 metal Inorganic materials 0.000 title claims description 29
- 239000002184 metal Substances 0.000 title claims description 29
- 239000000758 substrate Substances 0.000 claims abstract description 29
- 238000000034 method Methods 0.000 claims abstract description 21
- 239000011248 coating agent Substances 0.000 claims abstract description 19
- 238000000576 coating method Methods 0.000 claims abstract description 19
- 239000004065 semiconductor Substances 0.000 claims abstract description 12
- 238000000227 grinding Methods 0.000 claims description 8
- 238000004100 electronic packaging Methods 0.000 claims description 7
- 238000004519 manufacturing process Methods 0.000 claims description 5
- 229910000838 Al alloy Inorganic materials 0.000 claims description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 2
- 229910052737 gold Inorganic materials 0.000 claims description 2
- 239000010931 gold Substances 0.000 claims description 2
- PCTMTFRHKVHKIS-BMFZQQSSSA-N (1s,3r,4e,6e,8e,10e,12e,14e,16e,18s,19r,20r,21s,25r,27r,30r,31r,33s,35r,37s,38r)-3-[(2r,3s,4s,5s,6r)-4-amino-3,5-dihydroxy-6-methyloxan-2-yl]oxy-19,25,27,30,31,33,35,37-octahydroxy-18,20,21-trimethyl-23-oxo-22,39-dioxabicyclo[33.3.1]nonatriaconta-4,6,8,10 Chemical compound C1C=C2C[C@@H](OS(O)(=O)=O)CC[C@]2(C)[C@@H]2[C@@H]1[C@@H]1CC[C@H]([C@H](C)CCCC(C)C)[C@@]1(C)CC2.O[C@H]1[C@@H](N)[C@H](O)[C@@H](C)O[C@H]1O[C@H]1/C=C/C=C/C=C/C=C/C=C/C=C/C=C/[C@H](C)[C@@H](O)[C@@H](C)[C@H](C)OC(=O)C[C@H](O)C[C@H](O)CC[C@@H](O)[C@H](O)C[C@H](O)C[C@](O)(C[C@H](O)[C@H]2C(O)=O)O[C@H]2C1 PCTMTFRHKVHKIS-BMFZQQSSSA-N 0.000 claims 1
- 230000002093 peripheral effect Effects 0.000 claims 1
- 239000002689 soil Substances 0.000 claims 1
- 239000002243 precursor Substances 0.000 abstract 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 6
- 229910052802 copper Inorganic materials 0.000 description 5
- 239000010949 copper Substances 0.000 description 5
- 238000004806 packaging method and process Methods 0.000 description 4
- 229920000642 polymer Polymers 0.000 description 4
- 229910045601 alloy Inorganic materials 0.000 description 3
- 239000000956 alloy Substances 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 230000002079 cooperative effect Effects 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 241001391944 Commicarpus scandens Species 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 241000065675 Cyclops Species 0.000 description 1
- 238000003486 chemical etching Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 239000005022 packaging material Substances 0.000 description 1
- 238000007790 scraping Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000002966 varnish Substances 0.000 description 1
Classifications
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- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
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- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US737495P | 1995-11-20 | 1995-11-20 | |
| US08/749,259 US5764484A (en) | 1996-11-15 | 1996-11-15 | Ground ring for a metal electronic package |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW434870B true TW434870B (en) | 2001-05-16 |
Family
ID=26676905
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW086102000A TW434870B (en) | 1995-11-20 | 1997-02-20 | Ground ring for metal electronic package |
Country Status (5)
| Country | Link |
|---|---|
| EP (1) | EP0956589A1 (enrdf_load_stackoverflow) |
| JP (1) | JP2000500619A (enrdf_load_stackoverflow) |
| KR (1) | KR19990071466A (enrdf_load_stackoverflow) |
| TW (1) | TW434870B (enrdf_load_stackoverflow) |
| WO (1) | WO1997019470A1 (enrdf_load_stackoverflow) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6716363B2 (ja) * | 2016-06-28 | 2020-07-01 | 株式会社アムコー・テクノロジー・ジャパン | 半導体パッケージ及びその製造方法 |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3819431A (en) * | 1971-10-05 | 1974-06-25 | Kulite Semiconductor Products | Method of making transducers employing integral protective coatings and supports |
| JPS58169943A (ja) * | 1982-03-29 | 1983-10-06 | Fujitsu Ltd | 半導体装置 |
| US4939316A (en) * | 1988-10-05 | 1990-07-03 | Olin Corporation | Aluminum alloy semiconductor packages |
| US5023398A (en) * | 1988-10-05 | 1991-06-11 | Olin Corporation | Aluminum alloy semiconductor packages |
| JP2598129B2 (ja) * | 1989-05-18 | 1997-04-09 | 三菱電機株式会社 | 半導体装置 |
| JPH0423441A (ja) * | 1990-05-18 | 1992-01-27 | Fujitsu Ltd | セラミックパッケージ半導体装置およびその製造方法 |
| US6262477B1 (en) * | 1993-03-19 | 2001-07-17 | Advanced Interconnect Technologies | Ball grid array electronic package |
| US5353195A (en) * | 1993-07-09 | 1994-10-04 | General Electric Company | Integral power and ground structure for multi-chip modules |
| EP0645953B1 (de) * | 1993-09-29 | 1997-08-06 | Siemens NV | Verfahren zur Herstellung einer zwei- oder mehrlagigen Verdrahtung und danach hergestellte zwei- oder mehrlagige Verdrahtung |
| US5629835A (en) * | 1994-07-19 | 1997-05-13 | Olin Corporation | Metal ball grid array package with improved thermal conductivity |
-
1996
- 1996-11-18 KR KR1019980703735A patent/KR19990071466A/ko not_active Withdrawn
- 1996-11-18 WO PCT/US1996/018479 patent/WO1997019470A1/en not_active Application Discontinuation
- 1996-11-18 EP EP96941385A patent/EP0956589A1/en not_active Withdrawn
- 1996-11-18 JP JP9519824A patent/JP2000500619A/ja active Pending
-
1997
- 1997-02-20 TW TW086102000A patent/TW434870B/zh not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| WO1997019470A1 (en) | 1997-05-29 |
| JP2000500619A (ja) | 2000-01-18 |
| KR19990071466A (ko) | 1999-09-27 |
| EP0956589A4 (enrdf_load_stackoverflow) | 1999-11-17 |
| EP0956589A1 (en) | 1999-11-17 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GD4A | Issue of patent certificate for granted invention patent | ||
| MM4A | Annulment or lapse of patent due to non-payment of fees |