KR19990069089A - 웨이퍼 고정용 정전척 - Google Patents
웨이퍼 고정용 정전척 Download PDFInfo
- Publication number
- KR19990069089A KR19990069089A KR1019980003115A KR19980003115A KR19990069089A KR 19990069089 A KR19990069089 A KR 19990069089A KR 1019980003115 A KR1019980003115 A KR 1019980003115A KR 19980003115 A KR19980003115 A KR 19980003115A KR 19990069089 A KR19990069089 A KR 19990069089A
- Authority
- KR
- South Korea
- Prior art keywords
- electrostatic chuck
- cooling
- wafer
- cooling gas
- supply pipe
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67109—Apparatus for thermal treatment mainly by convection
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Description
Claims (7)
- 웨이퍼 고정용 정전척(ESC : Electro Static Chuck)에 있어서,표면에 다수의 구멍이 형성되어 있는 정전척 플레이트;상기 정전척 프레이트 하부에 위치하는 냉각수 챔버; 및상기 냉각수 챔버 내부를 통과하며 상기 정전척 플레이트 표면의 구멍에 연결되는 냉각가스 공급관;을 구비하여 이루어지는 것을 특징으로 하는 웨이퍼 고정용 정전척.
- 제 1 항에 있어서,상기 냉각수 챔버 내를 통과하는 부분의 상기 냉각가스 공급관은 스프링 형태인 것을 특징으로 하는 상기 웨이퍼 고정용 정전척.
- 제 1 항에 있어서,상기 냉각가스는 에어(Air) 인 것을 특징으로 하는 상기 웨이퍼 고정용 정전척.
- 제 1 항에 있어서,상기 정전척 플레이트 표면에는 다수의 냉각가스 배출구멍이 원형형태로 형성되어 있는 것을 특징으로 하는 상기 웨이퍼 고정용 정전척.
- 제 2 항에 있어서,상기 냉각수 챔버 내를 통과하기 전단의 상기 냉각가스 공급관에는 상기 냉각가스가 상기 플레이트에 도달하는 시간지연을 조절하는 밸브가 개재되는 것을 특징으로 하는 상기 웨이퍼 고정용 정전척.
- 제 5 항에 있어서,상기 밸브는 솔레노이드 밸브인 것을 특징으로 하는 상기 웨이퍼 고정용 정전척.
- 제 5 항에 있어서,상기 밸브와 냉각가스 공급원 사이에는 가스건조기가 개재되어 있는 것을 특징으로 하는 상기 웨이퍼 고정용 정전척.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019980003115A KR100490894B1 (ko) | 1998-02-04 | 1998-02-04 | 웨이퍼고정용정전척 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019980003115A KR100490894B1 (ko) | 1998-02-04 | 1998-02-04 | 웨이퍼고정용정전척 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR19990069089A true KR19990069089A (ko) | 1999-09-06 |
KR100490894B1 KR100490894B1 (ko) | 2005-08-31 |
Family
ID=37304319
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019980003115A Expired - Fee Related KR100490894B1 (ko) | 1998-02-04 | 1998-02-04 | 웨이퍼고정용정전척 |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR100490894B1 (ko) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100337108B1 (ko) * | 1999-11-09 | 2002-05-16 | 정기로 | 웨이퍼 냉각 장치 |
KR100551890B1 (ko) * | 2004-12-29 | 2006-02-14 | 동부아남반도체 주식회사 | 웨이퍼 온도 조절용 헬륨의 온도 제어장치 |
KR20160146286A (ko) * | 2015-06-12 | 2016-12-21 | 세메스 주식회사 | 기판 처리 장치 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5539609A (en) * | 1992-12-02 | 1996-07-23 | Applied Materials, Inc. | Electrostatic chuck usable in high density plasma |
US5376213A (en) * | 1992-07-28 | 1994-12-27 | Tokyo Electron Limited | Plasma processing apparatus |
JPH07335570A (ja) * | 1994-06-06 | 1995-12-22 | Anelva Corp | プラズマ処理における基板温度制御方法 |
US5667622A (en) * | 1995-08-25 | 1997-09-16 | Siemens Aktiengesellschaft | In-situ wafer temperature control apparatus for single wafer tools |
JPH09167794A (ja) * | 1995-12-15 | 1997-06-24 | Sony Corp | 静電チャックおよびプラズマ処理方法 |
JPH09219439A (ja) * | 1996-02-13 | 1997-08-19 | Kobe Steel Ltd | 基板処理装置 |
-
1998
- 1998-02-04 KR KR1019980003115A patent/KR100490894B1/ko not_active Expired - Fee Related
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100337108B1 (ko) * | 1999-11-09 | 2002-05-16 | 정기로 | 웨이퍼 냉각 장치 |
KR100551890B1 (ko) * | 2004-12-29 | 2006-02-14 | 동부아남반도체 주식회사 | 웨이퍼 온도 조절용 헬륨의 온도 제어장치 |
KR20160146286A (ko) * | 2015-06-12 | 2016-12-21 | 세메스 주식회사 | 기판 처리 장치 |
Also Published As
Publication number | Publication date |
---|---|
KR100490894B1 (ko) | 2005-08-31 |
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