KR19990064755A - Process for preparing heading lead pin with silver solder - Google Patents
Process for preparing heading lead pin with silver solder Download PDFInfo
- Publication number
- KR19990064755A KR19990064755A KR1019990016305A KR19990016305A KR19990064755A KR 19990064755 A KR19990064755 A KR 19990064755A KR 1019990016305 A KR1019990016305 A KR 1019990016305A KR 19990016305 A KR19990016305 A KR 19990016305A KR 19990064755 A KR19990064755 A KR 19990064755A
- Authority
- KR
- South Korea
- Prior art keywords
- lead pin
- silver
- heading
- carbon jig
- head portion
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 16
- 229910000679 solder Inorganic materials 0.000 title 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims abstract description 50
- 229910052709 silver Inorganic materials 0.000 claims abstract description 49
- 239000004332 silver Substances 0.000 claims abstract description 49
- 229910052799 carbon Inorganic materials 0.000 claims abstract description 29
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 26
- 238000002844 melting Methods 0.000 claims abstract description 13
- 230000008018 melting Effects 0.000 claims abstract description 13
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims abstract description 5
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims abstract description 5
- 229910001873 dinitrogen Inorganic materials 0.000 claims abstract description 4
- 238000000034 method Methods 0.000 abstract description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000002845 discoloration Methods 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen(.) Chemical compound [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4885—Wire-like parts or pins
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
본 발명은 은이 부착된 헤딩 리드핀의 제조방법으로서, 더욱 상세하게는 전자부품에 취부하는 구조로된 헤드부를 갖는 헤딩 리드핀의 헤드부에 은을 반구형상으로 형성시키는 방법에 관한것이다.BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a headed lead pin with silver, and more particularly, to a method of forming silver in a hemispherical head portion of a heading lead pin having a head portion structured to be mounted on an electronic component.
본 발명은 헤딩 리드핀(1)의 제조에 있어서, 헤딩 리드핀(1) 형상의 구멍(2)을 갖는 카본 지그(3)에 헤딩 리드핀을 삽입고정하고, 상기 헤딩 리드 핀의 헤드부(4) 위에 은조각(5)을 올려 놓고, 상기 은조각의 높이가 카본지그의 최상단(6) 높이를 초과하지 않도록 하고, 상기 카본 지그(3)의 선단에 카본지그 커버(7)를 덮고, 이어서 용융로 중에 인가하여 질소가스와 수소가스를 혼합하여 용융하여 은을 리드핀의 헤드부에 접착시키는 것을 특징으로 하는 은이 부착된 헤딩 리드핀의 제조방법이다.In the present invention, in the manufacture of the heading lead pin 1, the heading lead pin is inserted into the carbon jig 3 having the hole 2 in the shape of the heading lead pin 1, and the head portion of the heading lead pin ( 4) Place a piece of silver (5) on, so that the height of the silver piece does not exceed the height of the upper end (6) of the carbon jig, cover the carbon jig cover (7) on the tip of the carbon jig (3), then A method of manufacturing a headed lead pin with silver, which is applied in a melting furnace to mix and melt nitrogen gas and hydrogen gas to bond silver to a head portion of the lead pin.
Description
본 발명은 은이 부착된 헤딩 리드핀의 제조방법으로서, 더욱 상세하게는 전자부품에 취부하는 구조로된 헤드부를 갖는 헤딩 리드핀의 헤드부에 은을 반구형상으로 형성시키는 방법에 관한것이다.BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a headed lead pin with silver, and more particularly, to a method of forming silver in a hemispherical head portion of a heading lead pin having a head portion structured to be mounted on an electronic component.
이와 같은 은이 부착된 리드핀의 제조방법은 도 3에 나타난 바와 같이(일본특공소63-51543호 공보에 개시) 헤딩 리드핀상 구멍(31)을 갖는 카본지그(32)에 헤드부(33)를 갖는 리드핀(34)을 고정한 다음 은조각(35)을 리드핀의 헤드부에 올려놓고 이를 로중에 넣어 가열하여 은 조각을 용융시켜 헤드부분 위에 접합하는 방법이 알려져 있다. 이러한 경우 리드핀의 헤드부 위에 올려져 있는 은과 헤딩 리드핀이 로(爐)중에서 직접 열을 받아 용융되므로서 고온에 의해 은과 리드핀의 색깔이 변색되는 현상이 발생하고, 또한 용융되는 은조각에 기포현상이 발생하는 문제점이 있다.The manufacturing method of such a lead pin with silver is shown in FIG. 3 (started in Japanese Patent Application Laid-Open No. 63-51543). The head portion 33 is placed on a carbon jig 32 having a heading lead pin-shaped hole 31. After fixing the lead pin 34 having the silver piece 35 is put on the head portion of the lead pin and put it in the furnace and heated to melt the pieces of silver to join on the head portion is known. In this case, silver on the head of the lead pin and heading lead pin are melted by being directly heated in the furnace, causing the color of the silver and the lead pin to discolor due to high temperature, and also melting silver. There is a problem that bubbles occur in pieces.
본 발명에서는 이러한 문제점을 해결하기 위한 것으로 헤딩 리드핀의 헤드부에 은을 용융부착시키는 제조방법에서 은과 헤딩리드핀이 직접열을 받아 은과 헤딩리드핀이 변색되는 현상을 방지하는 것을 기술적인 과제로 한다.In the present invention to solve this problem, in the manufacturing method for melting and attaching silver to the head of the heading lead pin to prevent the phenomenon of silver and the heading lead pin discolored by direct heat. It is a task.
또한 본 발명은 헤딩 리드핀의 헤드부에 은을 용융부착하는 경우 은에 열을 직접 쏘이게 되는 경우 용융된 은에 기포가 발생하는 것을 방지하는 것을 기술적인 과제로 한다.In another aspect, the present invention is to prevent the generation of bubbles in the molten silver when the heat is directly directed to the silver when the silver is melt-bonded to the head of the head lead pin.
도 1은 본 발명에 의한 은이 부착된 헤딩 리드핀의 제조과정중 은을 용융부착하기 직전의 상태도이다.1 is a state diagram immediately before melting and attaching silver during the manufacturing process of the heading lead pin with silver according to the present invention.
도 2는 본 발명에 의해 제조된 은이 부착된 헤딩 리드핀의 측면도이다.Figure 2 is a side view of the headed lead pin with silver prepared according to the present invention.
도 3은 종래 기술에 의한 은이 부착된 리드핀의 제조방법을 나타내는 설명도이다.3 is an explanatory diagram showing a method for manufacturing a lead pin with silver according to the prior art.
1---헤딩리드핀 2---구멍1 --- Heading Lead Pin 2 --- Hole
3---카본지그 4---헤드부3 --- carbon jig 4 --- head
5---은조각 6---카본지그최상단5 --- silver piece 6 --- carbon jig top
7---카본지그커버7 --- Carbon Jig Cover
이하, 본 발명에 대해 상세히 설명하면 다음과 같다.Hereinafter, the present invention will be described in detail.
본 발명은 헤딩 리드핀(1)의 제조에 있어서, 헤딩 리드핀(1) 형상의 구멍(2)을 갖는 카본 지그(3)에 헤딩 리드핀을 삽입고정하고, 상기 헤딩 리드 핀의 헤드부(4) 위에 은조각(5)을 올려 놓고, 상기 은조각의 높이가 카본지그의 최상단(6) 높이를 초과하지 않도록 하고, 상기 카본 지그(3)의 선단에 카본지그 커버(7)를 덮고, 이어서 용융로 중에 인가하여 질소가스와 수소가스를 혼합하여 용융하여 은을 리드핀의 헤드부에 접착시키는 것을 특징으로 하는 은이 부착된 헤딩 리드핀의 제조방법이다.In the present invention, in the manufacture of the heading lead pin 1, the heading lead pin is inserted into the carbon jig 3 having the hole 2 in the shape of the heading lead pin 1, and the head portion of the heading lead pin ( 4) Place a piece of silver (5) on, so that the height of the silver piece does not exceed the height of the upper end (6) of the carbon jig, cover the carbon jig cover (7) on the tip of the carbon jig (3), then A method of manufacturing a headed lead pin with silver, which is applied in a melting furnace to mix and melt nitrogen gas and hydrogen gas to bond silver to a head portion of the lead pin.
이하, 본 발명을 첨부 도면을 참조하여 더욱 상세히 설명하면 다음과 같다.Hereinafter, the present invention will be described in more detail with reference to the accompanying drawings.
도 1은 본 발명에 의한 은이 부착된 헤딩 리드핀의 제조과정중 은을 용융부착하기 직전의 상태도이고, 도 2는 본 발명에 의해 제조된 은이 부착된 헤딩 리드핀의 측면도이다.1 is a state diagram just before melting and attaching silver during the manufacturing process of the headed lead pin with silver according to the present invention, and FIG. 2 is a side view of the headed lead pin with silver manufactured according to the present invention.
본 발명의 헤딩 리드핀(1)의 제조방법은 헤딩 리드핀 형상의 구멍(2)을 갖는 카본 지그(3)에 헤딩 리드핀(1)을 삽입 고정한다. 이때 리드핀(1)의 다리부분(11)의 직경은 약 0.5㎜, 헤드부분(4)의 직경은 약 0.7㎜이며, 상기 헤드부분(4)의 두께는 0.2㎜이다. 이와 같은 리드핀의 크기는 한정되지는 않고 사용용도에 따라 약간씩 차이가 있을 수 있게 된다.In the manufacturing method of the heading lead pin 1 of this invention, the heading lead pin 1 is inserted and fixed to the carbon jig 3 which has the hole 2 of the heading lead pin shape. At this time, the diameter of the leg portion 11 of the lead pin 1 is about 0.5 mm, the diameter of the head portion 4 is about 0.7 mm, the thickness of the head portion 4 is 0.2 mm. The size of the lead pin is not limited and may vary slightly depending on the intended use.
카본 지그(3)는 삽입 고정하게 되는 헤딩 리드핀(1)의 크기에 알맞도록 제작한다. 상기 카본 지그(3)에 형성되는 리드 고정 구멍(2)이 너무 큰 경우에는 상기 리드핀(1)의 고정이 곤란하다. 또한 헤드부분(4)의 삽입부(12)는 상기의 크기를 감안하여 고정구멍(2)을 형성하되 직경이 너무 큰 경우에는 용융된 은이 리드핀(1)의 헤드부분(4)을 넘쳐 흘러 헤드 에지부분을 초과하여 흐르게 되는 경우가 있으므로 되도록 이면 리드핀(1)의 크기에 정확하도록 형성된다.The carbon jig 3 is manufactured to fit the size of the heading lead pin 1 to be inserted and fixed. When the lead fixing hole 2 formed in the carbon jig 3 is too large, it is difficult to fix the lead pin 1. In addition, the insertion part 12 of the head part 4 forms the fixing hole 2 in view of the above-mentioned size, but when the diameter is too large, molten silver flows over the head part 4 of the lead pin 1. Since it may flow beyond the head edge part, it is formed so that it may be correct to the size of the lead pin 1 as much as possible.
또한 상기 카본지그(3)의 리드핀 헤드부의 구멍(12) 깊이는 용융 부착하게 되는 은조각(5)을 올려 놓았을 경우 카본 지그(3)의 최선단(6)의 높이를 벋어나지 않도록 형성된다. 용융하게 되는 은조각(5)이 카본 지그 커버(7)에 접촉하게 되면 용융시 매끄러운 표면을 갖는 은 부착형상이 얻어지지 못한다.In addition, the depth of the hole 12 of the lead pin head portion of the carbon jig 3 is formed so as not to deviate the height of the top end 6 of the carbon jig 3 when the silver piece 5 to be melted is placed thereon. do. When the silver pieces 5 to be melted are brought into contact with the carbon jig cover 7, a silver adhesion shape having a smooth surface upon melting cannot be obtained.
이어서, 상기 카본지그(3)의 리드핀 고정 구멍(2)에 헤딩 리드핀(1)을 삽입고정한 다음 상기 헤딩 리드핀(1)의 헤드부분(4) 위에 은조각(5)을 올려놓되, 상기 은조각(5)의 높이가 카본지그(3)의 최상단(6) 높이를 초과하지 않도록 하고, 상기 카본 지그(3)의 위에 카본지그 커버(7)를 덮는다.Subsequently, the heading lead pin 1 is inserted into the lead pin fixing hole 2 of the carbon jig 3, and then a silver piece 5 is placed on the head portion 4 of the heading lead pin 1. The height of the silver pieces 5 does not exceed the height of the upper end 6 of the carbon jig 3, and covers the carbon jig cover 7 on the carbon jig 3.
이어서 상기 카본 지그 커버(7)가 올려진 카본지그(3)를 용융로 중에 인가하여 질소가스와 수소가스를 혼합하여 용융하여 은을 리드핀(1)의 헤드부분(5)에 접착시켜 은이 부착된 헤딩리드핀(1)을 제조한다.Subsequently, the carbon jig 3 on which the carbon jig cover 7 is mounted is applied to the melting furnace to mix and melt nitrogen gas and hydrogen gas, thereby adhering the silver to the head portion 5 of the lead pin 1 to which silver is attached. The heading lead pin 1 is manufactured.
상기 본 발명에서와 같이 카본 지그 커버(7)를 덮어서 용융시키는 경우 은이 직접 열을 받지 않기 때문에 종래 기술에서 발생하는 은과 리드핀의 변색이 방지되게 되며 또한 용융시 질소가스와 수소가스를 혼합하여 용융시키므로써 최종 얻어지게 되는 은의 용융표면이 매끄럽고 광택성이 양호하게 얻어진다.In the case of melting and covering the carbon jig cover 7 as in the present invention, since silver does not receive heat directly, discoloration of silver and lead pins generated in the prior art is prevented, and when nitrogen and hydrogen gas are mixed during melting, By melting, the molten surface of the finally obtained silver is smooth and glossiness is obtained satisfactorily.
본 발명에 의한 제조방법에 의하면 은의 용융된 헤드부분의 형상이 매우 매끄럽고 광택성이 있으며 은과 헤딩리드핀의 색상이 변색되지 않고, 은중에 기포가 형성되지 않는 효과를 나타냈다.According to the manufacturing method according to the present invention, the shape of the molten head portion of the silver was very smooth and glossy, and the color of the silver and the heading pin was not discolored, and bubbles were not formed in the silver.
Claims (1)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1019990016305A KR19990064755A (en) | 1999-05-07 | 1999-05-07 | Process for preparing heading lead pin with silver solder |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1019990016305A KR19990064755A (en) | 1999-05-07 | 1999-05-07 | Process for preparing heading lead pin with silver solder |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR19990064755A true KR19990064755A (en) | 1999-08-05 |
Family
ID=54776104
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1019990016305A KR19990064755A (en) | 1999-05-07 | 1999-05-07 | Process for preparing heading lead pin with silver solder |
Country Status (1)
| Country | Link |
|---|---|
| KR (1) | KR19990064755A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5830148A (en) * | 1981-08-17 | 1983-02-22 | Tanaka Kikinzoku Kogyo Kk | Manufacture of lead pin for integrated circuit device |
| JPS6152981A (en) * | 1984-08-23 | 1986-03-15 | Nec Kansai Ltd | Brazing |
| JPS62124072A (en) * | 1985-11-20 | 1987-06-05 | Sumitomo Electric Ind Ltd | Jig for fitting brazing filler material to top part of lead pin |
| JPH03159265A (en) * | 1989-11-17 | 1991-07-09 | Toshiba Corp | Lead pin brazing method and jig |
-
1999
- 1999-05-07 KR KR1019990016305A patent/KR19990064755A/en not_active Application Discontinuation
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5830148A (en) * | 1981-08-17 | 1983-02-22 | Tanaka Kikinzoku Kogyo Kk | Manufacture of lead pin for integrated circuit device |
| JPS6152981A (en) * | 1984-08-23 | 1986-03-15 | Nec Kansai Ltd | Brazing |
| JPS62124072A (en) * | 1985-11-20 | 1987-06-05 | Sumitomo Electric Ind Ltd | Jig for fitting brazing filler material to top part of lead pin |
| JPH03159265A (en) * | 1989-11-17 | 1991-07-09 | Toshiba Corp | Lead pin brazing method and jig |
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