JPH0951160A - Brazing method of electronic component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide the method which makes it possible to braze a small object such as the terminal of an electronic component quickly and simply. SOLUTION: At first, powder-state brazing material 14 is inputted into a hole 12 provided in the surface of a printed board 10. Then, a terminal 16 of an electronic component is inserted into the hole 12, filled with the brazing material 14, and the brazing material 14 is indiated with laser light. Thus, the brazing material 14 is melted, so that the terminal 16 is brazed to a conducting pattern 10b of the printed board 10.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for connecting electronic parts to a substrate quickly and easily.

[0002]

2. Description of the Related Art Conventionally, when a terminal of an electronic component such as an IC is connected to a printed circuit board, solder which is a kind of brazing material is used and the terminal is soldered to a conductive pattern of the printed circuit board. . In soldering, an electronic component is placed on a substrate, massive solder is set in the vicinity of the terminal of the electronic component, and the solder is heated by a soldering iron or the like to perform soldering.

[0003]

By the way, since the terminals of electronic parts are very small, when soldering, a small amount of solder is supplied, and a minute portion to be soldered is locally heated. Must. However, in the conventional method, since lumped solder is used, it is difficult to supply a small amount of solder, and it is difficult to heat a minute portion, so that soldering cannot be performed quickly and easily. .

Therefore, an object of the present invention is to provide a method capable of brazing a small object such as a terminal of an electronic component quickly and easily.

[0005]

According to a first aspect of the invention, there is provided a method for brazing an electronic component, wherein the substrate is provided with a hole into which a brazing object such as a terminal of the electronic component is inserted.
It is possible to braze the brazing object by putting a powdery or pasty brazing material and a brazing object into the holes and irradiating laser light to melt the powdery brazing material. Characterize.

The invention according to claim 2 is the brazing method according to claim 1, wherein the brazing material contains a flux component.

[0007]

BEST MODE FOR CARRYING OUT THE INVENTION The brazing material used in the method of claim 1 is in the form of powder or paste,
It has fluidity. Therefore, a small amount of brazing material can be easily injected into the small holes provided in the substrate. Also, since heating is performed using laser light,
A minute portion can be easily heated. Moreover, in the present invention, since the brazing filler metal is put in the holes provided in the substrate, even if the brazing filler metal is irradiated with a laser, the powder or paste type brazing filler metal does not scatter, and there is no problem. Brazing can be done. Therefore, it becomes possible to quickly and easily braze an object such as a terminal of an electronic component.

Any type of laser light may be used as long as it can melt the brazing material, but far infrared laser light is preferable. Here, the material of the brazing material is not particularly limited as long as it is melted by irradiation of laser light and exhibits a brazing action, and specifically, for example, Zn or Sn powder, or these The powder obtained by kneading the above powder into a paste can be used. In addition, it is preferable to use a paste-like brazing material because the work of injecting the brazing material into the holes becomes easier than that of a powdery one.

Further, as described in claim 2, it is more preferable that the brazing material contains a flux component because the brazing performance is improved. As the flux, for example, rosin or resin can be used.

[0010]

An embodiment of the present invention will be described below with reference to the drawings. In the brazing method of the present embodiment, as shown in FIG.
As shown in (A), first, a powdery brazing material 14 is put into the holes 12 provided in the surface of the printed circuit board 10. Here, the printed circuit board 10 is a board 1 made of an insulating material.
The conductive pattern 10b made of a conductive material such as copper is formed on the surface of the hole 0a, and the inner surface of the hole 12 is also
It is covered with the conductive pattern 10b. The brazing material 14 is a mixture of Zn powder, Sn powder, and resin powder as a flux.

Next, as shown in FIG. 1 (B), the brazing material 1
The terminal 16 of the electronic component is inserted into the hole 12 in which the brazing material 4 is inserted, and the brazing material 14 is irradiated with laser light. As a result, the brazing material 14 is melted, and the terminals 16 become conductive patterns 10.
brazed to b. In the method as described above, since the powdery brazing filler metal 14 is used, a small amount of brazing filler metal 14 is used.
Can be easily supplied. Further, since heating is performed using laser light, it is possible to easily heat a minute portion. Moreover, since the brazing filler metal 14 is put in the hole 12, the brazing filler metal 14 does not scatter even if the powdery brazing filler metal 14 is irradiated with laser, and brazing can be performed without any problem. Therefore, the terminal 1 of the electronic component
It becomes possible to braze a very small object as in No. 6 quickly and simply, and the productivity of the substrate is dramatically improved.

Although the embodiments have been described above, the present invention is not limited to the above embodiments, but can be implemented in various modes. For example, in the above embodiment, the powdered brazing material 1
Although No. 4 was used, it is preferable to knead the brazing filler metal 14 into a paste and then inject it into the hole 12 because the injection work becomes easier.

Further, in the above embodiment, the inner surface of the hole 12 is provided with the conductive pattern 10 in order to ensure the brazing.
The inner surface of the hole 12 is covered with the conductive pattern 10b.
1B, the brazing material 14 rises up on the surface of the printed circuit board 10 and contacts the conductive pattern 10b on the surface of the printed circuit board, so that brazing can be performed without any problem. .

[Brief description of drawings]

FIG. 1 is a cross-sectional view showing a brazing method of an embodiment.

[Explanation of symbols]

 10 ... Printed circuit board 12 ... Hole 14 ... Brazing material 16 ... Terminal

Claims (2)

[Claims] 1. A substrate is provided with a hole into which an object to be brazed, such as a terminal of an electronic component, is inserted, and a powder or paste-like brazing material and the object to be brazed are put into the hole, and laser light is applied. A brazing method for an electronic component, characterized in that the object to be brazed is brazed by irradiating the brazing material to melt the powdery brazing material. 2. The brazing method for an electronic component according to claim 1, wherein the brazing material contains a flux component.