JPS62124072A - Jig for fitting brazing filler material to top part of lead pin - Google Patents

Jig for fitting brazing filler material to top part of lead pin

Info

Publication number
JPS62124072A
JPS62124072A JP26357685A JP26357685A JPS62124072A JP S62124072 A JPS62124072 A JP S62124072A JP 26357685 A JP26357685 A JP 26357685A JP 26357685 A JP26357685 A JP 26357685A JP S62124072 A JPS62124072 A JP S62124072A
Authority
JP
Japan
Prior art keywords
lead pin
jig
hole
carbon
lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP26357685A
Other languages
Japanese (ja)
Inventor
Yoshie Taguchi
田口 吉衛
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Electric Industries Ltd
Original Assignee
Sumitomo Electric Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Electric Industries Ltd filed Critical Sumitomo Electric Industries Ltd
Priority to JP26357685A priority Critical patent/JPS62124072A/en
Publication of JPS62124072A publication Critical patent/JPS62124072A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE:To prevent a defective lead pin from being generated due to the sticking of carbon, and also to realize the long life of a jig by providing a ceramic coating layer on the whole surface containing the inner surface of a holding hole of a carbon base plate provided with a vertical lead pin holding hole. CONSTITUTION:A through vertical lead pin holding hole 2 constituted of the lower hole 2a for receiving the leg part (b) of a lead pin R, and the upper hole 2b for receiving the head part of the lead pin R is provided on a base plate 1 whose materials is carbon. A ceramic coating layer 3 is provided on the whole surface of the base plate 1 containing the inner surface of this hole 2. In this way, it is prevented that carbon powder sticks to the lead pin R and a brazing filler material.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 この発明は、集積回路装置のセラミックス基板等に鑞付
けする通電用リードピンの鑞付は面に、鑞付を加熱溶融
して取付ける際に、リードピンを垂直な姿勢に保持する
リードピン頂部への鑞付取付は治具に関する。
[Detailed Description of the Invention] [Field of Industrial Application] This invention provides a method for attaching a current-carrying lead pin to a ceramic substrate of an integrated circuit device by heating and melting the solder on the surface. The brazing attachment to the top of the lead pin that holds the lead pin in a vertical position involves a jig.

〔従来の技術〕[Conventional technology]

コパールヤ、鉄−ニッケル合金等によって形成されるリ
ードビンの鑞付は面となる頂部に、銀鑞を取付ける場合
、作業の高能率化を目的として、基板に多数のリードピ
ン保持穴を設けた治具が使用される。この治具のリード
ピン保持穴は、リードビンの形状に合わせて適宜設計変
更されるが、リードピンの保持は、いずれもそのビンが
垂直向きとなるように行われる。例えば、第5図に示す
ように、大径頭部aを備えた釘状リードビンRへの鑞付
取付けでは、基板1に、リードビンRの頭部直径より小
さく、脚部すの長さよりも長い下穴2aと頭部直径より
も大きな径で頭部高さと同等もしくはそれよりも深い上
穴2bとを組合せる等したリードピン保持穴2を設け、
この穴番こ’)−ドビンを垂直に懸垂する。そして、保
持されたり一ドビンの頭頂部に銀鑞チップCを載せ、治
具ごと電気加熱炉に入れて銀鑞の融点以上の温度への加
熱によりチップCをリードピンに融着させている。
When attaching silver solder to the top surface of lead pins made of copper alloy, iron-nickel alloy, etc., a jig with many lead pin holding holes in the board is used to increase work efficiency. used. The design of the lead pin holding hole of this jig is appropriately changed according to the shape of the lead bin, but the lead pin is held in such a way that the bin is oriented vertically. For example, as shown in FIG. 5, when mounting a nail-shaped lead bin R with a large-diameter head a by brazing, the base plate 1 has a diameter smaller than the head diameter of the lead bin R and a length longer than the leg length. A lead pin holding hole 2 is provided, such as by combining a pilot hole 2a and an upper hole 2b with a diameter larger than the head diameter and a depth equal to or deeper than the head height,
Suspend the dobbin vertically through this hole. Then, the silver solder chip C is placed on the top of the head of the held dobbin, and the jig is placed in an electric heating furnace and the chip C is fused to the lead pin by heating to a temperature higher than the melting point of the silver solder.

この方法によれば、治具は高温に晒されるため、耐熱性
が要求され、従って、その要求に応えられるものとして
、基板1の材料にはカーボンやセラミックスが使用され
ている。
According to this method, the jig is exposed to high temperatures and is therefore required to have heat resistance. Therefore, carbon or ceramics is used as the material for the substrate 1 to meet this requirement.

〔発明が解決しようとする問題点〕[Problem that the invention seeks to solve]

ところが、カーボン製治具の場合、リードビン挿入時に
、表面にもともと付着しているカーボン粉や、リードピ
ンの接触によって新たに削り出されたカーボン粉が、リ
ードピンや銀壜チップに付着し、加熱により溶融したチ
ップに喰込んだり、リードビンに焼きついたりして取れ
なくなることがある。このような事態が生じると、リー
ドピンは不良品と認定されるので、鑞付取付は後のピン
を1本1本顕微鏡検査しなければならず、生産性向上の
大きなネックとなるばかりか、不良品の検査、111れ
の可能性も生じてくる。
However, in the case of carbon jigs, when the lead bin is inserted, carbon powder that originally adheres to the surface or carbon powder that is newly shaved off by contact with the lead pins adheres to the lead pins and silver bottle chips and melts due to heating. It may get stuck in the chip or burnt into the lead bin, making it impossible to remove it. If such a situation occurs, the lead pin will be recognized as a defective product, and each pin after soldering must be inspected under a microscope, which not only becomes a major bottleneck in improving productivity, but also leads to defects. Inspection of non-defective products also raises the possibility of 111 failure.

また、銀鑞付を融着させる温度は800〜950℃と非
常に高いため、カーボン治具は酸化消耗し、250〜;
300回の使用で寿命に至ると云う問題もある。
In addition, since the temperature at which silver brazing is fused is extremely high at 800 to 950°C, the carbon jig is oxidized and consumed, resulting in temperatures ranging from 250°C to 950°C.
There is also the problem that it reaches the end of its life after 300 uses.

一方、セラミックス製治具の場合、取扱いミスによる衝
撃で破損しない限り、半永久的に使用できる利点はある
もの\、基板の全体に精度良く穴あけすることが困難な
ため、工業面での実用性に欠ける。
On the other hand, ceramic jigs have the advantage of being able to be used semi-permanently as long as they are not damaged by impact due to mishandling. Missing.

この発明は、これ等の問題を総括して解消すること、即
ち、カーボンの付着による不良リードピンの発生が無く
、また、治具自体も長寿命を維持できるようにすること
を目的としている。
The present invention aims to solve all of these problems, that is, to eliminate the occurrence of defective lead pins due to carbon adhesion, and to enable the jig itself to maintain a long life.

〔問題点を解決するための手段〕[Means for solving problems]

この発明の冶具は、垂直なリードピン保持穴を設けたカ
ーボン基板の上記保持穴内面を含む全表面に、セラミッ
クコーティング層を設けて成る。
The jig of the present invention includes a carbon substrate provided with vertical lead pin holding holes, and a ceramic coating layer provided on the entire surface including the inner surface of the holding holes.

二〇治具は、耐衝撃性の良いカーボン基板に、予め高精
度の穴を加工でき、また、穴加工後に表面のセラミック
コーティング層を設けることにより、カーボン粉の発生
並びに加熱による酸化消耗も無くすことができる。
Jig No. 20 can pre-drill high-precision holes in a carbon substrate with good impact resistance, and by providing a ceramic coating layer on the surface after drilling, it eliminates the generation of carbon powder and oxidation wear due to heating. be able to.

〔実施例〕〔Example〕

第1図乃至第4図のこの発明の実施例を示す。 Embodiments of the invention are shown in FIGS. 1-4.

第1図の治具は、カーボンを材料とした基板1に、第5
図のそれと同様の保持穴、即ち、リードビンRの脚部す
を受は入れる下穴2aとそれよりも大径でリードビンの
頭部を受は入れる上穴2bとで構成される貫通した垂直
なリードピン保持穴2を設け、その後に、穴2の内面を
含む基板1の全表面(こセラミックコーティング層3を
設けたものである。
The jig shown in FIG. 1 has a fifth
A holding hole similar to that shown in the figure, that is, a perpendicular through-hole consisting of a lower hole 2a for receiving the leg of the lead bin R and an upper hole 2b with a larger diameter for receiving the head of the lead bin. A lead pin holding hole 2 is provided, and then a ceramic coating layer 3 is provided on the entire surface of the substrate 1 including the inner surface of the hole 2.

リードピン(呆持穴2は、下穴2aの長さをり一ドピン
の脚部すの長さとは一゛等しくすれば、第2図Oこ示す
ような盲穴としてもよい。また、盲穴の場合、全体がリ
ードピンの頭部径よりも僅かに大きな段差無しの穴とす
ることができる(第3図)。
The lead pin holding hole 2 may be a blind hole as shown in Figure 2 O, as long as the length of the pilot hole 2a is equal to the length of the leg of the lead pin.Also, in the case of a blind hole , the entire hole can be made into a step-free hole that is slightly larger than the head diameter of the lead pin (FIG. 3).

要は、リードピンを、少なくともその頭部が穴内に没入
する状態番こして垂直に保持し得る大きさ・形状であれ
ばよい。
In short, any size and shape may be used as long as the lead pin can be held vertically with at least its head recessed into the hole.

また、層3を形成するセラミックスとしては、513N
4、AQ、N、 BNXT i N等の窒化物、SiC
Further, as the ceramic forming layer 3, 513N
4. Nitride such as AQ, N, BNXT i N, SiC
.

TiC等の炭化物、或いはS i02、AQ、20・−
3ス、TlO2,5iZnO4、MnO2、Cr2O2
と云った酸化物が挙げられる。
Carbide such as TiC, or Si02, AQ, 20・-
3S, TlO2, 5iZnO4, MnO2, Cr2O2
Examples include oxides such as

第4図は、上述した如き保持穴2を、基板に多It ’
32けたこの発明の治具の全体図を示している。
FIG.
An overall view of the 32-digit jig of the invention is shown.

なお、セラミックコーティング層3は、治具表面のカー
ボン粉による汚れを無くすため、穴加工した基板を、例
えば、トリクレン、トリエタン等の有機溶剤で脱脂洗滌
し、乾燥後クリーンエアで座弁を除くと云った浄化工程
に回した後に形成するのがよい。
The ceramic coating layer 3 can be formed by degreasing and cleaning the holed board with an organic solvent such as trichlene or triethane, and then removing the seat valve with clean air after drying in order to eliminate dirt caused by carbon powder on the surface of the jig. It is best to form it after going through the purification process mentioned above.

〔効 果〕〔effect〕

以上述べたように、この発明の鑞付取付は治具は、リー
ドピン保持穴を有するカーボン基板の全表面にセラミッ
クコーティング層を設けであるので、リードビン及び鑞
付に対するカーボン粉の付着を完全に無くし得る。
As mentioned above, since the brazing installation jig of the present invention is provided with a ceramic coating layer on the entire surface of the carbon substrate having lead pin holding holes, it completely eliminates the adhesion of carbon powder to the lead bin and brazing. obtain.

また、基板の主材はカーボンであるので、高精度の穴を
容易に加工できるし、耐衝撃性にも優れる。一方、表面
はセラミックスであるため、セラミックス単体の治具と
同等の耐酸化性が得られ、従って、加熱による酸化消耗
は殆んどなく、半永久的な使用に耐える。
Furthermore, since the main material of the substrate is carbon, it is easy to form holes with high precision and has excellent impact resistance. On the other hand, since the surface is made of ceramic, it has the same oxidation resistance as a jig made of ceramic alone, so there is almost no oxidative wear due to heating, and it can be used semi-permanently.

【図面の簡単な説明】[Brief explanation of drawings]

第1図乃至第3図はいずれもこの発明の冶具の要部を示
す断面図、第4図は全体の外観図、第5図は従来治具の
要部を示す断面図である。 1・・・基板、2・・リードピン保持穴、3・・・セラ
ミツクコーティング層
1 to 3 are sectional views showing the main parts of the jig of the present invention, FIG. 4 is an overall external view, and FIG. 5 is a sectional view showing the main parts of the conventional jig. 1...Substrate, 2...Lead pin holding hole, 3...Ceramic coating layer

Claims (1)

【特許請求の範囲】[Claims] 垂直なリードピン保持穴を設けたカーボン基板の上記保
持穴内面を含む全表面に、セラミックコーティング層を
設けて成るリードピン頂部への鑞付取付け治具。
A brazing attachment jig for the top of a lead pin, which is made of a carbon substrate with a vertical lead pin holding hole provided with a ceramic coating layer on the entire surface including the inner surface of the holding hole.
JP26357685A 1985-11-20 1985-11-20 Jig for fitting brazing filler material to top part of lead pin Pending JPS62124072A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP26357685A JPS62124072A (en) 1985-11-20 1985-11-20 Jig for fitting brazing filler material to top part of lead pin

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP26357685A JPS62124072A (en) 1985-11-20 1985-11-20 Jig for fitting brazing filler material to top part of lead pin

Publications (1)

Publication Number Publication Date
JPS62124072A true JPS62124072A (en) 1987-06-05

Family

ID=17391471

Family Applications (1)

Application Number Title Priority Date Filing Date
JP26357685A Pending JPS62124072A (en) 1985-11-20 1985-11-20 Jig for fitting brazing filler material to top part of lead pin

Country Status (1)

Country Link
JP (1) JPS62124072A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR19990064755A (en) * 1999-05-07 1999-08-05 홍성결 Process for preparing heading lead pin with silver solder

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR19990064755A (en) * 1999-05-07 1999-08-05 홍성결 Process for preparing heading lead pin with silver solder

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