KR102893346B1 - 표시 장치 - Google Patents
표시 장치Info
- Publication number
- KR102893346B1 KR102893346B1 KR1020227015297A KR20227015297A KR102893346B1 KR 102893346 B1 KR102893346 B1 KR 102893346B1 KR 1020227015297 A KR1020227015297 A KR 1020227015297A KR 20227015297 A KR20227015297 A KR 20227015297A KR 102893346 B1 KR102893346 B1 KR 102893346B1
- Authority
- KR
- South Korea
- Prior art keywords
- light
- module substrate
- display device
- substrate
- module
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H29/00—Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
- H10H29/30—Active-matrix LED displays
- H10H29/45—Active-matrix LED displays comprising two substrates, each having active devices thereon, e.g. displays comprising LED arrays and driving circuitry on different substrates
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H29/00—Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
- H10H29/10—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00
- H10H29/14—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00 comprising multiple light-emitting semiconductor components
- H10H29/142—Two-dimensional arrangements, e.g. asymmetric LED layout
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
-
- H01L25/0753—
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/01—Manufacture or treatment
- H10D86/021—Manufacture or treatment of multiple TFTs
- H10D86/0212—Manufacture or treatment of multiple TFTs comprising manufacture, treatment or coating of substrates
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
- H10D86/411—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs characterised by materials, geometry or structure of the substrates
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
- H10D86/441—Interconnections, e.g. scanning lines
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/8506—Containers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H29/00—Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
- H10H29/30—Active-matrix LED displays
- H10H29/49—Interconnections, e.g. wiring lines or terminals
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/01—Manufacture or treatment
- H10H20/036—Manufacture or treatment of packages
- H10H20/0364—Manufacture or treatment of packages of interconnections
Landscapes
- Led Device Packages (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201962942567P | 2019-12-02 | 2019-12-02 | |
| US62/942,567 | 2019-12-02 | ||
| US17/108,981 US11664355B2 (en) | 2019-12-02 | 2020-12-01 | Display apparatus |
| US17/108,981 | 2020-12-01 | ||
| PCT/KR2020/017453 WO2021112555A1 (ko) | 2019-12-02 | 2020-12-02 | 표시 장치 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20220110184A KR20220110184A (ko) | 2022-08-05 |
| KR102893346B1 true KR102893346B1 (ko) | 2025-12-01 |
Family
ID=76090959
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020227015297A Active KR102893346B1 (ko) | 2019-12-02 | 2020-12-02 | 표시 장치 |
Country Status (6)
| Country | Link |
|---|---|
| US (3) | US11664355B2 (https=) |
| EP (1) | EP4064261A4 (https=) |
| JP (1) | JP7670712B2 (https=) |
| KR (1) | KR102893346B1 (https=) |
| CN (2) | CN114762027B (https=) |
| WO (1) | WO2021112555A1 (https=) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11664355B2 (en) * | 2019-12-02 | 2023-05-30 | Seoul Semiconductor Co., Ltd. | Display apparatus |
| TWI705562B (zh) * | 2019-12-13 | 2020-09-21 | 國立中興大學 | 大面積被動式微發光二極體陣列顯示器 |
| CN119695026A (zh) * | 2019-12-20 | 2025-03-25 | 群创光电股份有限公司 | 电子装置 |
| CN115731812A (zh) * | 2021-09-02 | 2023-03-03 | 深圳市洲明科技股份有限公司 | 发光二极管显示面板及显示装置 |
| EP4379802A4 (en) * | 2021-12-02 | 2024-12-25 | Samsung Electronics Co., Ltd. | DISPLAY MODULE AND DISPLAY DEVICE THEREFOR |
| US20230215848A1 (en) * | 2022-01-03 | 2023-07-06 | Seoul Semiconductor Co., Ltd. | Light emitting device |
| WO2023183578A1 (en) | 2022-03-25 | 2023-09-28 | Lumileds Llc | Cluster of lighting devices, display and method of manufacture |
| CN119790452A (zh) | 2022-06-24 | 2025-04-08 | 亮锐有限责任公司 | 用于电动车辆的柔性三维显示器组件 |
| JP2025125021A (ja) * | 2024-02-15 | 2025-08-27 | 三星電子株式会社 | ＬＥＤ表示装置用Ｔｉｌｉｎｇ基板 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2018087927A (ja) * | 2016-11-29 | 2018-06-07 | Ｉｔｓ合同会社 | Ｌｅｄディスプレイ装置 |
| US20190012956A1 (en) | 2017-07-04 | 2019-01-10 | PlayNitride Inc. | Light emitting module and display device |
| JP2019016766A (ja) | 2017-04-28 | 2019-01-31 | 日亜化学工業株式会社 | 発光装置 |
Family Cites Families (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4078830B2 (ja) * | 2001-11-29 | 2008-04-23 | ソニー株式会社 | 表示装置及び表示装置の製造方法 |
| JP4032716B2 (ja) * | 2001-11-29 | 2008-01-16 | ソニー株式会社 | 半導体装置の製造方法 |
| KR100715457B1 (ko) * | 2005-12-30 | 2007-05-07 | 서울반도체 주식회사 | 발광 다이오드 실장용 인쇄회로기판 제조방법 및 발광다이오드 패키지 |
| JP5354997B2 (ja) * | 2008-08-29 | 2013-11-27 | 京セラ株式会社 | 発光装置用基板、発光装置用基板を用いた発光装置及び発光装置を用いた照明装置 |
| JP5970865B2 (ja) | 2012-03-05 | 2016-08-17 | 大日本印刷株式会社 | 薄膜素子用基板、薄膜素子、有機エレクトロルミネッセンス表示装置、および電子ペーパー |
| CN202816322U (zh) | 2012-09-19 | 2013-03-20 | 深圳市柔宇科技有限公司 | 一种显示屏 |
| JP6084027B2 (ja) | 2012-12-20 | 2017-02-22 | 新光電気工業株式会社 | 光導波路装置及びその製造方法 |
| US9799719B2 (en) * | 2014-09-25 | 2017-10-24 | X-Celeprint Limited | Active-matrix touchscreen |
| KR20170050365A (ko) | 2015-10-30 | 2017-05-11 | 엘지디스플레이 주식회사 | 유기 발광 표시 장치 |
| JP6762793B2 (ja) * | 2016-07-29 | 2020-09-30 | 株式会社ジャパンディスプレイ | 電子機器及びその製造方法 |
| US10468391B2 (en) * | 2017-02-08 | 2019-11-05 | X-Celeprint Limited | Inorganic light-emitting-diode displays with multi-ILED pixels |
| WO2018169243A1 (ko) | 2017-03-13 | 2018-09-20 | 서울반도체주식회사 | 디스플레이 장치 제조 방법 |
| KR102514755B1 (ko) * | 2017-07-10 | 2023-03-29 | 삼성전자주식회사 | 마이크로 엘이디 디스플레이 및 그 제작 방법 |
| US10615321B2 (en) * | 2017-08-21 | 2020-04-07 | Seoul Semiconductor Co., Ltd. | Light emitting device package |
| CN111048656B (zh) * | 2017-09-04 | 2024-06-14 | 首尔半导体株式会社 | 显示装置及该显示装置的制造方法 |
| DE102017123290A1 (de) * | 2017-10-06 | 2019-04-11 | Osram Opto Semiconductors Gmbh | Lichtemittierendes Bauteil, Anzeigevorrichtung und Verfahren zur Herstellung einer Anzeigevorrichtung |
| US11282981B2 (en) * | 2017-11-27 | 2022-03-22 | Seoul Viosys Co., Ltd. | Passivation covered light emitting unit stack |
| US20210013099A1 (en) * | 2019-07-10 | 2021-01-14 | Facebook Technologies, Llc | Reducing the planarity variation in a display device |
| KR102850607B1 (ko) | 2019-07-25 | 2025-08-27 | 삼성전자주식회사 | Led 패키지를 구비한 디스플레이 모듈 및 그 제조 방법 |
| US11398462B2 (en) * | 2019-09-18 | 2022-07-26 | Seoul Viosys Co., Ltd. | Light emitting device for display and light emitting package having the same |
| US11621173B2 (en) * | 2019-11-19 | 2023-04-04 | Lumileds Llc | Fan out structure for light-emitting diode (LED) device and lighting system |
| US11664355B2 (en) * | 2019-12-02 | 2023-05-30 | Seoul Semiconductor Co., Ltd. | Display apparatus |
| US11881473B2 (en) * | 2020-01-09 | 2024-01-23 | Seoul Semiconductor Co., Ltd. | Display apparatus |
-
2020
- 2020-12-01 US US17/108,981 patent/US11664355B2/en active Active
- 2020-12-02 CN CN202080083289.1A patent/CN114762027B/zh active Active
- 2020-12-02 CN CN202022891182.XU patent/CN213519057U/zh active Active
- 2020-12-02 JP JP2022533189A patent/JP7670712B2/ja active Active
- 2020-12-02 EP EP20896330.6A patent/EP4064261A4/en active Pending
- 2020-12-02 KR KR1020227015297A patent/KR102893346B1/ko active Active
- 2020-12-02 WO PCT/KR2020/017453 patent/WO2021112555A1/ko not_active Ceased
-
2023
- 2023-04-16 US US18/135,178 patent/US12218111B2/en active Active
-
2025
- 2025-01-17 US US19/029,128 patent/US20250174608A1/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2018087927A (ja) * | 2016-11-29 | 2018-06-07 | Ｉｔｓ合同会社 | Ｌｅｄディスプレイ装置 |
| JP2019016766A (ja) | 2017-04-28 | 2019-01-31 | 日亜化学工業株式会社 | 発光装置 |
| US20190012956A1 (en) | 2017-07-04 | 2019-01-10 | PlayNitride Inc. | Light emitting module and display device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN114762027A (zh) | 2022-07-15 |
| JP7670712B2 (ja) | 2025-04-30 |
| WO2021112555A1 (ko) | 2021-06-10 |
| KR20220110184A (ko) | 2022-08-05 |
| EP4064261A1 (en) | 2022-09-28 |
| CN213519057U (zh) | 2021-06-22 |
| EP4064261A4 (en) | 2023-12-13 |
| CN114762027B (zh) | 2025-06-06 |
| US20250174608A1 (en) | 2025-05-29 |
| JP2023504666A (ja) | 2023-02-06 |
| US20210167047A1 (en) | 2021-06-03 |
| US12218111B2 (en) | 2025-02-04 |
| US11664355B2 (en) | 2023-05-30 |
| US20230268323A1 (en) | 2023-08-24 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PA0105 | International application |
St.27 status event code: A-0-1-A10-A15-nap-PA0105 |
|
| PG1501 | Laying open of application |
St.27 status event code: A-1-1-Q10-Q12-nap-PG1501 |
|
| A201 | Request for examination | ||
| E13-X000 | Pre-grant limitation requested |
St.27 status event code: A-2-3-E10-E13-lim-X000 |
|
| P11-X000 | Amendment of application requested |
St.27 status event code: A-2-2-P10-P11-nap-X000 |
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| P13-X000 | Application amended |
St.27 status event code: A-2-2-P10-P13-nap-X000 |
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| PA0201 | Request for examination |
St.27 status event code: A-1-2-D10-D11-exm-PA0201 |
|
| P22-X000 | Classification modified |
St.27 status event code: A-2-2-P10-P22-nap-X000 |
|
| E902 | Notification of reason for refusal | ||
| PE0902 | Notice of grounds for rejection |
St.27 status event code: A-1-2-D10-D21-exm-PE0902 |
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| E13-X000 | Pre-grant limitation requested |
St.27 status event code: A-2-3-E10-E13-lim-X000 |
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| P11-X000 | Amendment of application requested |
St.27 status event code: A-2-2-P10-P11-nap-X000 |
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| D22 | Grant of ip right intended |
Free format text: ST27 STATUS EVENT CODE: A-1-2-D10-D22-EXM-PE0701 (AS PROVIDED BY THE NATIONAL OFFICE) |
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| Q13 | Ip right document published |
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