JP7670712B2 - 表示装置 - Google Patents

表示装置 Download PDF

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Publication number
JP7670712B2
JP7670712B2 JP2022533189A JP2022533189A JP7670712B2 JP 7670712 B2 JP7670712 B2 JP 7670712B2 JP 2022533189 A JP2022533189 A JP 2022533189A JP 2022533189 A JP2022533189 A JP 2022533189A JP 7670712 B2 JP7670712 B2 JP 7670712B2
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JP
Japan
Prior art keywords
disposed
region
module
display device
light
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JP2022533189A
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English (en)
Japanese (ja)
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JP2023504666A (ja
JP2023504666A5 (https=
Inventor
チュン・フン・イ
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Seoul Semiconductor Co Ltd
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Seoul Semiconductor Co Ltd
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H29/00—Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
    • H10H29/10—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00
    • H10H29/14—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00 comprising multiple light-emitting semiconductor components
    • H10H29/142—Two-dimensional arrangements, e.g. asymmetric LED layout
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H29/00—Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
    • H10H29/30—Active-matrix LED displays
    • H10H29/45—Active-matrix LED displays comprising two substrates, each having active devices thereon, e.g. displays comprising LED arrays and driving circuitry on different substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/01—Manufacture or treatment
    • H10D86/021—Manufacture or treatment of multiple TFTs
    • H10D86/0212—Manufacture or treatment of multiple TFTs comprising manufacture, treatment or coating of substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
    • H10D86/411—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs characterised by materials, geometry or structure of the substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
    • H10D86/441—Interconnections, e.g. scanning lines
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/8506—Containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H29/00—Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
    • H10H29/30—Active-matrix LED displays
    • H10H29/49—Interconnections, e.g. wiring lines or terminals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/036—Manufacture or treatment of packages
    • H10H20/0364—Manufacture or treatment of packages of interconnections

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  • Led Device Packages (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
JP2022533189A 2019-12-02 2020-12-02 表示装置 Active JP7670712B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201962942567P 2019-12-02 2019-12-02
US62/942,567 2019-12-02
US17/108,981 US11664355B2 (en) 2019-12-02 2020-12-01 Display apparatus
US17/108,981 2020-12-01
PCT/KR2020/017453 WO2021112555A1 (ko) 2019-12-02 2020-12-02 표시 장치

Publications (3)

Publication Number Publication Date
JP2023504666A JP2023504666A (ja) 2023-02-06
JP2023504666A5 JP2023504666A5 (https=) 2023-12-12
JP7670712B2 true JP7670712B2 (ja) 2025-04-30

Family

ID=76090959

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022533189A Active JP7670712B2 (ja) 2019-12-02 2020-12-02 表示装置

Country Status (6)

Country Link
US (3) US11664355B2 (https=)
EP (1) EP4064261A4 (https=)
JP (1) JP7670712B2 (https=)
KR (1) KR102893346B1 (https=)
CN (2) CN114762027B (https=)
WO (1) WO2021112555A1 (https=)

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* Cited by examiner, † Cited by third party
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US11664355B2 (en) * 2019-12-02 2023-05-30 Seoul Semiconductor Co., Ltd. Display apparatus
TWI705562B (zh) * 2019-12-13 2020-09-21 國立中興大學 大面積被動式微發光二極體陣列顯示器
CN119695026A (zh) * 2019-12-20 2025-03-25 群创光电股份有限公司 电子装置
CN115731812A (zh) * 2021-09-02 2023-03-03 深圳市洲明科技股份有限公司 发光二极管显示面板及显示装置
EP4379802A4 (en) * 2021-12-02 2024-12-25 Samsung Electronics Co., Ltd. DISPLAY MODULE AND DISPLAY DEVICE THEREFOR
US20230215848A1 (en) * 2022-01-03 2023-07-06 Seoul Semiconductor Co., Ltd. Light emitting device
WO2023183578A1 (en) 2022-03-25 2023-09-28 Lumileds Llc Cluster of lighting devices, display and method of manufacture
CN119790452A (zh) 2022-06-24 2025-04-08 亮锐有限责任公司 用于电动车辆的柔性三维显示器组件
JP2025125021A (ja) * 2024-02-15 2025-08-27 三星電子株式会社 ＬＥＤ表示装置用Ｔｉｌｉｎｇ基板

Citations (2)

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Publication number Priority date Publication date Assignee Title
CN202816322U (zh) 2012-09-19 2013-03-20 深圳市柔宇科技有限公司 一种显示屏
JP2013182853A (ja) 2012-03-05 2013-09-12 Dainippon Printing Co Ltd 薄膜素子用基板、薄膜素子、有機エレクトロルミネッセンス表示装置、および電子ペーパー

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JP4078830B2 (ja) * 2001-11-29 2008-04-23 ソニー株式会社 表示装置及び表示装置の製造方法
JP4032716B2 (ja) * 2001-11-29 2008-01-16 ソニー株式会社 半導体装置の製造方法
KR100715457B1 (ko) * 2005-12-30 2007-05-07 서울반도체 주식회사 발광 다이오드 실장용 인쇄회로기판 제조방법 및 발광다이오드 패키지
JP5354997B2 (ja) * 2008-08-29 2013-11-27 京セラ株式会社 発光装置用基板、発光装置用基板を用いた発光装置及び発光装置を用いた照明装置
JP6084027B2 (ja) 2012-12-20 2017-02-22 新光電気工業株式会社 光導波路装置及びその製造方法
US9799719B2 (en) * 2014-09-25 2017-10-24 X-Celeprint Limited Active-matrix touchscreen
KR20170050365A (ko) 2015-10-30 2017-05-11 엘지디스플레이 주식회사 유기 발광 표시 장치
JP6762793B2 (ja) * 2016-07-29 2020-09-30 株式会社ジャパンディスプレイ 電子機器及びその製造方法
JP6872769B2 (ja) 2016-11-29 2021-05-19 株式会社Ｓｐａｃｅｗａ Ｌｅｄディスプレイ装置
US10468391B2 (en) * 2017-02-08 2019-11-05 X-Celeprint Limited Inorganic light-emitting-diode displays with multi-ILED pixels
WO2018169243A1 (ko) 2017-03-13 2018-09-20 서울반도체주식회사 디스플레이 장치 제조 방법
JP6460201B2 (ja) 2017-04-28 2019-01-30 日亜化学工業株式会社 発光装置
TWI635470B (zh) * 2017-07-04 2018-09-11 PlayNitride Inc. 發光模組及顯示裝置
KR102514755B1 (ko) * 2017-07-10 2023-03-29 삼성전자주식회사 마이크로 엘이디 디스플레이 및 그 제작 방법
US10615321B2 (en) * 2017-08-21 2020-04-07 Seoul Semiconductor Co., Ltd. Light emitting device package
CN111048656B (zh) * 2017-09-04 2024-06-14 首尔半导体株式会社 显示装置及该显示装置的制造方法
DE102017123290A1 (de) * 2017-10-06 2019-04-11 Osram Opto Semiconductors Gmbh Lichtemittierendes Bauteil, Anzeigevorrichtung und Verfahren zur Herstellung einer Anzeigevorrichtung
US11282981B2 (en) * 2017-11-27 2022-03-22 Seoul Viosys Co., Ltd. Passivation covered light emitting unit stack
US20210013099A1 (en) * 2019-07-10 2021-01-14 Facebook Technologies, Llc Reducing the planarity variation in a display device
KR102850607B1 (ko) 2019-07-25 2025-08-27 삼성전자주식회사 Led 패키지를 구비한 디스플레이 모듈 및 그 제조 방법
US11398462B2 (en) * 2019-09-18 2022-07-26 Seoul Viosys Co., Ltd. Light emitting device for display and light emitting package having the same
US11621173B2 (en) * 2019-11-19 2023-04-04 Lumileds Llc Fan out structure for light-emitting diode (LED) device and lighting system
US11664355B2 (en) * 2019-12-02 2023-05-30 Seoul Semiconductor Co., Ltd. Display apparatus
US11881473B2 (en) * 2020-01-09 2024-01-23 Seoul Semiconductor Co., Ltd. Display apparatus

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013182853A (ja) 2012-03-05 2013-09-12 Dainippon Printing Co Ltd 薄膜素子用基板、薄膜素子、有機エレクトロルミネッセンス表示装置、および電子ペーパー
CN202816322U (zh) 2012-09-19 2013-03-20 深圳市柔宇科技有限公司 一种显示屏

Also Published As

Publication number Publication date
CN114762027A (zh) 2022-07-15
WO2021112555A1 (ko) 2021-06-10
KR20220110184A (ko) 2022-08-05
EP4064261A1 (en) 2022-09-28
CN213519057U (zh) 2021-06-22
EP4064261A4 (en) 2023-12-13
CN114762027B (zh) 2025-06-06
US20250174608A1 (en) 2025-05-29
JP2023504666A (ja) 2023-02-06
US20210167047A1 (en) 2021-06-03
US12218111B2 (en) 2025-02-04
KR102893346B1 (ko) 2025-12-01
US11664355B2 (en) 2023-05-30
US20230268323A1 (en) 2023-08-24

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