KR102887414B1 - 필름 형성용 경화성 오가노폴리실록산 조성물 및 오가노폴리실록산 경화물 필름의 제조 방법 - Google Patents

필름 형성용 경화성 오가노폴리실록산 조성물 및 오가노폴리실록산 경화물 필름의 제조 방법

Info

Publication number
KR102887414B1
KR102887414B1 KR1020217020878A KR20217020878A KR102887414B1 KR 102887414 B1 KR102887414 B1 KR 102887414B1 KR 1020217020878 A KR1020217020878 A KR 1020217020878A KR 20217020878 A KR20217020878 A KR 20217020878A KR 102887414 B1 KR102887414 B1 KR 102887414B1
Authority
KR
South Korea
Prior art keywords
film
organopolysiloxane
curing
composition
group
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
KR1020217020878A
Other languages
English (en)
Korean (ko)
Other versions
KR20210112322A (ko
Inventor
히로시 후쿠이
다케아키 츠다
후아 렌
Original Assignee
다우 도레이 캄파니 리미티드
다우 실리콘즈 코포레이션
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 다우 도레이 캄파니 리미티드, 다우 실리콘즈 코포레이션 filed Critical 다우 도레이 캄파니 리미티드
Publication of KR20210112322A publication Critical patent/KR20210112322A/ko
Application granted granted Critical
Publication of KR102887414B1 publication Critical patent/KR102887414B1/ko
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
    • C09D183/04—Polysiloxanes
    • C09D183/08—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen, and oxygen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/06—Preparatory processes
    • C08G77/08—Preparatory processes characterised by the catalysts used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/22—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen
    • C08G77/24—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen halogen-containing groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/01—Hydrocarbons
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/02—Halogenated hydrocarbons
    • C08K5/03—Halogenated hydrocarbons aromatic, e.g. C6H5-CH2-Cl
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/07—Aldehydes; Ketones
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/14—Peroxides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/541—Silicon-containing compounds containing oxygen
    • C08K5/5415—Silicon-containing compounds containing oxygen containing at least one Si—O bond
    • C08K5/5419—Silicon-containing compounds containing oxygen containing at least one Si—O bond containing at least one Si—C bond
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2383/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Derivatives of such polymers
    • C08J2383/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2383/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Derivatives of such polymers
    • C08J2383/04—Polysiloxanes
    • C08J2383/08—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen, and oxygen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/019—Specific properties of additives the composition being defined by the absence of a certain additive
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/16—Applications used for films
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2312/00—Crosslinking
    • C08L2312/06—Crosslinking by radiation
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2312/00—Crosslinking
    • C08L2312/08—Crosslinking by silane

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Paints Or Removers (AREA)
KR1020217020878A 2018-12-07 2019-12-06 필름 형성용 경화성 오가노폴리실록산 조성물 및 오가노폴리실록산 경화물 필름의 제조 방법 Active KR102887414B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2018-229642 2018-12-07
JP2018229642 2018-12-07
PCT/JP2019/047740 WO2020116596A1 (ja) 2018-12-07 2019-12-06 フィルム形成用硬化性オルガノポリシロキサン組成物およびオルガノポリシロキサン硬化物フィルムの製造方法

Publications (2)

Publication Number Publication Date
KR20210112322A KR20210112322A (ko) 2021-09-14
KR102887414B1 true KR102887414B1 (ko) 2025-11-18

Family

ID=70975381

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020217020878A Active KR102887414B1 (ko) 2018-12-07 2019-12-06 필름 형성용 경화성 오가노폴리실록산 조성물 및 오가노폴리실록산 경화물 필름의 제조 방법

Country Status (7)

Country Link
US (1) US12122935B2 (https=)
EP (1) EP3892688A4 (https=)
JP (1) JP7453155B2 (https=)
KR (1) KR102887414B1 (https=)
CN (1) CN113348211A (https=)
TW (1) TWI845567B (https=)
WO (1) WO2020116596A1 (https=)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020116440A1 (ja) * 2018-12-07 2020-06-11 ダウ・東レ株式会社 硬化性オルガノポリシロキサン組成物、その硬化物および当該硬化物を備えたトランスデューサー等
US12503598B2 (en) 2019-02-14 2025-12-23 Dow Toray Co., Ltd. Organopolysiloxane cured product film and usage, manufacturing method, and manufacturing apparatus therefor
WO2022004462A1 (ja) * 2020-06-30 2022-01-06 ダウ・東レ株式会社 オルガノポリシロキサン硬化物フィルムからなる積層体、その用途、およびその製造方法
CN113490129B (zh) * 2021-06-30 2023-03-03 歌尔股份有限公司 用于发声装置的振膜及发声装置
US20260078222A1 (en) * 2022-10-05 2026-03-19 Dow Toray Co., Ltd. Curable organopolysiloxane composition for transducers, cured product of same, and transducer and others each provided with said cured product
CN118895086B (zh) * 2024-04-10 2025-10-24 华为技术有限公司 一种成膜组合物及其应用
CN118995043B (zh) * 2024-10-26 2024-12-27 河北冀特电气有限公司 一种高压输电线高分子绝缘涂覆材料及其制备方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003026926A (ja) 2001-07-18 2003-01-29 Shin Etsu Chem Co Ltd シリコーンゴム組成物及び導電性ゴム硬化物
JP2007500775A (ja) 2003-05-23 2007-01-18 イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニー 離型組成物およびその方法

Family Cites Families (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0436355A (ja) 1990-05-31 1992-02-06 Toray Dow Corning Silicone Co Ltd シリコーンゴム組成物
US5321058A (en) 1990-05-31 1994-06-14 Dow Corning Toray Silicone Co., Ltd. Curable organosiloxane compositions exhibiting reduced mold staining and scorching
JPH05148275A (ja) 1991-11-28 1993-06-15 Toray Dow Corning Silicone Co Ltd ジシロキサン化合物およびその製造方法
US5880210A (en) 1997-04-01 1999-03-09 Dow Corning Corporation Silicone fluids and solvents thickened with silicone elastomers
US6121368A (en) 1999-09-07 2000-09-19 Dow Corning Corporation Silicone composition and silicone pressure sensitive adhesive formed therefrom
JP2005029642A (ja) * 2003-07-09 2005-02-03 Shin Etsu Chem Co Ltd シリコーンゴムコーティング剤組成物
DE602007004594D1 (de) 2006-05-10 2010-03-18 Dow Corning Toray Co Ltd Silikongummizusammensetzung
JP5042703B2 (ja) 2006-05-10 2012-10-03 東レ・ダウコーニング株式会社 シリコーンゴム組成物
JP5683848B2 (ja) * 2009-07-01 2015-03-11 東レ・ダウコーニング株式会社 硬化性オルガノポリシロキサン組成物、該組成物からなる硬化層を備えたシート状物品およびその製造方法
US20110152434A1 (en) 2009-12-18 2011-06-23 Claude Schweitzer Tire with component containing combined high structure silica and low structure silica
JP5767161B2 (ja) * 2012-05-08 2015-08-19 信越化学工業株式会社 ウエハ加工用仮接着材、それを用いたウエハ加工用部材、ウエハ加工体、及び薄型ウエハの作製方法
CN104684730A (zh) * 2012-10-09 2015-06-03 道康宁东丽株式会社 可固化有机聚硅氧烷组合物、具有由所述组合物形成的固化层的片状制品和层合材料
DE102012220954A1 (de) * 2012-11-16 2014-05-22 Wacker Chemie Ag Schleifbare Siliconelastomerzusammensetzung und deren Verwendung
TW201431967A (zh) 2012-12-28 2014-08-16 Dow Corning 用於轉換器之可固化有機聚矽氧烷組合物的製造方法
WO2014105970A1 (en) 2012-12-28 2014-07-03 Dow Corning Corporation Transducers and production method thereof
TW201431959A (zh) 2012-12-28 2014-08-16 Dow Corning 用於轉換器之可固化有機聚矽氧烷組合物及該可固化聚矽氧組合物於轉換器之應用
WO2014105959A1 (en) 2012-12-28 2014-07-03 Dow Corning Corporation Curable organopolysiloxane composition for transducers and applications of such curable silicone composition for transducers
TWI616477B (zh) 2012-12-28 2018-03-01 道康寧公司 用於轉換器之可固化有機聚矽氧烷組合物及該可固化聚矽氧組合物於轉換器之應用
TW201431925A (zh) 2012-12-28 2014-08-16 Dow Corning 用於轉換器之可固化有機聚矽氧烷組合物及該可固化聚矽氧組合物於轉換器之應用
CN105899616B (zh) * 2013-11-11 2019-02-22 道康宁东丽株式会社 可固化有机聚硅氧烷组合物以及用于使用其与介电陶瓷层形成材料一起使用的隔离膜
JP6107741B2 (ja) 2014-05-09 2017-04-05 信越化学工業株式会社 ミラブル型シリコーンゴムコンパウンド及びミラブル型シリコーンゴム組成物の製造方法
US20160329562A1 (en) 2014-12-16 2016-11-10 Sanyo Electric Co., Ltd. Negative electrode active material for nonaqueous electrolyte secondary batteries and nonaqueous electrolyte secondary battery containing negative electrode active material
JPWO2016163069A1 (ja) 2015-04-10 2018-02-01 東レ・ダウコーニング株式会社 フルオロアルキル基含有硬化性オルガノポリシロキサン組成物、その硬化物および当該硬化物を備えた電子部品または表示装置
JP6712162B2 (ja) 2016-03-30 2020-06-17 日本碍子株式会社 圧電素子
JP6866353B2 (ja) 2016-04-22 2021-04-28 ダウ・東レ株式会社 高誘電性フィルム、その用途および製造方法
KR102002831B1 (ko) * 2016-07-11 2019-07-23 (주)엘지하우시스 경화 후의 내마모성이 향상된 하드코팅 조성물 및 이를 포함하는 성형필름

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003026926A (ja) 2001-07-18 2003-01-29 Shin Etsu Chem Co Ltd シリコーンゴム組成物及び導電性ゴム硬化物
JP2007500775A (ja) 2003-05-23 2007-01-18 イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニー 離型組成物およびその方法

Also Published As

Publication number Publication date
EP3892688A1 (en) 2021-10-13
EP3892688A4 (en) 2022-08-24
WO2020116596A1 (ja) 2020-06-11
TW202037675A (zh) 2020-10-16
JP7453155B2 (ja) 2024-03-19
US12122935B2 (en) 2024-10-22
TWI845567B (zh) 2024-06-21
CN113348211A (zh) 2021-09-03
JPWO2020116596A1 (ja) 2021-10-21
US20220064448A1 (en) 2022-03-03
KR20210112322A (ko) 2021-09-14

Similar Documents

Publication Publication Date Title
KR102933344B1 (ko) 오가노폴리실록산 경화물 필름, 그의 용도, 제조 방법 및 제조 장치
KR102887414B1 (ko) 필름 형성용 경화성 오가노폴리실록산 조성물 및 오가노폴리실록산 경화물 필름의 제조 방법
KR102802701B1 (ko) 오가노폴리실록산 경화물 필름, 그의 용도 및 제조 방법
KR102802709B1 (ko) 필름 형성용 경화성 오가노폴리실록산 조성물 및 오가노폴리실록산 경화물 필름의 제조 방법
US12584016B2 (en) Curable elastomer composition, cured product of same, film provided with cured product, multilayer body provided with film, method for producing said multilayer body, electronic component and display device each comprising cured product, method for designing curable elastomer composition and method for designing transducer device

Legal Events

Date Code Title Description
PA0105 International application

St.27 status event code: A-0-1-A10-A15-nap-PA0105

R17-X000 Change to representative recorded

St.27 status event code: A-3-3-R10-R17-oth-X000

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

A201 Request for examination
E13-X000 Pre-grant limitation requested

St.27 status event code: A-2-3-E10-E13-lim-X000

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

E13-X000 Pre-grant limitation requested

St.27 status event code: A-2-3-E10-E13-lim-X000

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

D22 Grant of ip right intended

Free format text: ST27 STATUS EVENT CODE: A-1-2-D10-D22-EXM-PE0701 (AS PROVIDED BY THE NATIONAL OFFICE)

PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701

R18 Changes to party contact information recorded

Free format text: ST27 STATUS EVENT CODE: A-3-3-R10-R18-OTH-X000 (AS PROVIDED BY THE NATIONAL OFFICE)

R18-X000 Changes to party contact information recorded

St.27 status event code: A-3-3-R10-R18-oth-X000

F11 Ip right granted following substantive examination

Free format text: ST27 STATUS EVENT CODE: A-2-4-F10-F11-EXM-PR0701 (AS PROVIDED BY THE NATIONAL OFFICE)

PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U12-oth-PR1002

Fee payment year number: 1

U12 Designation fee paid

Free format text: ST27 STATUS EVENT CODE: A-2-2-U10-U12-OTH-PR1002 (AS PROVIDED BY THE NATIONAL OFFICE)

Year of fee payment: 1

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

Q13 Ip right document published

Free format text: ST27 STATUS EVENT CODE: A-4-4-Q10-Q13-NAP-PG1601 (AS PROVIDED BY THE NATIONAL OFFICE)