KR102870178B1 - 프로브 카드 - Google Patents
프로브 카드Info
- Publication number
- KR102870178B1 KR102870178B1 KR1020237006038A KR20237006038A KR102870178B1 KR 102870178 B1 KR102870178 B1 KR 102870178B1 KR 1020237006038 A KR1020237006038 A KR 1020237006038A KR 20237006038 A KR20237006038 A KR 20237006038A KR 102870178 B1 KR102870178 B1 KR 102870178B1
- Authority
- KR
- South Korea
- Prior art keywords
- probe
- guide plate
- offset
- guide
- probes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
- G01R1/07371—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate card or back card with apertures through which the probes pass
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06705—Apparatus for holding or moving single probes
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06733—Geometry aspects
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
- G01R1/07328—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support for testing printed circuit boards
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
- G01R31/2889—Interfaces, e.g. between probe and tester
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07357—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with flexible bodies, e.g. buckling beams
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Measuring Leads Or Probes (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Geometry (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2020/034931 WO2022059070A1 (ja) | 2020-09-15 | 2020-09-15 | プローブカード |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20230038795A KR20230038795A (ko) | 2023-03-21 |
| KR102870178B1 true KR102870178B1 (ko) | 2025-10-14 |
Family
ID=80777301
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020237006038A Active KR102870178B1 (ko) | 2020-09-15 | 2020-09-15 | 프로브 카드 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US12332278B2 (https=) |
| JP (3) | JPWO2022059070A1 (https=) |
| KR (1) | KR102870178B1 (https=) |
| CN (2) | CN116097104A (https=) |
| TW (1) | TWI899329B (https=) |
| WO (1) | WO2022059070A1 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115684677B (zh) * | 2021-07-29 | 2025-08-01 | 芯卓科技(浙江)有限公司 | 探针及探针卡装置 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2019525204A (ja) * | 2016-08-11 | 2019-09-05 | テクノプローべ ソシエタ ペル アチオニ | 接触プローブ、および電子機器を検査するための装置の対応するテストヘッド |
| WO2020012799A1 (ja) * | 2018-07-13 | 2020-01-16 | 日本電産リード株式会社 | 検査治具、及び検査装置 |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4750820B2 (ja) * | 2008-04-21 | 2011-08-17 | 東京エレクトロン株式会社 | プローブカード |
| US8222912B2 (en) * | 2009-03-12 | 2012-07-17 | Sv Probe Pte. Ltd. | Probe head structure for probe test cards |
| US9702904B2 (en) * | 2011-03-21 | 2017-07-11 | Formfactor, Inc. | Non-linear vertical leaf spring |
| US10006938B2 (en) * | 2012-01-04 | 2018-06-26 | Formfactor, Inc. | Probes with programmable motion |
| JP5868239B2 (ja) * | 2012-03-27 | 2016-02-24 | 株式会社日本マイクロニクス | プローブ及びプローブカード |
| WO2014087906A1 (ja) * | 2012-12-04 | 2014-06-12 | 日本電子材料株式会社 | 電気的接触子 |
| JP2015072182A (ja) * | 2013-10-03 | 2015-04-16 | 日本電子材料株式会社 | プローブカード |
| SG11201704433TA (en) * | 2014-12-30 | 2017-07-28 | Technoprobe Spa | Contact probe for testing head |
| WO2016146499A1 (en) * | 2015-03-13 | 2016-09-22 | Technoprobe S.P.A. | Testing head with vertical probes having an improved sliding movement within respective guide holes and correct holding of the probes within the testing head under different operative conditions |
| JP6654061B2 (ja) * | 2016-02-23 | 2020-02-26 | 日本電子材料株式会社 | プローブガイド、プローブカード及びプローブガイドの製造方法 |
| JP6781598B2 (ja) * | 2016-09-16 | 2020-11-04 | 日本電子材料株式会社 | プローブカード |
| CN111403937A (zh) * | 2020-03-24 | 2020-07-10 | 东莞立德精密工业有限公司 | 金属端子及其制作方法 |
| CN113721051B (zh) * | 2020-05-26 | 2023-12-01 | 旺矽科技股份有限公司 | 具有线型探针的探针头 |
| CN115248338B (zh) * | 2021-04-27 | 2025-09-23 | 芯卓科技(浙江)有限公司 | 探针结构及其探针卡装置 |
-
2020
- 2020-09-15 US US18/024,055 patent/US12332278B2/en active Active
- 2020-09-15 JP JP2022550072A patent/JPWO2022059070A1/ja active Pending
- 2020-09-15 CN CN202080103394.7A patent/CN116097104A/zh active Pending
- 2020-09-15 KR KR1020237006038A patent/KR102870178B1/ko active Active
- 2020-09-15 CN CN202610060267.2A patent/CN121831221A/zh active Pending
- 2020-09-15 WO PCT/JP2020/034931 patent/WO2022059070A1/ja not_active Ceased
-
2021
- 2021-09-14 TW TW110134208A patent/TWI899329B/zh active
-
2024
- 2024-10-02 JP JP2024173484A patent/JP2024174199A/ja active Pending
-
2026
- 2026-01-22 JP JP2026008887A patent/JP2026063332A/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2019525204A (ja) * | 2016-08-11 | 2019-09-05 | テクノプローべ ソシエタ ペル アチオニ | 接触プローブ、および電子機器を検査するための装置の対応するテストヘッド |
| WO2020012799A1 (ja) * | 2018-07-13 | 2020-01-16 | 日本電産リード株式会社 | 検査治具、及び検査装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| US12332278B2 (en) | 2025-06-17 |
| TW202215058A (zh) | 2022-04-16 |
| US20230266365A1 (en) | 2023-08-24 |
| TWI899329B (zh) | 2025-10-01 |
| JP2024174199A (ja) | 2024-12-13 |
| WO2022059070A1 (ja) | 2022-03-24 |
| JP2026063332A (ja) | 2026-04-10 |
| CN116097104A (zh) | 2023-05-09 |
| KR20230038795A (ko) | 2023-03-21 |
| CN121831221A (zh) | 2026-04-10 |
| JPWO2022059070A1 (https=) | 2022-03-24 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A201 | Request for examination | ||
| E13-X000 | Pre-grant limitation requested |
St.27 status event code: A-2-3-E10-E13-lim-X000 |
|
| P11-X000 | Amendment of application requested |
St.27 status event code: A-2-2-P10-P11-nap-X000 |
|
| P13-X000 | Application amended |
St.27 status event code: A-2-2-P10-P13-nap-X000 |
|
| PA0105 | International application |
St.27 status event code: A-0-1-A10-A15-nap-PA0105 |
|
| PA0201 | Request for examination |
St.27 status event code: A-1-2-D10-D11-exm-PA0201 |
|
| PG1501 | Laying open of application |
St.27 status event code: A-1-1-Q10-Q12-nap-PG1501 |
|
| E902 | Notification of reason for refusal | ||
| PE0902 | Notice of grounds for rejection |
St.27 status event code: A-1-2-D10-D21-exm-PE0902 |
|
| P11-X000 | Amendment of application requested |
St.27 status event code: A-2-2-P10-P11-nap-X000 |
|
| D22 | Grant of ip right intended |
Free format text: ST27 STATUS EVENT CODE: A-1-2-D10-D22-EXM-PE0701 (AS PROVIDED BY THE NATIONAL OFFICE) |
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| PE0701 | Decision of registration |
St.27 status event code: A-1-2-D10-D22-exm-PE0701 |
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| F11 | Ip right granted following substantive examination |
Free format text: ST27 STATUS EVENT CODE: A-2-4-F10-F11-EXM-PR0701 (AS PROVIDED BY THE NATIONAL OFFICE) |
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| PR0701 | Registration of establishment |
St.27 status event code: A-2-4-F10-F11-exm-PR0701 |
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| PR1002 | Payment of registration fee |
St.27 status event code: A-2-2-U10-U12-oth-PR1002 Fee payment year number: 1 |
|
| U12 | Designation fee paid |
Free format text: ST27 STATUS EVENT CODE: A-2-2-U10-U12-OTH-PR1002 (AS PROVIDED BY THE NATIONAL OFFICE) Year of fee payment: 1 |
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| PG1601 | Publication of registration |
St.27 status event code: A-4-4-Q10-Q13-nap-PG1601 |
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| Q13 | Ip right document published |
Free format text: ST27 STATUS EVENT CODE: A-4-4-Q10-Q13-NAP-PG1601 (AS PROVIDED BY THE NATIONAL OFFICE) |