JPWO2022059070A1 - - Google Patents

Info

Publication number
JPWO2022059070A1
JPWO2022059070A1 JP2022550072A JP2022550072A JPWO2022059070A1 JP WO2022059070 A1 JPWO2022059070 A1 JP WO2022059070A1 JP 2022550072 A JP2022550072 A JP 2022550072A JP 2022550072 A JP2022550072 A JP 2022550072A JP WO2022059070 A1 JPWO2022059070 A1 JP WO2022059070A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2022550072A
Other versions
JPWO2022059070A5 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2022059070A1 publication Critical patent/JPWO2022059070A1/ja
Publication of JPWO2022059070A5 publication Critical patent/JPWO2022059070A5/ja
Pending legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
    • G01R1/07371—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate card or back card with apertures through which the probes pass
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
    • G01R1/07328—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support for testing printed circuit boards
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2889—Interfaces, e.g. between probe and tester
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07357—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with flexible bodies, e.g. buckling beams

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Measuring Leads Or Probes (AREA)
  • Geometry (AREA)
JP2022550072A 2020-09-15 2020-09-15 Pending JPWO2022059070A1 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2020/034931 WO2022059070A1 (ja) 2020-09-15 2020-09-15 プローブカード

Publications (2)

Publication Number Publication Date
JPWO2022059070A1 true JPWO2022059070A1 (ja) 2022-03-24
JPWO2022059070A5 JPWO2022059070A5 (ja) 2023-04-21

Family

ID=80777301

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022550072A Pending JPWO2022059070A1 (ja) 2020-09-15 2020-09-15

Country Status (6)

Country Link
US (1) US20230266365A1 (ja)
JP (1) JPWO2022059070A1 (ja)
KR (1) KR20230038795A (ja)
CN (1) CN116097104A (ja)
TW (1) TW202215058A (ja)
WO (1) WO2022059070A1 (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115684677A (zh) * 2021-07-29 2023-02-03 迪科特测试科技(苏州)有限公司 探针及探针卡装置

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8222912B2 (en) * 2009-03-12 2012-07-17 Sv Probe Pte. Ltd. Probe head structure for probe test cards
JP5868239B2 (ja) * 2012-03-27 2016-02-24 株式会社日本マイクロニクス プローブ及びプローブカード
JP2015072182A (ja) * 2013-10-03 2015-04-16 日本電子材料株式会社 プローブカード
IT201600084921A1 (it) * 2016-08-11 2018-02-11 Technoprobe Spa Sonda di contatto e relativa testa di misura di un’apparecchiatura di test di dispositivi elettronici
JP6781598B2 (ja) 2016-09-16 2020-11-04 日本電子材料株式会社 プローブカード
CN112424615A (zh) * 2018-07-13 2021-02-26 日本电产理德股份有限公司 检查治具以及检查装置

Also Published As

Publication number Publication date
TW202215058A (zh) 2022-04-16
KR20230038795A (ko) 2023-03-21
WO2022059070A1 (ja) 2022-03-24
US20230266365A1 (en) 2023-08-24
CN116097104A (zh) 2023-05-09

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