KR102857158B1 - 베이퍼 챔버용의 본체 시트, 베이퍼 챔버 및 전자 기기 - Google Patents

베이퍼 챔버용의 본체 시트, 베이퍼 챔버 및 전자 기기

Info

Publication number
KR102857158B1
KR102857158B1 KR1020247034623A KR20247034623A KR102857158B1 KR 102857158 B1 KR102857158 B1 KR 102857158B1 KR 1020247034623 A KR1020247034623 A KR 1020247034623A KR 20247034623 A KR20247034623 A KR 20247034623A KR 102857158 B1 KR102857158 B1 KR 102857158B1
Authority
KR
South Korea
Prior art keywords
land
intersection
main body
groove
body surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
KR1020247034623A
Other languages
English (en)
Korean (ko)
Other versions
KR20240169006A (ko
Inventor
다카유키 오타
도시히코 다케다
가즈노리 오다
마코토 야마키
신야 기우라
마사시 이나가키
Original Assignee
다이니폰 인사츠 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 다이니폰 인사츠 가부시키가이샤 filed Critical 다이니폰 인사츠 가부시키가이샤
Priority to KR1020257029430A priority Critical patent/KR20250134723A/ko
Publication of KR20240169006A publication Critical patent/KR20240169006A/ko
Application granted granted Critical
Publication of KR102857158B1 publication Critical patent/KR102857158B1/ko
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/40—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids
    • H01L23/46—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/73—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control for cooling by change of state
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • H01L23/367—
    • H01L23/427—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20327—Accessories for moving fluid, for connecting fluid conduits, for distributing fluid or for preventing leakage, e.g. pumps, tanks or manifolds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H10W40/226—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections characterised by projecting parts, e.g. fins to increase surface area
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H10W40/226—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections characterised by projecting parts, e.g. fins to increase surface area
    • H10W40/228—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections characterised by projecting parts, e.g. fins to increase surface area the projecting parts being wire-shaped or pin-shaped

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)
  • Cookers (AREA)
  • Physical Vapour Deposition (AREA)
KR1020247034623A 2022-03-31 2023-03-30 베이퍼 챔버용의 본체 시트, 베이퍼 챔버 및 전자 기기 Active KR102857158B1 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020257029430A KR20250134723A (ko) 2022-03-31 2023-03-30 베이퍼 챔버용의 본체 시트, 베이퍼 챔버 및 전자 기기

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2022061290 2022-03-31
JP2022061295 2022-03-31
JPJP-P-2022-061290 2022-03-31
JPJP-P-2022-061295 2022-03-31
PCT/JP2023/013416 WO2023191000A1 (ja) 2022-03-31 2023-03-30 ベーパーチャンバ用の本体シート、ベーパーチャンバおよび電子機器

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR1020257029430A Division KR20250134723A (ko) 2022-03-31 2023-03-30 베이퍼 챔버용의 본체 시트, 베이퍼 챔버 및 전자 기기

Publications (2)

Publication Number Publication Date
KR20240169006A KR20240169006A (ko) 2024-12-02
KR102857158B1 true KR102857158B1 (ko) 2025-09-10

Family

ID=88202291

Family Applications (2)

Application Number Title Priority Date Filing Date
KR1020247034623A Active KR102857158B1 (ko) 2022-03-31 2023-03-30 베이퍼 챔버용의 본체 시트, 베이퍼 챔버 및 전자 기기
KR1020257029430A Pending KR20250134723A (ko) 2022-03-31 2023-03-30 베이퍼 챔버용의 본체 시트, 베이퍼 챔버 및 전자 기기

Family Applications After (1)

Application Number Title Priority Date Filing Date
KR1020257029430A Pending KR20250134723A (ko) 2022-03-31 2023-03-30 베이퍼 챔버용의 본체 시트, 베이퍼 챔버 및 전자 기기

Country Status (6)

Country Link
US (1) US20250169041A1 (https=)
JP (3) JP7537646B2 (https=)
KR (2) KR102857158B1 (https=)
CN (1) CN119053830A (https=)
TW (1) TW202346776A (https=)
WO (1) WO2023191000A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP4159057B1 (en) * 2022-05-13 2025-08-13 Shenzhen Smoore Technology Limited Heating body, atomizer and electronic atomization device

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019039662A (ja) 2017-08-24 2019-03-14 大日本印刷株式会社 ベーパーチャンバ用のウィックシート、ベーパーチャンバおよびベーパーチャンバの製造方法
WO2019088301A1 (ja) 2017-11-06 2019-05-09 大日本印刷株式会社 ベーパーチャンバ、電子機器、ベーパーチャンバ用シート、並びに、ベーパーチャンバ用シート及びベーパーチャンバの製造方法
JP2020003194A (ja) 2018-06-29 2020-01-09 大日本印刷株式会社 ベーパーチャンバー、電子機器、及びベーパーチャンバーの製造方法
JP2021188800A (ja) 2020-05-27 2021-12-13 大日本印刷株式会社 ベーパーチャンバ、電子機器およびベーパーチャンバの製造方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09184696A (ja) * 1995-12-29 1997-07-15 Fujikura Ltd ヒートパイプ
JP6462771B2 (ja) 2017-06-01 2019-01-30 古河電気工業株式会社 平面型ヒートパイプ

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019039662A (ja) 2017-08-24 2019-03-14 大日本印刷株式会社 ベーパーチャンバ用のウィックシート、ベーパーチャンバおよびベーパーチャンバの製造方法
WO2019088301A1 (ja) 2017-11-06 2019-05-09 大日本印刷株式会社 ベーパーチャンバ、電子機器、ベーパーチャンバ用シート、並びに、ベーパーチャンバ用シート及びベーパーチャンバの製造方法
JP2020003194A (ja) 2018-06-29 2020-01-09 大日本印刷株式会社 ベーパーチャンバー、電子機器、及びベーパーチャンバーの製造方法
JP2021188800A (ja) 2020-05-27 2021-12-13 大日本印刷株式会社 ベーパーチャンバ、電子機器およびベーパーチャンバの製造方法

Also Published As

Publication number Publication date
JP7584027B2 (ja) 2024-11-15
US20250169041A1 (en) 2025-05-22
KR20240169006A (ko) 2024-12-02
JPWO2023191000A1 (https=) 2023-10-05
JP2024150781A (ja) 2024-10-23
CN119053830A (zh) 2024-11-29
JP2025014057A (ja) 2025-01-28
JP7537646B2 (ja) 2024-08-21
KR20250134723A (ko) 2025-09-11
WO2023191000A1 (ja) 2023-10-05
TW202346776A (zh) 2023-12-01

Similar Documents

Publication Publication Date Title
KR102608789B1 (ko) 베이퍼 챔버, 전자 기기, 베이퍼 챔버용 금속 시트및 베이퍼 챔버의 제조 방법
US11859913B2 (en) Wick sheet for vapor chamber, vapor chamber, and electronic apparatus
JP2025157264A (ja) ベーパーチャンバ用のウィックシート、ベーパーチャンバおよび電子機器
KR102857158B1 (ko) 베이퍼 챔버용의 본체 시트, 베이퍼 챔버 및 전자 기기
JP7723915B2 (ja) ベーパーチャンバおよび電子機器
JP2025011160A (ja) ベーパーチャンバおよび電子機器
JP7780721B2 (ja) ベーパーチャンバ用のウィックシート、ベーパーチャンバおよび電子機器
JP2025148370A (ja) ベーパーチャンバ、電子機器およびベーパーチャンバの製造方法
KR20230156088A (ko) 베이퍼 챔버, 베이퍼 챔버용 윅 시트 및 전자 기기
JP7816407B2 (ja) ベーパーチャンバおよび電子機器
JP7745154B2 (ja) ベーパーチャンバ用のウィックシート、ベーパーチャンバおよび電子機器
JP7259564B2 (ja) ベーパーチャンバ、電子機器、及び、ベーパーチャンバ用金属シート
KR20230175276A (ko) 베이퍼 챔버, 베이퍼 챔버용의 윅 시트 및 전자 기기
JP7800453B2 (ja) ベーパーチャンバ用の本体シート、ベーパーチャンバおよび電子機器
KR20240109609A (ko) 베이퍼 챔버, 전자 기기 및 베이퍼 챔버용 본체 시트
WO2024034632A1 (ja) ベイパーチャンバー、冷却装置および電子機器
CN116745573A (zh) 蒸发室用的主体片材、蒸发室以及电子设备

Legal Events

Date Code Title Description
PA0105 International application

St.27 status event code: A-0-1-A10-A15-nap-PA0105

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

A201 Request for examination
E13-X000 Pre-grant limitation requested

St.27 status event code: A-2-3-E10-E13-lim-X000

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PA0302 Request for accelerated examination

St.27 status event code: A-1-2-D10-D16-exm-PA0302

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701

A16 Divisional, continuation or continuation in part application filed

Free format text: ST27 STATUS EVENT CODE: A-0-1-A10-A16-DIV-PA0104 (AS PROVIDED BY THE NATIONAL OFFICE)

A18 Application divided or continuation or continuation in part accepted

Free format text: ST27 STATUS EVENT CODE: A-0-1-A10-A18-DIV-PA0104 (AS PROVIDED BY THE NATIONAL OFFICE)

PA0104 Divisional application for international application

St.27 status event code: A-0-1-A10-A18-div-PA0104

St.27 status event code: A-0-1-A10-A16-div-PA0104

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

Q13 Ip right document published

Free format text: ST27 STATUS EVENT CODE: A-4-4-Q10-Q13-NAP-PG1601 (AS PROVIDED BY THE NATIONAL OFFICE)

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000