JP7537646B2 - ベーパーチャンバ用の本体シート、ベーパーチャンバおよび電子機器 - Google Patents

ベーパーチャンバ用の本体シート、ベーパーチャンバおよび電子機器 Download PDF

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Publication number
JP7537646B2
JP7537646B2 JP2024512867A JP2024512867A JP7537646B2 JP 7537646 B2 JP7537646 B2 JP 7537646B2 JP 2024512867 A JP2024512867 A JP 2024512867A JP 2024512867 A JP2024512867 A JP 2024512867A JP 7537646 B2 JP7537646 B2 JP 7537646B2
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JP
Japan
Prior art keywords
land
body surface
main body
intersection
groove
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2024512867A
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English (en)
Japanese (ja)
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JPWO2023191000A5 (https=
JPWO2023191000A1 (https=
Inventor
貴之 太田
利彦 武田
和範 小田
誠 山木
伸哉 木浦
雅史 稲垣
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dai Nippon Printing Co Ltd
Original Assignee
Dai Nippon Printing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dai Nippon Printing Co Ltd filed Critical Dai Nippon Printing Co Ltd
Publication of JPWO2023191000A1 publication Critical patent/JPWO2023191000A1/ja
Publication of JPWO2023191000A5 publication Critical patent/JPWO2023191000A5/ja
Priority to JP2024131215A priority Critical patent/JP7584027B2/ja
Application granted granted Critical
Publication of JP7537646B2 publication Critical patent/JP7537646B2/ja
Priority to JP2024193148A priority patent/JP2025014057A/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/40—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/73—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control for cooling by change of state
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20327—Accessories for moving fluid, for connecting fluid conduits, for distributing fluid or for preventing leakage, e.g. pumps, tanks or manifolds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H10W40/226—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections characterised by projecting parts, e.g. fins to increase surface area
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H10W40/226—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections characterised by projecting parts, e.g. fins to increase surface area
    • H10W40/228—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections characterised by projecting parts, e.g. fins to increase surface area the projecting parts being wire-shaped or pin-shaped

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)
  • Physical Vapour Deposition (AREA)
  • Cookers (AREA)
JP2024512867A 2022-03-31 2023-03-30 ベーパーチャンバ用の本体シート、ベーパーチャンバおよび電子機器 Active JP7537646B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2024131215A JP7584027B2 (ja) 2022-03-31 2024-08-07 ベーパーチャンバ用のウィックシート、ベーパーチャンバおよび電子機器
JP2024193148A JP2025014057A (ja) 2022-03-31 2024-11-01 ベーパーチャンバ用の本体シート、ベーパーチャンバおよび電子機器

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2022061295 2022-03-31
JP2022061290 2022-03-31
JP2022061295 2022-03-31
JP2022061290 2022-03-31
PCT/JP2023/013416 WO2023191000A1 (ja) 2022-03-31 2023-03-30 ベーパーチャンバ用の本体シート、ベーパーチャンバおよび電子機器

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2024131215A Division JP7584027B2 (ja) 2022-03-31 2024-08-07 ベーパーチャンバ用のウィックシート、ベーパーチャンバおよび電子機器

Publications (3)

Publication Number Publication Date
JPWO2023191000A1 JPWO2023191000A1 (https=) 2023-10-05
JPWO2023191000A5 JPWO2023191000A5 (https=) 2024-05-22
JP7537646B2 true JP7537646B2 (ja) 2024-08-21

Family

ID=88202291

Family Applications (3)

Application Number Title Priority Date Filing Date
JP2024512867A Active JP7537646B2 (ja) 2022-03-31 2023-03-30 ベーパーチャンバ用の本体シート、ベーパーチャンバおよび電子機器
JP2024131215A Active JP7584027B2 (ja) 2022-03-31 2024-08-07 ベーパーチャンバ用のウィックシート、ベーパーチャンバおよび電子機器
JP2024193148A Pending JP2025014057A (ja) 2022-03-31 2024-11-01 ベーパーチャンバ用の本体シート、ベーパーチャンバおよび電子機器

Family Applications After (2)

Application Number Title Priority Date Filing Date
JP2024131215A Active JP7584027B2 (ja) 2022-03-31 2024-08-07 ベーパーチャンバ用のウィックシート、ベーパーチャンバおよび電子機器
JP2024193148A Pending JP2025014057A (ja) 2022-03-31 2024-11-01 ベーパーチャンバ用の本体シート、ベーパーチャンバおよび電子機器

Country Status (6)

Country Link
US (1) US20250169041A1 (https=)
JP (3) JP7537646B2 (https=)
KR (2) KR20250134723A (https=)
CN (1) CN119053830A (https=)
TW (1) TW202346776A (https=)
WO (1) WO2023191000A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN218185267U (zh) * 2022-05-13 2023-01-03 深圳麦克韦尔科技有限公司 发热体、雾化器及电子雾化装置

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019039662A (ja) 2017-08-24 2019-03-14 大日本印刷株式会社 ベーパーチャンバ用のウィックシート、ベーパーチャンバおよびベーパーチャンバの製造方法
WO2019088301A1 (ja) 2017-11-06 2019-05-09 大日本印刷株式会社 ベーパーチャンバ、電子機器、ベーパーチャンバ用シート、並びに、ベーパーチャンバ用シート及びベーパーチャンバの製造方法
JP2020003194A (ja) 2018-06-29 2020-01-09 大日本印刷株式会社 ベーパーチャンバー、電子機器、及びベーパーチャンバーの製造方法
JP2021188800A (ja) 2020-05-27 2021-12-13 大日本印刷株式会社 ベーパーチャンバ、電子機器およびベーパーチャンバの製造方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09184696A (ja) * 1995-12-29 1997-07-15 Fujikura Ltd ヒートパイプ
JP6462771B2 (ja) 2017-06-01 2019-01-30 古河電気工業株式会社 平面型ヒートパイプ

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019039662A (ja) 2017-08-24 2019-03-14 大日本印刷株式会社 ベーパーチャンバ用のウィックシート、ベーパーチャンバおよびベーパーチャンバの製造方法
WO2019088301A1 (ja) 2017-11-06 2019-05-09 大日本印刷株式会社 ベーパーチャンバ、電子機器、ベーパーチャンバ用シート、並びに、ベーパーチャンバ用シート及びベーパーチャンバの製造方法
JP2020003194A (ja) 2018-06-29 2020-01-09 大日本印刷株式会社 ベーパーチャンバー、電子機器、及びベーパーチャンバーの製造方法
JP2021188800A (ja) 2020-05-27 2021-12-13 大日本印刷株式会社 ベーパーチャンバ、電子機器およびベーパーチャンバの製造方法

Also Published As

Publication number Publication date
CN119053830A (zh) 2024-11-29
KR20240169006A (ko) 2024-12-02
JP2025014057A (ja) 2025-01-28
US20250169041A1 (en) 2025-05-22
JP7584027B2 (ja) 2024-11-15
TW202346776A (zh) 2023-12-01
KR20250134723A (ko) 2025-09-11
JP2024150781A (ja) 2024-10-23
WO2023191000A1 (ja) 2023-10-05
JPWO2023191000A1 (https=) 2023-10-05
KR102857158B1 (ko) 2025-09-10

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