JPWO2023191000A1 - - Google Patents

Info

Publication number
JPWO2023191000A1
JPWO2023191000A1 JP2024512867A JP2024512867A JPWO2023191000A1 JP WO2023191000 A1 JPWO2023191000 A1 JP WO2023191000A1 JP 2024512867 A JP2024512867 A JP 2024512867A JP 2024512867 A JP2024512867 A JP 2024512867A JP WO2023191000 A1 JPWO2023191000 A1 JP WO2023191000A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2024512867A
Other languages
Japanese (ja)
Other versions
JPWO2023191000A5 (https=
JP7537646B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2023191000A1 publication Critical patent/JPWO2023191000A1/ja
Publication of JPWO2023191000A5 publication Critical patent/JPWO2023191000A5/ja
Priority to JP2024131215A priority Critical patent/JP7584027B2/ja
Application granted granted Critical
Publication of JP7537646B2 publication Critical patent/JP7537646B2/ja
Priority to JP2024193148A priority patent/JP2025014057A/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/40—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/73—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control for cooling by change of state
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20327—Accessories for moving fluid, for connecting fluid conduits, for distributing fluid or for preventing leakage, e.g. pumps, tanks or manifolds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H10W40/226—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections characterised by projecting parts, e.g. fins to increase surface area
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H10W40/226—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections characterised by projecting parts, e.g. fins to increase surface area
    • H10W40/228—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections characterised by projecting parts, e.g. fins to increase surface area the projecting parts being wire-shaped or pin-shaped

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)
  • Physical Vapour Deposition (AREA)
  • Cookers (AREA)
JP2024512867A 2022-03-31 2023-03-30 ベーパーチャンバ用の本体シート、ベーパーチャンバおよび電子機器 Active JP7537646B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2024131215A JP7584027B2 (ja) 2022-03-31 2024-08-07 ベーパーチャンバ用のウィックシート、ベーパーチャンバおよび電子機器
JP2024193148A JP2025014057A (ja) 2022-03-31 2024-11-01 ベーパーチャンバ用の本体シート、ベーパーチャンバおよび電子機器

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2022061295 2022-03-31
JP2022061290 2022-03-31
JP2022061295 2022-03-31
JP2022061290 2022-03-31
PCT/JP2023/013416 WO2023191000A1 (ja) 2022-03-31 2023-03-30 ベーパーチャンバ用の本体シート、ベーパーチャンバおよび電子機器

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2024131215A Division JP7584027B2 (ja) 2022-03-31 2024-08-07 ベーパーチャンバ用のウィックシート、ベーパーチャンバおよび電子機器

Publications (3)

Publication Number Publication Date
JPWO2023191000A1 true JPWO2023191000A1 (https=) 2023-10-05
JPWO2023191000A5 JPWO2023191000A5 (https=) 2024-05-22
JP7537646B2 JP7537646B2 (ja) 2024-08-21

Family

ID=88202291

Family Applications (3)

Application Number Title Priority Date Filing Date
JP2024512867A Active JP7537646B2 (ja) 2022-03-31 2023-03-30 ベーパーチャンバ用の本体シート、ベーパーチャンバおよび電子機器
JP2024131215A Active JP7584027B2 (ja) 2022-03-31 2024-08-07 ベーパーチャンバ用のウィックシート、ベーパーチャンバおよび電子機器
JP2024193148A Pending JP2025014057A (ja) 2022-03-31 2024-11-01 ベーパーチャンバ用の本体シート、ベーパーチャンバおよび電子機器

Family Applications After (2)

Application Number Title Priority Date Filing Date
JP2024131215A Active JP7584027B2 (ja) 2022-03-31 2024-08-07 ベーパーチャンバ用のウィックシート、ベーパーチャンバおよび電子機器
JP2024193148A Pending JP2025014057A (ja) 2022-03-31 2024-11-01 ベーパーチャンバ用の本体シート、ベーパーチャンバおよび電子機器

Country Status (6)

Country Link
US (1) US20250169041A1 (https=)
JP (3) JP7537646B2 (https=)
KR (2) KR20250134723A (https=)
CN (1) CN119053830A (https=)
TW (1) TW202346776A (https=)
WO (1) WO2023191000A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN218185267U (zh) * 2022-05-13 2023-01-03 深圳麦克韦尔科技有限公司 发热体、雾化器及电子雾化装置

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09184696A (ja) * 1995-12-29 1997-07-15 Fujikura Ltd ヒートパイプ
JP2019039662A (ja) * 2017-08-24 2019-03-14 大日本印刷株式会社 ベーパーチャンバ用のウィックシート、ベーパーチャンバおよびベーパーチャンバの製造方法
WO2019088301A1 (ja) * 2017-11-06 2019-05-09 大日本印刷株式会社 ベーパーチャンバ、電子機器、ベーパーチャンバ用シート、並びに、ベーパーチャンバ用シート及びベーパーチャンバの製造方法
JP2020003194A (ja) * 2018-06-29 2020-01-09 大日本印刷株式会社 ベーパーチャンバー、電子機器、及びベーパーチャンバーの製造方法
JP2021188800A (ja) * 2020-05-27 2021-12-13 大日本印刷株式会社 ベーパーチャンバ、電子機器およびベーパーチャンバの製造方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6462771B2 (ja) 2017-06-01 2019-01-30 古河電気工業株式会社 平面型ヒートパイプ

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09184696A (ja) * 1995-12-29 1997-07-15 Fujikura Ltd ヒートパイプ
JP2019039662A (ja) * 2017-08-24 2019-03-14 大日本印刷株式会社 ベーパーチャンバ用のウィックシート、ベーパーチャンバおよびベーパーチャンバの製造方法
WO2019088301A1 (ja) * 2017-11-06 2019-05-09 大日本印刷株式会社 ベーパーチャンバ、電子機器、ベーパーチャンバ用シート、並びに、ベーパーチャンバ用シート及びベーパーチャンバの製造方法
JP2020003194A (ja) * 2018-06-29 2020-01-09 大日本印刷株式会社 ベーパーチャンバー、電子機器、及びベーパーチャンバーの製造方法
JP2021188800A (ja) * 2020-05-27 2021-12-13 大日本印刷株式会社 ベーパーチャンバ、電子機器およびベーパーチャンバの製造方法

Also Published As

Publication number Publication date
CN119053830A (zh) 2024-11-29
KR20240169006A (ko) 2024-12-02
JP7537646B2 (ja) 2024-08-21
JP2025014057A (ja) 2025-01-28
US20250169041A1 (en) 2025-05-22
JP7584027B2 (ja) 2024-11-15
TW202346776A (zh) 2023-12-01
KR20250134723A (ko) 2025-09-11
JP2024150781A (ja) 2024-10-23
WO2023191000A1 (ja) 2023-10-05
KR102857158B1 (ko) 2025-09-10

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