KR102790443B1 - Led 어레이 - Google Patents
Led 어레이 Download PDFInfo
- Publication number
- KR102790443B1 KR102790443B1 KR1020217013348A KR20217013348A KR102790443B1 KR 102790443 B1 KR102790443 B1 KR 102790443B1 KR 1020217013348 A KR1020217013348 A KR 1020217013348A KR 20217013348 A KR20217013348 A KR 20217013348A KR 102790443 B1 KR102790443 B1 KR 102790443B1
- Authority
- KR
- South Korea
- Prior art keywords
- layer
- led
- array
- semiconductor layer
- holes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H29/00—Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
- H10H29/10—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00
- H10H29/14—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00 comprising multiple light-emitting semiconductor components
- H10H29/142—Two-dimensional arrangements, e.g. asymmetric LED layout
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/01—Manufacture or treatment
- H10H20/011—Manufacture or treatment of bodies, e.g. forming semiconductor layers
- H10H20/013—Manufacture or treatment of bodies, e.g. forming semiconductor layers having light-emitting regions comprising only Group III-V materials
- H10H20/0137—Manufacture or treatment of bodies, e.g. forming semiconductor layers having light-emitting regions comprising only Group III-V materials the light-emitting regions comprising nitride materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/01—Manufacture or treatment
- H10H20/032—Manufacture or treatment of electrodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/01—Manufacture or treatment
- H10H20/034—Manufacture or treatment of coatings
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/811—Bodies having quantum effect structures or superlattices, e.g. tunnel junctions
- H10H20/812—Bodies having quantum effect structures or superlattices, e.g. tunnel junctions within the light-emitting regions, e.g. having quantum confinement structures
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/822—Materials of the light-emitting regions
- H10H20/824—Materials of the light-emitting regions comprising only Group III-V materials, e.g. GaP
- H10H20/825—Materials of the light-emitting regions comprising only Group III-V materials, e.g. GaP containing nitrogen, e.g. GaN
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/83—Electrodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/83—Electrodes
- H10H20/831—Electrodes characterised by their shape
- H10H20/8316—Multi-layer electrodes comprising at least one discontinuous layer
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H29/00—Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
- H10H29/01—Manufacture or treatment
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H29/00—Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
- H10H29/01—Manufacture or treatment
- H10H29/034—Manufacture or treatment of coatings
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/813—Bodies having a plurality of light-emitting regions, e.g. multi-junction LEDs or light-emitting devices having photoluminescent regions within the bodies
Landscapes
- Led Devices (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Recrystallisation Techniques (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020257010201A KR20250050979A (ko) | 2018-10-09 | 2019-10-08 | Led 어레이 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB1816455.8 | 2018-10-09 | ||
| GBGB1816455.8A GB201816455D0 (en) | 2018-10-09 | 2018-10-09 | LED Arrays |
| PCT/GB2019/052843 WO2020074875A1 (en) | 2018-10-09 | 2019-10-08 | LED Arrays |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020257010201A Division KR20250050979A (ko) | 2018-10-09 | 2019-10-08 | Led 어레이 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20210069101A KR20210069101A (ko) | 2021-06-10 |
| KR102790443B1 true KR102790443B1 (ko) | 2025-04-01 |
Family
ID=64394978
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020217013348A Active KR102790443B1 (ko) | 2018-10-09 | 2019-10-08 | Led 어레이 |
| KR1020257010201A Pending KR20250050979A (ko) | 2018-10-09 | 2019-10-08 | Led 어레이 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020257010201A Pending KR20250050979A (ko) | 2018-10-09 | 2019-10-08 | Led 어레이 |
Country Status (7)
| Country | Link |
|---|---|
| US (2) | US20210335884A1 (enExample) |
| EP (1) | EP3864699A1 (enExample) |
| JP (4) | JP7407181B2 (enExample) |
| KR (2) | KR102790443B1 (enExample) |
| CN (2) | CN121038476A (enExample) |
| GB (1) | GB201816455D0 (enExample) |
| WO (1) | WO2020074875A1 (enExample) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US12426426B2 (en) | 2019-07-19 | 2025-09-23 | Snap Inc. | Arrays of LED structures extending through holes in a dielectric layer and independently activated |
| US12446385B2 (en) | 2023-11-03 | 2025-10-14 | Snap Inc. | Monolithic RGB microLED array |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP4062459A4 (en) * | 2019-11-18 | 2024-02-28 | Avicenatech Corp. | FAST, MULTI-CONTACT LEDS FOR DATA COMMUNICATION |
| FR3112026B1 (fr) * | 2020-06-30 | 2022-09-23 | Aledia | Dispositif optoélectronique et procédé de fabrication |
| CN111864024A (zh) * | 2020-07-24 | 2020-10-30 | 武汉大学 | 一种选区外延生长Micro-LED芯片及其制备方法 |
| JP7591785B2 (ja) * | 2020-12-25 | 2024-11-29 | セイコーエプソン株式会社 | 発光装置の製造方法 |
| EP4085449A1 (en) * | 2021-03-23 | 2022-11-09 | Google LLC | Baseline and shaped pulse driving for micro-light emitting diode display |
| DE102021134107A1 (de) | 2021-12-21 | 2023-06-22 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Verfahren zum herstellen von mikro-halbleiter-leuchtdioden-strukturen und halbleiter-leuchtdiode |
| CN118867079A (zh) * | 2023-04-27 | 2024-10-29 | 苏州晶湛半导体有限公司 | 一种半导体结构及其制作方法 |
| WO2025182431A1 (ja) | 2024-02-26 | 2025-09-04 | セイコーインスツル株式会社 | ボタン型アルカリ一次電池用負極缶、およびボタン型アルカリ一次電池 |
| CN119050125B (zh) * | 2024-08-21 | 2025-08-26 | 西安电子科技大学广州研究院 | 一种多种颜色led阵列及其制备方法 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030087462A1 (en) | 2001-11-02 | 2003-05-08 | Norikatsu Koide | Semiconductor light emitting device and method for producing the same |
| US20100140629A1 (en) * | 2008-12-04 | 2010-06-10 | Lee Chi-Shen | Light-emitting diode and method for fabricating the same |
Family Cites Families (26)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3744211B2 (ja) * | 1997-09-01 | 2006-02-08 | 日亜化学工業株式会社 | 窒化物半導体素子 |
| US6329676B1 (en) * | 1999-03-01 | 2001-12-11 | Toru Takayama | Flat panel solid state light source |
| JP3702700B2 (ja) * | 1999-03-31 | 2005-10-05 | 豊田合成株式会社 | Iii族窒化物系化合物半導体素子及びその製造方法 |
| JP4651161B2 (ja) * | 2000-07-03 | 2011-03-16 | 宣彦 澤木 | 半導体素子およびその製造方法 |
| US7595511B2 (en) * | 2003-08-08 | 2009-09-29 | Sang-Kyu Kang | Nitride micro light emitting diode with high brightness and method of manufacturing the same |
| US7417258B2 (en) * | 2005-04-28 | 2008-08-26 | Sharp Kabushiki Kaisha | Semiconductor light-emitting device, and a method of manufacture of a semiconductor device |
| JP4525500B2 (ja) * | 2005-07-14 | 2010-08-18 | パナソニック電工株式会社 | 半導体発光素子およびそれを用いる照明装置ならびに半導体発光素子の製造方法 |
| KR100869962B1 (ko) * | 2006-12-07 | 2008-11-24 | 한국전자통신연구원 | 전류 확산층을 포함하는 발광소자의 제조방법 |
| JP2009071220A (ja) * | 2007-09-18 | 2009-04-02 | Toyoda Gosei Co Ltd | Iii族窒化物系化合物半導体発光素子 |
| KR100956499B1 (ko) * | 2008-08-01 | 2010-05-07 | 주식회사 실트론 | 금속층을 가지는 화합물 반도체 기판, 그 제조 방법 및이를 이용한 화합물 반도체 소자 |
| JP4586935B2 (ja) * | 2010-03-17 | 2010-11-24 | パナソニック電工株式会社 | 半導体発光素子の製造方法 |
| JP2011258631A (ja) * | 2010-06-07 | 2011-12-22 | Panasonic Corp | 発光ダイオード素子およびその製造方法 |
| CN102709410B (zh) * | 2012-06-04 | 2014-08-27 | 中国科学院半导体研究所 | 纳米柱发光二极管的制作方法 |
| KR101898679B1 (ko) * | 2012-12-14 | 2018-10-04 | 삼성전자주식회사 | 나노구조 발광소자 |
| KR102022266B1 (ko) * | 2013-01-29 | 2019-09-18 | 삼성전자주식회사 | 나노구조 반도체 발광소자 제조방법 |
| US20150137072A1 (en) * | 2013-11-19 | 2015-05-21 | Gwangju Institute Of Science And Technology | Mask for forming semiconductor layer, semiconductor device, and method of fabricating the same |
| KR101452801B1 (ko) * | 2014-03-25 | 2014-10-22 | 광주과학기술원 | 발광다이오드 및 이의 제조방법 |
| KR20160027610A (ko) * | 2014-09-01 | 2016-03-10 | 삼성전자주식회사 | 나노구조 반도체 발광소자 |
| WO2016049507A1 (en) * | 2014-09-26 | 2016-03-31 | Glo Ab | Monolithic image chip for near-to-eye display |
| JP6959919B2 (ja) * | 2015-12-04 | 2021-11-05 | クロミス,インコーポレイテッド | 加工基板上のワイドバンドギャップデバイス集積回路アーキテクチャ |
| KR101837623B1 (ko) * | 2015-12-21 | 2018-03-13 | (재)한국나노기술원 | 질화물 반도체 발광소자 및 그 제조방법 |
| GB201705755D0 (en) * | 2017-04-10 | 2017-05-24 | Norwegian Univ Of Science And Tech (Ntnu) | Nanostructure |
| CN207183308U (zh) * | 2017-09-21 | 2018-04-03 | 山西飞虹微纳米光电科技有限公司 | 基于GaN基轴向纳米棒阵列的LED |
| CN107833878B (zh) * | 2017-11-29 | 2019-06-14 | 北京工业大学 | 一种全色堆栈式外延的Micro-LED倒装阵列制备方法 |
| FR3080487B1 (fr) * | 2018-04-20 | 2020-06-12 | Commissariat A L'energie Atomique Et Aux Energies Alternatives | Procede de fabrication d’un dispositif optoelectronique a matrice de diodes |
| CN111864024A (zh) * | 2020-07-24 | 2020-10-30 | 武汉大学 | 一种选区外延生长Micro-LED芯片及其制备方法 |
-
2018
- 2018-10-09 GB GBGB1816455.8A patent/GB201816455D0/en not_active Ceased
-
2019
- 2019-10-08 KR KR1020217013348A patent/KR102790443B1/ko active Active
- 2019-10-08 WO PCT/GB2019/052843 patent/WO2020074875A1/en not_active Ceased
- 2019-10-08 US US17/250,997 patent/US20210335884A1/en not_active Abandoned
- 2019-10-08 CN CN202511004658.4A patent/CN121038476A/zh active Pending
- 2019-10-08 KR KR1020257010201A patent/KR20250050979A/ko active Pending
- 2019-10-08 EP EP19787394.6A patent/EP3864699A1/en active Pending
- 2019-10-08 CN CN201980066550.4A patent/CN112823421B/zh active Active
- 2019-10-08 JP JP2021519576A patent/JP7407181B2/ja active Active
-
2023
- 2023-12-18 JP JP2023212818A patent/JP7617236B2/ja active Active
-
2024
- 2024-09-27 US US18/900,266 patent/US20250022910A1/en active Pending
-
2025
- 2025-01-06 JP JP2025000067A patent/JP7829745B2/ja active Active
-
2026
- 2026-03-03 JP JP2026032983A patent/JP2026102661A/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030087462A1 (en) | 2001-11-02 | 2003-05-08 | Norikatsu Koide | Semiconductor light emitting device and method for producing the same |
| US20100140629A1 (en) * | 2008-12-04 | 2010-06-10 | Lee Chi-Shen | Light-emitting diode and method for fabricating the same |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US12426426B2 (en) | 2019-07-19 | 2025-09-23 | Snap Inc. | Arrays of LED structures extending through holes in a dielectric layer and independently activated |
| US12446385B2 (en) | 2023-11-03 | 2025-10-14 | Snap Inc. | Monolithic RGB microLED array |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2026102661A (ja) | 2026-06-23 |
| CN112823421A (zh) | 2021-05-18 |
| GB201816455D0 (en) | 2018-11-28 |
| KR20210069101A (ko) | 2021-06-10 |
| EP3864699A1 (en) | 2021-08-18 |
| JP2024026392A (ja) | 2024-02-28 |
| JP2025060989A (ja) | 2025-04-10 |
| JP2022504524A (ja) | 2022-01-13 |
| CN121038476A (zh) | 2025-11-28 |
| US20210335884A1 (en) | 2021-10-28 |
| KR20250050979A (ko) | 2025-04-15 |
| WO2020074875A1 (en) | 2020-04-16 |
| JP7617236B2 (ja) | 2025-01-17 |
| JP7829745B2 (ja) | 2026-03-13 |
| CN112823421B (zh) | 2025-08-08 |
| US20250022910A1 (en) | 2025-01-16 |
| JP7407181B2 (ja) | 2023-12-28 |
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