KR102735423B1 - 구조체 및 가열 장치 - Google Patents

구조체 및 가열 장치 Download PDF

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Publication number
KR102735423B1
KR102735423B1 KR1020227012459A KR20227012459A KR102735423B1 KR 102735423 B1 KR102735423 B1 KR 102735423B1 KR 1020227012459 A KR1020227012459 A KR 1020227012459A KR 20227012459 A KR20227012459 A KR 20227012459A KR 102735423 B1 KR102735423 B1 KR 102735423B1
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KR
South Korea
Prior art keywords
terminal
electrode layer
contact portion
modified example
concave portion
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KR1020227012459A
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English (en)
Korean (ko)
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KR20220062390A (ko
Inventor
야스노리 카와나베
요시히로 코마츠
요시히로 오카와
Original Assignee
교세라 가부시키가이샤
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Publication of KR20220062390A publication Critical patent/KR20220062390A/ko
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Publication of KR102735423B1 publication Critical patent/KR102735423B1/ko
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Classifications

    • H01L21/67103—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H10P72/0432—Apparatus for thermal treatment mainly by conduction
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/02—Details
    • H05B3/03—Electrodes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/20—Heating elements having extended surface area substantially in a two-dimensional [2D] plane, e.g. plate-heater
    • H05B3/22—Heating elements having extended surface area substantially in a two-dimensional [2D] plane, e.g. plate-heater non-flexible
    • H05B3/26—Heating elements having extended surface area substantially in a two-dimensional [2D] plane, e.g. plate-heater non-flexible heating conductor mounted on insulating base
    • H05B3/265—Heating elements having extended surface area substantially in a two-dimensional [2D] plane, e.g. plate-heater non-flexible heating conductor mounted on insulating base the insulating base being an inorganic material, e.g. ceramic
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/20—Heating elements having extended surface area substantially in a two-dimensional [2D] plane, e.g. plate-heater
    • H05B3/22—Heating elements having extended surface area substantially in a two-dimensional [2D] plane, e.g. plate-heater non-flexible
    • H05B3/28—Heating elements having extended surface area substantially in a two-dimensional [2D] plane, e.g. plate-heater non-flexible heating conductor embedded in insulating material
    • H05B3/283—Heating elements having extended surface area substantially in a two-dimensional [2D] plane, e.g. plate-heater non-flexible heating conductor embedded in insulating material the insulating material being an inorganic material, e.g. ceramic
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
    • H05B2203/016—Heaters using particular connecting means

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Resistance Heating (AREA)
KR1020227012459A 2019-10-18 2020-09-25 구조체 및 가열 장치 Active KR102735423B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2019-190776 2019-10-18
JP2019190776 2019-10-18
PCT/JP2020/036476 WO2021075240A1 (ja) 2019-10-18 2020-09-25 構造体および加熱装置

Publications (2)

Publication Number Publication Date
KR20220062390A KR20220062390A (ko) 2022-05-16
KR102735423B1 true KR102735423B1 (ko) 2024-11-28

Family

ID=75537828

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020227012459A Active KR102735423B1 (ko) 2019-10-18 2020-09-25 구조체 및 가열 장치

Country Status (4)

Country Link
US (1) US12525472B2 (https=)
JP (1) JP7368488B2 (https=)
KR (1) KR102735423B1 (https=)
WO (1) WO2021075240A1 (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021075241A1 (ja) * 2019-10-18 2021-04-22 京セラ株式会社 構造体および加熱装置
JP7498605B2 (ja) * 2020-07-01 2024-06-12 日本特殊陶業株式会社 セラミックス部材、保持装置、及びセラミックス部材の製造方法
JP7547282B2 (ja) * 2021-05-20 2024-09-09 京セラ株式会社 セラミック構造体の製造方法
JP7623309B2 (ja) 2022-01-12 2025-01-28 日本碍子株式会社 ウエハ載置台
WO2025041254A1 (ja) * 2023-08-22 2025-02-27 日本碍子株式会社 半導体製造装置用部材

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003245792A (ja) * 2002-02-21 2003-09-02 Sumitomo Electric Ind Ltd 接続構造
JP2004087392A (ja) * 2002-08-28 2004-03-18 Toshiba Ceramics Co Ltd ＡｌＮヒータ及びその製造方法
JP2009188394A (ja) * 2008-01-08 2009-08-20 Ngk Insulators Ltd 接合構造及び半導体製造装置
JP2015002300A (ja) * 2013-06-17 2015-01-05 株式会社Maruwa 接合構造体及びこれを用いた半導体製造装置
JP2018064055A (ja) * 2016-10-14 2018-04-19 日本碍子株式会社 半導体製造装置用部材及びその製法

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0119345Y2 (https=) * 1981-02-21 1989-06-05
JP2002313531A (ja) * 2001-04-17 2002-10-25 Toshiba Ceramics Co Ltd 面状セラミックスヒーター及び製造方法
JP2003040686A (ja) 2001-07-27 2003-02-13 Taiheiyo Cement Corp セラミック部品
JP3854145B2 (ja) * 2001-12-19 2006-12-06 京セラ株式会社 ウエハ支持部材
JP4531004B2 (ja) * 2006-03-24 2010-08-25 日本碍子株式会社 加熱装置
JP4421595B2 (ja) * 2006-11-16 2010-02-24 日本碍子株式会社 加熱装置
US8414704B2 (en) * 2008-01-08 2013-04-09 Ngk Insulators, Ltd. Bonding structure and semiconductor device manufacturing apparatus
US8908349B2 (en) * 2011-03-31 2014-12-09 Ngk Insulators, Ltd. Member for semiconductor manufacturing apparatus
JP6835658B2 (ja) * 2017-04-26 2021-02-24 京セラ株式会社 試料保持具
JP7025268B2 (ja) * 2018-04-04 2022-02-24 日本特殊陶業株式会社 セラミックス構造体
US20210265189A1 (en) * 2018-09-28 2021-08-26 Kyocera Corporation Ceramic structure and wafer system
US12266557B2 (en) * 2021-11-15 2025-04-01 Ngk Insulators, Ltd. Wafer placement table
JP7580429B2 (ja) * 2022-06-10 2024-11-11 日本碍子株式会社 ウエハ載置台

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003245792A (ja) * 2002-02-21 2003-09-02 Sumitomo Electric Ind Ltd 接続構造
JP2004087392A (ja) * 2002-08-28 2004-03-18 Toshiba Ceramics Co Ltd ＡｌＮヒータ及びその製造方法
JP2009188394A (ja) * 2008-01-08 2009-08-20 Ngk Insulators Ltd 接合構造及び半導体製造装置
JP2015002300A (ja) * 2013-06-17 2015-01-05 株式会社Maruwa 接合構造体及びこれを用いた半導体製造装置
JP2018064055A (ja) * 2016-10-14 2018-04-19 日本碍子株式会社 半導体製造装置用部材及びその製法

Also Published As

Publication number Publication date
WO2021075240A1 (ja) 2021-04-22
US20230141651A1 (en) 2023-05-11
KR20220062390A (ko) 2022-05-16
JPWO2021075240A1 (https=) 2021-04-22
JP7368488B2 (ja) 2023-10-24
US12525472B2 (en) 2026-01-13

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