KR102653610B1 - An ultrasonic inspection apparatus for defective elements capable of drying an inspection object and an inspection method using the same - Google Patents

Abstract

The present invention is an ultrasonic inspection system that detects defects in an object through ultrasonic scanning, comprising: a conveyor module that transports the object in a first direction; An ultrasonic scanning module that performs ultrasonic scanning on a subject transported by the conveyor module, comprising an ultrasonic probe array formed to correspond to the arrangement of the subject, and transmitting ultrasonic waves between the ultrasonic probe array and the subject. An ultrasonic scanning module filled with a solvent medium; and a drying module that dries the subject on which ultrasonic scanning has been completed by the ultrasonic scanning module in a preset manner. The drying module further includes: a hot chamber unit that forms a closed space and applies heat to the subject provided through the unloading unit in a preset manner to dry the subject; Provides an ultrasonic inspection system including.

Description

{An ultrasonic inspection apparatus for defective elements capable of drying an inspection object and an inspection method using the same}

The present invention relates to a defective element ultrasonic inspection device capable of drying an inspection object and an inspection method using the same. More specifically, it relates to a system and method for inspecting whether defects exist inside a packaged object using an ultrasonic probe array without damaging it.

A technology that acquires internal images of an object to be examined using signals with a frequency in the ultrasonic wave region can identify internal defects without modifying the medical field or manufacturing results targeting internal organs of the body or the fetus during pregnancy. It is used in a variety of fields such as non-destructive testing (NDT).

Defect detection using ultrasonic inspection can also be performed on semiconductor devices forming complex circuit patterns. Conventionally, ultrasonic inspection could be performed for purposes such as selecting only some of the finished semiconductor devices and calculating the defect rate. However, in relation to autonomous driving technology that has been developing recently, the standards for defect inspection of semiconductors for autonomous vehicles are gradually being strengthened to prevent vehicle accidents due to device defects.

As a prior art, Korean Patent Publication No. 10-2014-0001138, ''Ultrasonic inspection device and ultrasonic inspection method,'' is disclosed. The prior art discloses a structure capable of obtaining a stable inspection image by adjusting the distance between the lens and the surface of the work (meaning 'subject') through a holder and a height adjustment means.

However, since the above-mentioned prior art does not disclose a structure for simultaneously examining multiple subjects, the problem arises that the work speed must be significantly low in fields that require full inspection.

Therefore, in fields that require a very high level of manufacturing quality, such as autonomous driving, full inspection of semiconductor devices, rather than screening, is performed with high inspection precision to detect potential defective elements of semiconductor devices in advance. Development of improved ultrasonic inspection devices that can reduce inspection time may be required.

(Patent Document 1) Korean Patent Publication No. 10-2014-0001138

The technical problem to be solved by the present invention is to propose an ultrasonic inspection system that simultaneously has high inspection precision and fast inspection speed, and a method using the same. In particular, we would like to propose an optimized structure for inspecting and drying multiple subjects simultaneously.

One embodiment of the present invention to solve the above problems is an ultrasonic inspection device that detects defects in a subject through ultrasonic scanning, comprising: a conveyor module that transports the subject in a first direction; An ultrasonic scanning module that performs ultrasonic scanning on a subject transported by the conveyor module, comprising an ultrasonic probe array formed to correspond to the arrangement of the subject, and transmitting ultrasonic waves between the ultrasonic probe array and the subject. An ultrasonic scanning module filled with a solvent medium; and a drying module that dries the subject for which ultrasonic scanning has been completed by the ultrasonic scanning module in a preset manner, forming a closed space, and applying heat to the subject provided through the unloading unit in a preset manner, A drying module including a hot chamber unit for drying the subject; It includes: a main body forming a hollow space; a cover that covers the main body to form a closed space; and a seating jig located within the main body on which at least one subject is seated. Includes, wherein the seating jig is formed in the same arrangement as the shuttle jig provided on the transfer part of the conveyor module for transporting the subject in the first direction, wherein the arrangement form places the subject in an M*N matrix. An ultrasonic inspection device is provided that is seated in an array (M and N are natural numbers).

Additionally, the hot chamber part is formed using a hot air circulation method and can be operated at a preset temperature and time.

In addition, the drying module includes an air drying unit provided at a rear end of the ultrasonic probe array and spraying air onto the subject in an air knife manner; may further include.

In addition, the air drying unit is provided on the conveyor module, is located on an upper side adjacent to the subject, is formed to have a predetermined slope downward, and air can be sprayed downward along the slope.

In addition, the ultrasonic scanning module includes: a first ultrasonic probe array for ultrasonic scanning the upper surface of the subject; and a second ultrasonic probe array for ultrasonic scanning the lower surface of the subject. It includes, based on the first direction, between the first and second ultrasonic probe arrays, a reversal for flipping the subject on which ultrasonic scanning has been completed by the first ultrasonic probe array in a preset manner. module; It may further include, wherein the air drying unit may be provided at rear ends of the first and second ultrasonic probe arrays, respectively.

In addition, the ultrasonic inspection system includes a loader magazine module on which at least one subject is loaded in a preset arrangement; and an unloader magazine module provided with the unloading unit disposed at a rear end of the conveyor module based on the first direction. It includes, wherein the conveyor module is configured to receive the subject from the loader magazine module through a loading unit located on the front end, and the unloading unit moves the subject on the conveyor module to the hot chamber unit, The object under test in the hot chamber can be loaded in a preset arrangement.

Additionally, the unloading unit may be configured as a multi-joint robot arm.

In addition, the conveyor module includes: a first section in which the loader magazine module operates; a second section in which ultrasonic scanning is performed by the first ultrasonic probe array; a third section in which the subject is flipped by the inversion module; a fourth section in which ultrasonic scanning is performed by the second ultrasonic probe array; and a fifth section in which the unloader magazine module is operated; It is divided into, and the first to fifth sections may be formed sequentially along the first direction.

Additionally, the ultrasonic probe array may be provided with a water storage tank, and may be formed in a way that water supplied from the water storage tank is provided on the subject.

In addition, the conveyor module may include a transfer unit extending in the first direction; and a shuttle jig that is movably disposed on the transfer unit and transports the subject in the first direction in a seated state. It includes: the shuttle jig is formed to seat the subject in an array of M*N matrix (M and N are natural numbers), and the ultrasonic probe array is arranged in parallel with the ultrasonic probes corresponding to the M rows. Can be arranged in a structure.

The effects of the present invention are as follows.

In the present invention, instead of a single ultrasonic probe conventionally used for ultrasonic inspection, an ultrasonic probe array of a specific structure consisting of a plurality of probe elements can be used, so surface-based inspection using an array structure rather than the conventional line-based inspection. can be performed, so the accuracy and inspection speed of ultrasonic inspection can be improved.

In addition, the ultrasonic examination system of the present invention effectively dries the ultrasonic transmission medium used during ultrasonic examination in conjunction with the movement of the subject, thereby ensuring the stability of the examined subject.

1 is an overall conceptual diagram of an ultrasonic inspection system according to the present invention.
Figure 2 is a schematic overall perspective view of the ultrasonic inspection system according to the present invention.
Figure 3 is a plan view of an ultrasonic inspection system according to the present invention.
Figure 4 is a perspective view schematically showing the ultrasonic scanning module of the ultrasonic inspection system according to the present invention.
Figure 5 is a schematic diagram schematically showing the ultrasonic probe of the ultrasonic inspection system according to the present invention.
Figure 6 is a reference diagram for explaining a method of generating a boundary pattern image of a subject using an ultrasonic probe array.
Figure 7 is a perspective view schematically showing the inversion module of the ultrasonic inspection system according to the present invention.
Figure 8 is a perspective view schematically showing the conveyor module of the ultrasonic inspection system according to the present invention, together with the alignment confirmation module.
Figure 9 is a block diagram of the drying module of the ultrasonic inspection system according to the present invention.
Figure 10 is a perspective view schematically showing the hot chamber part of the drying module of the ultrasonic inspection system according to the present invention.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. The description below is only intended to specify embodiments and is not intended to limit or limit the scope of rights according to the present invention. What a person skilled in the art related to the present invention can easily infer from the detailed description and examples of the invention should be construed as falling within the scope of rights according to the present invention.

The terms used in the present invention are described as general terms widely used in the technical field related to the present invention, but the meaning of the terms used in the present invention is the intention of the technician working in the field, the emergence of new technology, examination standards, or precedents. It may vary depending on etc. Some terms may be arbitrarily selected by the applicant, in which case the meaning of the arbitrarily selected terms will be explained in detail. Terms used in the present invention should be construed not only in their dictionary meaning, but in a meaning that reflects the overall context of the specification.

Terms such as 'consists of' or 'includes' used in the present invention should not necessarily be interpreted as including all of the components or steps described in the specification, and if some components or steps are not included, And if additional components or steps are further included, they should also be interpreted as intended from the corresponding terms.

The terms described below are terms defined in consideration of functions in the present invention, and may vary depending on the intentions or practices of users, operators, and designers. Therefore, the definition should be made based on the contents throughout this specification.

The 'subject' used herein includes semiconductor devices that are the subject of inspection, as well as all objects that can be inspected using ultrasonic irradiation, and is also called a work. The description herein assumes that the subject has a planar shape, but the shape of the subject is not limited thereto.

Additionally, the 'first direction' used herein refers to the direction in which the conveyor module (rail and belt) extends. In other words, the extension direction of the conveyor module is used herein to mean the transport direction of the subject. Additionally, 'second direction' refers to the width direction of the conveyor module. Based on the horizontal direction, the first direction and the second direction mean mutually perpendicular directions.

In the term 'matrix' used herein, for convenience of explanation, the first direction is used to mean 'column' and the second direction is used to mean 'row'.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. Detailed descriptions of matters widely known to those skilled in the art related to the present invention will be omitted.

Overall configuration of ultrasonic inspection system

1 is an overall conceptual diagram of an ultrasonic inspection system according to the present invention.

Referring to Figure 1, the ultrasonic inspection system according to the present invention is largely comprised of a loader magazine module 101, a conveyor module 110, an ultrasonic scanning module 120, a reversal module 130, and an unloader magazine. magazine) module 102, alignment confirmation module 140, and drying module 150. The drying module 150 will be described separately later.

The loader magazine module 101 loads at least one subject in a magazine state, which is a preset arrangement, and is provided with a loading unit 111 for moving the subject. Specifically, the loading unit 111 may transport the subject within the ultrasound examination system. The loading unit 111 can move the object loaded in the form of a magazine at the front end of the ultrasonic inspection system to the conveyor module 110.

Here, the conveyor module 110 performs the function of an 'ultrasonic inspection stage', and the subject is moved to the shuttle jig 113 on the conveyor module 110 by the loading unit 111 for ultrasonic inspection. At this time, the loading unit 111 may transport the subject to a location for DMC engraving and barcode inspection. As in the illustrated example, the loading unit 111 may be configured in a push-and-pull structure, and magazines may be located on the front side of the conveyor module 110 in predetermined units.

FIG. 2 shows an embodiment in which the magazine is composed of five rows, and the loading unit 111 is configured to transport the magazine in which the object is stacked through a preset guide unit and then seat it on the conveyor module 110. As an example, the loading unit 111 of the ultrasonic inspection system according to the present invention takes 8 seconds to move a unit subject, and assuming that the shuttle jig 113 is a structure capable of seating 8 subjects, the shuttle jig 113 In placing the subject on the jig 113, it takes a short time of 64 seconds in total.

The loading unit 111 may be implemented in the form of a robot arm, or may be implemented in another form of mechanical structure with an element transport function, and is not limited to the form shown in the drawings. Specify.

The conveyor module 110 receives the subject through the loading unit 111 and performs the function of transporting the subject in the first direction.

The conveyor module 110 consists of a transfer unit 112, a shuttle jig 113, and a drive unit 114. The transfer unit 112 supports the shuttle jig 113 to be movable and functions to guide the movement of the shuttle jig 113. To this end, the transfer unit 112 extends in the first direction, and the transfer unit 112 is connected to the drive unit 114 to receive power from the drive unit 114. By the operation of the driving unit 114, the transfer unit 112 moves continuously in the first direction, but stops at each preset individual section to perform ultrasonic inspection.

This will be explained with reference to FIGS. 2 and 3. Regarding the above sections, the conveyor module 110 according to the present invention is largely divided into the following five sections (or areas).

The 'first section' is a section in which the loader magazine module 101 operates.

The 'second section' is a section where ultrasonic scanning is performed by the first ultrasonic probe array 121.

The 'third section' is a section in which the subject is flipped by the inversion module 130.

The 'fourth section' is a section where ultrasonic scanning is performed by the second ultrasonic probe array 122.

The 'fifth section' is a section in which the unloader magazine module 101 operates.

Here, the first to fifth sections are formed sequentially along the first direction, and the processor 160 is configured to control the operation of the driver 114 in conjunction with the driver 114 according to preset conditions. . For example, while ultrasonic scanning is performed by the first ultrasonic probe array 121 in the second section, the drive unit 114 does not operate, thereby maintaining the stationary state of the transfer unit 112. After the ultrasonic examination of the upper surface of the subject is completed by the first ultrasonic probe array 121 and the acquisition of image information is completed, the processor 160 is configured to transmit an operation signal to the driving unit 114.

The shuttle jig 113 is coupled to the transfer unit 112 and provides a space where the subject can be stably seated. That is, the subject is configured to move in the first direction while seated on the shuttle jig 113. At this time, the shuttle jig 113 is formed to seat the subject in an arrangement of an M*N matrix (M and N are natural numbers). 3-5 show an example structure where M=2, N=4. In other words, one unit of shuttle jig 113 can transport a total of eight subjects simultaneously.

As described above, the shuttle jig 113 transports a plurality of subjects simultaneously, and the driving unit 114 operates based on the arrangement of the shuttle jig 113. Instead of moving it continuously, the shuttle jig is moved discontinuously so that ultrasonic inspection (or scanning) is performed one row at a time. That is, it can be moved in the first direction by the scanning unit.

The ultrasonic scanning module 120 is configured to perform ultrasonic scanning on a subject mounted on a shuttle jig 113 moving on the conveyor module 110.

The ultrasonic scanning module 120 includes an ultrasonic probe array (121, 122). The ultrasonic probe arrays 121 and 122 can irradiate a test object with a test signal having a frequency in the ultrasonic range and thereby measure echo signals reflected from the boundary surfaces of each layer of the test object. The ultrasonic probe arrays 121 and 122 may be composed of a plurality of probe elements 124d rather than a single probe, thereby performing 'plane-based' scanning rather than 'line-based' scanning. can do.

In the ultrasonic scanning process, ultrasonic signals and echo signals can be transmitted through an ultrasonic transmission medium. For example, when ultrasonic signals and echo signals are transmitted through an ultrasonic transmission medium such as water, attenuation in the high frequency region can be reduced compared to when transmitted through air, so defect inspection can be performed more smoothly. . In addition to the water exemplified, other suitable types of materials that can prevent signal attenuation can be used as a medium for ultrasonic transmission.

The shape of the ultrasonic probe arrays 121 and 122 is formed to correspond to the shape of the shuttle jig 113, so that ultrasonic inspection efficiency can be maximized. The ultrasonic probe arrays 121 and 122 may be configured in the same manner as the arrangement of the shuttle jig 113 described above. However, considering that the ultrasonic probes are expensive, the ultrasonic probe arrays 121 and 122 are configured with the ultrasonic probes 121a. , 122a) is preferably arranged in a parallel structure corresponding to the M row above.

Referring to FIG. 4, the ultrasonic probe arrays 121 and 122 are formed of dual ultrasonic probes with M=2, and can perform ultrasonic scanning of two units of objects at the same time. At this time, the driving unit 114 is configured to move the shuttle jig 113 by a distance corresponding to the ultrasonic scanning interval. Of course, the ultrasonic probe arrays 121 and 122 may be formed in a structure in which ultrasonic scanning is performed while the shuttle jig 113 is moved in the first direction by the drive unit 114 in a fixed state. However, on the contrary, the ultrasonic probe arrays 121 and 122 may be formed in a fixed state. The probe arrays 121 and 122 may be combined with a separate driving device to perform ultrasonic scanning while moving the ultrasonic probe arrays 121 and 122 in the first direction or in a direction opposite to the first direction. This can be optimally designed depending on the designer's choice.

Meanwhile, the semiconductor substrate of the object under test may have an upper semiconductor pattern formed on the upper surface of the substrate and a lower semiconductor pattern formed on the lower surface of the substrate. For example, depending on the semiconductor packaging design, a substantive detailed circuit pattern among the top and bottom patterns may be formed on one side, and ancillary patterns such as a heat dissipation structure may be formed on the other side.

Considering this, the ultrasonic scanning module 120 can be designed in various ways. For example, the ultrasonic scanning module 120 can be designed in a top-bottom simultaneous measurement method, and as a result, a top image for the top semiconductor pattern and a bottom image for the bottom semiconductor pattern can be generated.

However, when ultrasonic scanning of the upper and lower surfaces is performed simultaneously by an ultrasonic probe array and an additional ultrasonic probe array in the upper and lower simultaneous measurement method, the overall image is blurred due to the influence of ultrasonic scattering due to the three-dimensional structure of the detailed circuit pattern. Since there is a problem with acquisition, it is more desirable to design it with a separate upper and lower measurement method rather than a simultaneous upper and lower measurement method. Below, the explanation is based on the premise of ‘separate measurement method for top and bottom’.

In the 'top and bottom separate measurement method', unlike the above-mentioned top and bottom simultaneous measurement method, after ultrasonic scanning of the upper semiconductor pattern is performed to generate a top image, ultrasonic scanning of the bottom semiconductor pattern is performed to create a bottom image. This is how it is created.

In relation to the upper and lower separate measurement method, in the ultrasonic scanning process, after ultrasonic scanning of the upper surface is performed by the ultrasonic probe arrays 121 and 122, an additional ultrasonic probe is additionally provided to irradiate an ultrasonic signal for defect inspection to the lower surface. Additional ultrasonic scanning of the lower surface can be performed by the array.

The present invention provides an ultrasonic scanning module 120 and an inversion module 130 structure optimized for separate upper and lower measurement methods.

The ultrasonic scanning module 120 consists of a first ultrasonic probe array 121 that ultrasonic scans the upper surface of the subject and a second ultrasonic probe array 122 that ultrasonic scans the lower surface of the subject. Here, the 'upper surface' and 'lower surface' are defined based on the state of the subject before entering the ultrasonic scanning module 120, and may be divided into 'one side' and 'the other side'.

The first ultrasound probe array 121 will be described in detail.

Figures 5 (a) and (b) show an exemplary structure of an ultrasonic probe array, and (c) shows an operation method of the ultrasonic probe array. As shown, because the ultrasonic probe array has an array structure, it can have higher precision and scan speed than a single probe structure.

The ultrasonic probe arrays 121 and 122 may include a plurality of probe elements 121d arranged in a row at a constant pitch, and the size and size of each of the plurality of probe elements 121d and a plurality of probe elements ( The size of the constant pitch of 121d) can be determined according to the scanning time required for each sheet of the subject.

The plurality of probe elements 121d are configured in the form of an oscillator and can generate ultrasonic signals for defect inspection using a method such as phased array ultrasonics. The scanning speed may vary depending on the pitch indicating the arrangement spacing of the plurality of probe elements 121d and the size of each probe element 121d. When other factors are equal, as the pitch increases, the scanning speed may increase but the scanning resolution may decrease.

When full inspection of a large number of devices is required, such as in the case of power module devices for autonomous vehicles, requirements for the time required for each device, that is, scanning speed, may be set. At this time, detailed specifications of the ultrasonic probe array, such as the pitch between probe elements or the size of each probe element, may be changed to meet the required scanning speed.

Referring to (c) of FIG. 5, the ultrasonic probe arrays 121 and 122 can perform ultrasonic scanning on a subject. Planar scanning can be performed on a device having a certain size, for example, 190 mm * 140 mm, one line at each scan interval.

Figure 6 is a reference diagram for explaining a method of generating a boundary pattern image of a subject using an ultrasonic probe array. Referring to FIG. 6, an ultrasonic scanning process 210 and an echo generation process 220 are shown in relation to a method of generating a boundary pattern image of an object using an ultrasonic probe array.

Regarding the ultrasonic scanning process 210, ultrasonic scanning of the subject using the ultrasonic probe arrays 121 and 122 may be performed through an ultrasonic transmission medium. Specifically, the ultrasonic signal for defect inspection may be irradiated to the upper semiconductor pattern through an ultrasonic transmission medium charged between the ultrasonic probe array and the object to prevent attenuation of the ultrasonic signal for defect inspection occurring in the high frequency region, The medium for transmitting ultrasonic waves may be a liquid, and the liquid may be water or other mixtures that facilitate ultrasonic transmission.

Ultrasonic signals for defect inspection by the ultrasonic probe arrays 121 and 122 may be irradiated to the subject through a medium and reflected at the interface between materials. As an example, the object under test may have a three-layer structure of a top semiconductor pattern, a semiconductor substrate, and a bottom semiconductor pattern, and ultrasonic signal reflection may occur at the interlayer interface or the medium-device interface.

As in the echo generation process 220, the reflected ultrasonic signal, that is, the ultrasonic echo signal, may reflect the properties of the interface material. As shown, ultrasonic echo signals with different characteristics may be generated for each type of boundary, and in particular, when a defect exists inside the object, a corresponding ultrasonic echo signal may be generated at the boundary of the defect.

Accordingly, the processor 160 can generate an interface pattern image indicating whether there is any abnormality in the interface pattern or whether there is an internal defect such as a crack or peeling by analyzing the ultrasonic echo signal from the object under test.

Referring again to FIGS. 2 and 3, the inversion module 130 is located between the first and second ultrasonic probe arrays 121 and 122 based on the first direction. The subjects for which ultrasonic scanning has been completed by the first ultrasonic probe array 121 are flipped upside down by the inversion module 130, and are provided to the second ultrasonic probe array 122 in an inverted state. Through this series of processes, the top and bottom separate measurement method can be effectively applied.

If described in detail with reference to FIG. 7, the inversion module 130 is configured to flip the subject on which primary ultrasonic scanning (meaning upper surface scanning) has been completed by the first ultrasonic probe array 121. . As described above, the subject moves while mounted on the shuttle jig 113, and the ultrasonic scanning of one unit of the shuttle jig 113 is completed and the shuttle jig 113 enters the third section. When this is completed, the inversion module 130 operates.

Specifically, the inversion module 130 consists of a flipping unit 131 and a pickup unit 132.

The flipping unit 131 is disposed on the outside of the transfer unit 112 and is configured to flip the subject so that it is upside down. It includes a support body 131a and a rotating body 131b that support the object moved from the pickup unit 132 in the second direction. However, the structure shown in FIG. 7 is an exemplary structure of the flipping unit 131, and any structure can be adopted as long as it can stably rotate the subject.

The support body 131a is formed in a shape corresponding to the shuttle jig 113, and is configured to invert the upper and lower sides of the subject while accommodating a 2*4 subject. The rotating body 131b includes a rotating shaft and is arranged in a direction parallel to the first direction in order to minimize pickup efficiency and the moving line of the pickup unit 132.

The pickup unit 132 is provided on the upper side of the conveyor module 110, moves the subject on the shuttle jig 113 to the flipping unit 131, and flips the subject upside down by the flipping unit 131. It serves to move it to its original position on the shuttle jig (113). That is, the pickup unit 132 couples the object to be inspected on the shuttle jig 113 in a predetermined manner, lifts it upward, and moves in the second direction to support the support 131a of the flipping unit 131. Move the subject upward. The pickup unit 132 may be configured to retrieve objects mounted on one row of the shuttle jig 113. In the case of the shuttle jig 113 that accommodates 2*4 subjects, a process of extracting the subjects in the first row and then the subjects in the second row is necessary.

An exemplary operation of the inversion module 130 will be described. First, the pickup unit 132 pulls out 4 rows (meaning 4) of objects located in the first row of the shuttle jig 113, and then moves them onto the support 131a of the flipping unit 131. (meaning movement in the second direction). Next, the pickup unit 132 moves again to the upper side of the conveyor module 110, takes out the four rows of objects located in the second row of the shuttle jig 113, and then moves them onto the support body 131a. At this time, the subjects in the 4th row located in the 2nd row can be moved to a position parallel to the 1st row that has already been moved to the support 131a.

Next, the first row of subjects arranged on the support 131a are inverted, and then the second row of subjects are inverted, thereby inverting the top and bottom of all the subjects. Finally, the pickup unit 132 completes preparations to enter the second ultrasonic probe array 122 by moving the objects arranged in 2*4 on the support 131a back onto the shuttle jig 113.

The second ultrasonic probe array 122 can complete the upper and lower separate measurement method by performing ultrasonic scanning again on the subject whose upper and lower surfaces are inverted. Since the process performed in the second ultrasonic probe array 122 is the same as that in the first ultrasonic probe array 121 described above, overlapping descriptions will be omitted.

The shuttle jig 113, on which ultrasonic scanning has been completed by the second ultrasonic probe array 122, enters the fifth section by the transfer unit 112. The fifth section refers to the rear end of the transfer unit 112, and the unloading unit 115 of the unloader magazine module 101 reloads the subject for which ultrasonic scanning of the upper and lower surfaces has been completed in a preset arrangement. At this time, it can be loaded in magazine form.

The ultrasonic inspection system according to the present invention includes an alignment confirmation module 140 to confirm the proper alignment of the subject during ultrasonic inspection. The alignment confirmation module 140 consists of first to third alignment units 141, 142, and 143. This will be explained with reference to FIG. 8 .

The first alignment unit 141 is formed through the index sensor 141a provided on the lower side of the shuttle jig 113 and the detection hole 113a formed at a preset position in each of the shuttle jig 113, It is configured to check whether the specimen is in the correct position. The index position can be maintained through two-step speed control of the driving unit 114. Here, the driving unit 114 is composed of a servo motor and can control index moving. Accordingly, the shuttle jig 113 can be moved only a predetermined distance.

The index sensors 141a may be formed in a pair to be spaced apart from each other in the first direction, and the distance between the pair of index sensors 141a may be configured to correspond to the distance between the objects under test.

The second alignment unit 142 uses a detection camera 142a configured to recognize a reference mark preset in each of the shuttle jigs 113 to check whether the subject on the shuttle jig 113 is in the correct position. It is configured to do so. Figure 5 shows a 2*4 matrix of shuttle jigs 113, which have a structure in which a total of 8 subjects can be mounted. After displaying a reference mark corresponding to the shape of the subject in advance in each of the eight spaces, the reference mark is recognized using the detection camera 142a while the subject is mounted on the shuttle jig 113. If the subject deviates from the pre-displayed reference mark, it is determined that the subject is not in the correct position, and the position can be rearranged.

The second alignment unit 142 is preferably provided before the first ultrasonic probe array 121, before the shuttle jig 113 enters the ultrasonic scanning module 120, and can maximize the accuracy of ultrasonic scanning. .

The third alignment unit 143 is formed to correct reference marks preset on each of the shuttle jigs 113 based on image information generated by the ultrasonic probe arrays 121 and 122. The information acquired from the ultrasonic probe arrays 121 and 122 is transmitted to the processor 160 to generate image information. Since the reference mark is confirmed in the image information, the position of the reference mark itself is displayed at the correct position. This is to check whether it has been done. If the position of the reference mark is not in the correct position, the position of the reference mark displayed on the shuttle jig 113 can be corrected.

Meanwhile, the ultrasonic inspection system according to the present invention includes a processor 160 (see Figure 1). The processor 160 controls the components of the ultrasonic inspection system and simultaneously performs computational processing to generate image information based on information transmitted from the ultrasonic scanning module 120.

The processor 160 may generate an internal image of the subject by using the echo signal reflected from the subject. The processor 160 may be implemented in the form of a CPU, GPU, AP, or a combination thereof with a calculation processing function, and may be provided with DRAM, flash memory, SSD, and various other types of memory as needed.

When an internal image of the subject, that is, an interface pattern image, is created, it can be determined what types of manufacturing defects the subject has. For example, it can be determined from the interface pattern image whether manufacturing defects such as direct bonded copper (DBC) cracks, solder voids, epoxy mold compound (EMC) delamination, spacer distortion, DMC voids, and ceramic pattern delamination exist.

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Drying module of ultrasonic inspection system

Hereinafter, with reference to FIGS. 9 and 10, the drying module 150 of the ultrasonic inspection system according to the present invention will be described.

First, referring to FIG. 9, the drying module 150 includes a first air drying unit 151, a second air drying unit 152, and a hot chamber unit 153. The drying module 150 is configured to be controlled in conjunction with the processor 160.

The processor 160 is configured to control the output, direction, time, etc. of the air discharged from the first and second air drying units 152. In addition, the heating state of the hot chamber unit 153 is also configured to be controlled.

The ultrasonic scanning module 120 according to the present invention supplies an ultrasonic transmission medium in a waterfall manner (see FIG. 4), and the ultrasonic transmission medium needs to be dried. For this purpose, air drying units 151 and 152 are provided at the rear ends of the first and second ultrasonic probe arrays 122, respectively, to spray air onto the subject in an air knife manner. In addition, the ultrasonic probe array is provided with a water storage tank (not shown), and is formed by providing water supplied from the water storage tank to the subject.

The air drying units 151 and 152 are provided on the conveyor module 110, are located on the upper side adjacent to the subject, are formed to have a predetermined slope downward, and are configured to spray air downward along the slope. do. By blowing air through the air drying units 151 and 152, the ultrasonic transmission medium remaining in the subject can be dried.

The air drying unit disposed at the rear end of the second section in which the first ultrasonic probe array 121 operates is referred to as the first air drying unit 151. The air drying unit disposed at the rear end of the fourth section in which the second ultrasonic probe array 122 operates is referred to as the second air drying unit 152.

In the fifth section, an additional drying process is performed. A hot chamber unit 153 is provided on the outside of the conveyor module 110, and the subject placed in the shuttle jig by the unloading unit 115 is not loaded directly in the form of a magazine, but is loaded in the hot chamber unit 153. After the drying process is performed, it can be configured to be loaded in the form of a magazine.

Referring to FIG. 10 , if the hot chamber part 153 is described in detail, the hot chamber part 153 includes a main body 153b, a cover 153a, and a seating jig 153c.

The main body 153b is configured to form a hollow space, and the cover 153a is configured to cover the hollow space formed in the main body to form a closed space. The hot chamber unit 153 is connected to a heating means (not shown), and the heating means is configured to be controlled by the processor 160.

Since the subject is dried in a sealed state by the main body 153b and the cover 153a, drying efficiency can be maximized. A seating jig 153c on which the subject is seated is provided inside the main body 153b. The seating jig 153c preferably has a ventilation hole formed so that heated air can circulate in the vertical direction.

The seating jig 153c is formed in the same arrangement as the shuttle jig, and the arrangement may be configured to seat the subject in an M*N matrix arrangement. Through this, it can be effectively moved from the shuttle jig 113 to the seating jig 153c by the unloading unit 115.

Additionally, the hot chamber unit 153 is formed using a hot air circulation method and is operated at a preset temperature and time. As an example, the maximum temperature may be set to 180 degrees and the operation time to 125 seconds or less. The above maximum temperature and operating time may be set differently depending on the characteristics of the subject. When the maximum temperature is exceeded, the operation of the heating means is automatically turned off, and it is preferable that a temperature sensor (not shown) connected to the processor 160 is provided inside the hot chamber portion 153.

To describe the shape of the hot chamber portion 153, the main body 153b may be configured in a box shape with a square horizontal cross-section. Since the shuttle jig 113 and the seating jig 153c are formed in shapes corresponding to each other, it is preferable that the main body 153b is also configured in a shape corresponding to the seating jig 153c. The cover 153a may be made of a transparent material so that the inside of the main body 153b can be viewed from the outside. Accordingly, the worker or manager can visually check the drying process in the hot chamber unit 153 from the outside.

Of course, the details that can be visually confirmed are somewhat limited, but matters related to the safety of work, such as the occurrence of fire or sparks within the main body 153b due to malfunction of the heating means, can be sufficiently confirmed. .

Meanwhile, the unloading unit 115 may be configured as a multi-joint robot arm. Specifically, it may be configured in a belt and eject pusher method. The unloading unit 115 is responsible for the primary movement from the shuttle jig 113 to the seating jig 153c, and performs the secondary movement from the seating jig 153c to the unloader magazine module 102. Here, the primary movement refers to movement for drying work, and the secondary movement refers to movement for magazine loading.

In the present invention, the above embodiment is an example and the present invention is not limited thereto. Anything that has substantially the same structure and achieves the same effect as the technical idea described in the claims of the present invention is included in the technical scope of the present invention.

101: Loader magazine module
102: Unloader magazine module
110: Conveyor module
120: Ultrasonic scanning module
130: Inversion module
140: Alignment confirmation module
150: Drying module
151: First air drying unit
152: Second air drying unit
153: Hot chamber part
160: processor

Claims (10)

An ultrasonic inspection device that detects defects in a subject through ultrasonic scanning,
A conveyor module that transports the subject in a first direction;
An ultrasonic scanning module that performs ultrasonic scanning on a subject transported by the conveyor module; and
A drying module that passes through the ultrasonic scanning module and dries the subject wet by the ultrasonic transmission medium in a preset manner,
The drying module is,
A hot chamber unit that forms a closed space and applies heat to the subject provided through the unloading unit in a preset manner to dry the subject,
The ultrasonic scanning module,
It includes an ultrasonic probe array formed to correspond to the arrangement of the subject transported by the conveyor module,
The drying module is,
It further includes an air drying unit provided at a rear end of the ultrasonic probe array and spraying air to the subject in an air knife manner,
The ultrasonic probe array,
a first ultrasonic probe array for ultrasonic scanning the upper surface of the subject; and
a second ultrasound probe array for ultrasound scanning the lower surface of the subject; Includes,
The air drying unit,
It is provided on the conveyor module, respectively, at the rear end of the first and second ultrasonic probe arrays, and is located on the adjacent upper side of the subject, and is formed to have a predetermined slope downward, and air flows downward along the slope. sprayed towards,
Ultrasound inspection device. In claim 1,
The hot chamber part,
a body forming a hollow space;
a cover that covers the main body to form a closed space; and
a seating jig located within the main body on which at least one subject is seated; containing
Ultrasound inspection device. In claim 1,
The hot chamber part,
It is formed by hot air circulation and operates at a preset temperature and time,
Ultrasound inspection device. delete delete In claim 1,
The ultrasonic inspection device,
A loader magazine module in which at least one subject is loaded in a preset arrangement;
An unloader magazine module provided with the unloading unit disposed at a rear end of the conveyor module based on the first direction; and
a reversal module for flipping an object on which ultrasonic scanning has been completed by the first ultrasonic probe array between the first and second ultrasonic probe arrays in a preset manner, based on the first direction; It further includes,
The conveyor module is,
It is configured to receive the subject from the loader magazine module through a loading unit located on the front end,
The unloading unit,
Moving the subject on the conveyor module to the hot chamber unit and loading the subject in the hot chamber unit in a preset arrangement.
Ultrasound inspection device. In claim 6,
The unloading unit,
Composed of a multi-joint robot arm method,
Ultrasound inspection device. In claim 6,
The conveyor module is,
A first section in which the loader magazine module operates;
a second section in which ultrasonic scanning is performed by the first ultrasonic probe array;
a third section in which the subject is flipped by the inversion module;
a fourth section in which ultrasonic scanning is performed by the second ultrasonic probe array; and
A fifth section in which the unloader magazine module operates; It is divided into
The first to fifth sections are,
Formed sequentially along the first direction,
Ultrasound inspection device. In claim 1,
The ultrasonic probe array,
A water storage tank is provided, and water supplied from the water storage tank is provided to the subject,
Ultrasound inspection device. delete