KR20200113115A - Rinsing And Drying Apparatus For Vertical Typed Continuous Developing System For Board - Google Patents

Abstract

The present invention relates to a substrate cleaning and drying apparatus in a non-contact vertical processing system of a substrate which performs surface treatment while vertically moving a substrate, such as a printed circuit board, while being held by a frame-type jig. According to the present invention, the substrate cleaning and drying apparatus is used for a non-contact vertical processing system of a substrate comprising: a main chamber; a substrate supply unit; a jig transfer device installed inside the main chamber for continuously transferring a jig holding the substrate; a surface treatment unit for spraying a surface treatment liquid onto the surface of the substrate transferred inside the main chamber; a substrate cleaning unit for spraying and supplying cleaning water to the surface of the substrate passing through the surface treatment unit; and a substrate drying unit for removing cleaning water from the surface of the substrate which has passed through the substrate cleaning unit. The walls of a cleaning chamber and a drying chamber, which constitute the cleaning unit and the drying unit, are made of transparent windows so that the inside can be seen. Opening doors are installed on the wall.

Description

Substrate cleaning and drying device for vertical continuous processing system of substrate{Rinsing And Drying Apparatus For Vertical Typed Continuous Developing System For Board}

The present invention relates to a vertical processing system of a substrate, and more specifically, a substrate for cleaning and drying a substrate in a system that performs a surface treatment operation while vertically moving a substrate such as a printed circuit board while holding it with a frame type jig It relates to a washing and drying apparatus.

There are several tasks for processing substrates and several systems to do this. The substrate is a typical printed circuit board used in various electronic products. Printed circuit boards tend to become ultra-thin and large due to the development of technology. Processing a substrate means plating, etching, development, peeling, pretreatment, and the like.

In particular, the phenomenon is a part of photolithography technology, and it is becoming more and more complicated and more difficult with the development of technology in the field. It refers to the work of firstly reproducing the image required on the copper foil of the printed circuit board by peeling off the uncured part of the printed circuit board that has not been changed to a polymer in the pattern exposure by using chemicals.

The development work consists of detailed operations such as inputting, cleaning, drying, chemical treatment, washing and drying (or cutting liquid) several times, pickling and drying (or cutting liquid), heating drying, and discharging the product that has gone through the exposure process. Sodium carbonate is generally used as the developer, and industrial water or electrolyzed water may be used as the washing solution depending on the product used.

The present invention is to improve the existing substrate processing system to increase work efficiency and to build a more economical system for installation and operation.

In a conventional substrate processing system, a jig in the form of a frame has been used to hold a thin substrate. The jig is made of a square frame, and clamps for clamping the upper and lower ends of the substrate are installed at the top and bottom of the jig.

The substrate processing system has a jig transfer device for continuously transferring the jig. The jig transfer device continuously drives the jig similar to a conveyor.

The substrate is subjected to a considerable load during the transfer process. The substrate is continuously supplied with surface treatment liquid, washing water, and compressed air that are strongly sprayed from the spray nozzle.

A conventional substrate post-treatment apparatus includes a cleaning and drying apparatus in which cleaning water is sprayed onto the surface of a substrate in motion to remove the surface treatment liquid buried on the surface, and then air is sprayed to dry it. The conventional washing and drying apparatus includes a spray nozzle, but the washing and drying ability was not good. If the cleaning and drying capabilities are insufficient, the developer and the cleaning water remain on the substrate, resulting in a problem that stains are formed on the substrate after the operation is completed.

Korean Patent Application No. 10-2016-0115157 Korean Patent Application No. 10-2007-0088002

An object of the present invention for the above problems is a cleaning and drying apparatus having improved cleaning and drying capabilities as installed in a system that performs surface treatment while vertically moving a substrate such as a printed circuit board while holding it with a frame type jig. To provide.

It is a specific object of the present invention, by improving the cleaning power, it is possible to cleanly clean foreign substances present on the substrate with a small flow rate; It is to provide a substrate cleaning and drying apparatus capable of preventing stains from occurring on the substrate upon completion of the work.

The above object is a main chamber installed in the form of a box on the upper portion of the base frame to provide a continuous working space in a straight line; A substrate supply unit supplying a substrate into the main chamber; A plurality of jigs for gripping the edge of the thin substrate with a clamp so that the work can be performed in a state that is held taut; A jig transfer device installed in the main chamber and configured to continuously transfer the jig holding the substrate; A surface treatment unit for spraying a surface treatment liquid onto the surface of the substrate transferred inside the main chamber by the jig transfer device; A substrate cleaning unit for spraying and supplying cleaning water to the surface of the substrate passing through the surface treatment unit; As used in a non-contact vertical processing system of a substrate having a substrate drying unit for removing cleaning water from the surface of the substrate passing through the substrate cleaning unit;

A cleaning chamber that provides a plurality of cleaning spaces for cleaning several times while the substrate passing through the surface treatment unit is continuously moved; A washing water supply unit supplying washing water into the washing chamber; A cleaning water spraying unit for spraying and supplying the cleaning water to the moving substrate surface; A drying chamber installed at a rear end of the cleaning chamber and providing a drying space for drying a substrate that has passed through the cleaning chamber continuously and drying several times; A compressed air supply unit for supplying compressed air into the drying chamber; Comprising a compressed air injection unit for supplying the supplied compressed air to the substrate;

The walls of the cleaning chamber and the drying chamber are made of transparent windows so that the inside can be seen; A substrate cleaning and drying apparatus in a vertical continuous processing system of substrates, characterized in that an opening and closing door is installed on the wall, is provided.

According to another feature of the present invention, the washing water spraying unit is installed so as to be perpendicular to the ground; Including; a plurality of spray nozzles arranged at regular intervals along the washing water spray pipe;

The spray nozzle may be installed to spray the washing water in an oblique direction with respect to the transfer direction of the substrate.

"와 같이 기다란 타원 형태로 되어 있으며, 수직선에 대하여 경사지게 배열되어 있으며, 이류체 분사노즐일 수 있다. According to another feature of the present invention, the injection nozzle has an injection area "

It is in the form of an elongated ellipse, and is arranged obliquely with respect to a vertical line, and may be a two-fluid injection nozzle.

According to another feature of the present invention, the compressed air injection unit may include a clamp injection unit to inject compressed air to the clamp holding the substrate. This allows washing water to be blown out of a clamp having a complex structure.

According to the above configuration, improved substrate cleaning and drying for a non-contact vertical processing system of a substrate for transferring a jig in a system that performs surface treatment while vertically moving a substrate such as a printed circuit board with a frame type jig. A device is provided.

More specifically, the cleaning and drying chamber is transparent so that the situation of the operation can be directly seen, so it is easy to manage, and the opening and closing door is installed, which is advantageous for maintenance and repair; It is possible to increase the cleaning effect by using the air jet nozzle; A substrate cleaning and drying apparatus with improved functions such as minimizing stains on a substrate by imparting a self-cleaning function to the clamp is provided. Other effects of the present invention will be further embodied through the following description.

1 is an overall plan configuration diagram of a vertical continuous processing system for a substrate to which a substrate cleaning and drying apparatus of the present invention is applied.
2 is a longitudinal sectional view of a cleaning unit in a substrate cleaning and drying apparatus according to an embodiment of the present invention.
3 is a cross-sectional plan view of a cleaning unit in a substrate cleaning and drying apparatus according to an embodiment of the present invention.
FIG. 4 is a configuration diagram showing a spraying form of a spray nozzle of a cleaning unit in a substrate cleaning and drying apparatus according to an embodiment of the present invention.
5 is a front configuration diagram of a drying unit in a substrate cleaning and drying apparatus according to an embodiment of the present invention.

Hereinafter, specific contents of the present invention will be described in detail with reference to the accompanying drawings. Reference will be made to FIG. 1 by default, and the remaining drawings will be referred to where necessary.

First, a configuration of a plate non-contact vertical processing system to which a jig inspection apparatus (hereinafter, referred to as a “jig inspection apparatus”) of a non-contact vertical continuous processing system of a substrate according to the present invention is applied will be briefly described with reference to FIG. 1.

The main chamber 1 is installed in the form of a box so as to provide a continuous working space in a straight line. The substrate supply unit 3 supplies a substrate into one side of the main chamber 1. The plurality of jigs 5 (refer to FIG. 2) grips the edge of the thin substrate P with the clamp 6 so that the work can be performed in a state where it is held tight. The surface treatment unit 7 sprays the surface treatment liquid L onto the surface of the substrate P transferred inside the main chamber 1. The cleaning unit 9 and the drying unit 11 perform cleaning and drying by spraying and supplying cleaning water and air to the surface of the substrate that has passed through the surface treatment unit 5. The jig transfer unit 13 transports the jig holding the processed substrate P toward the substrate supply unit 3, and the substrate recovery unit 15 recovers the substrate P from the jig 5 Transfer to the subsequent process.

According to the present invention, a buffer unit 17 is provided at one or more of the boundary points of the substrate supply unit, the surface treatment unit, the cleaning unit, the drying unit, and the jig transfer unit. As shown, the buffer unit 17 is provided at all points of each boundary point. The buffer unit 17 has a width capable of accommodating 1 to 3 jigs 5 at the same time.

The jig inspection apparatus of the present invention is a device for inspecting the abnormality of a jig in use in a system, in particular its clamp. The jig inspection device 17 includes the inside of the main chamber 1, in particular, the substrate supply unit 3, the surface treatment unit 7, the substrate cleaning unit 9, the substrate drying unit 11 and the jig transfer unit 13, respectively. It is installed at one or more of the branches. Furthermore, it is installed in one or more of the buffer units 17. In some cases, it may also be installed on the jig transfer unit 13. Hereinafter, the substrate cleaning and drying apparatus will be described with further reference to FIGS. 2 to 6.

First, the substrate cleaning unit 9 will be described with reference to FIGS. 2 to 4.

The substrate cleaning unit 9 includes a cleaning chamber 19, a cleaning water supply unit 21, and a cleaning water spraying unit 23. Of course, a drain portion (not shown) for discharging the used washing water should be at the bottom of the washing chamber 19.

The cleaning chamber 19 provides a plurality of cleaning spaces R in which the substrate P that has passed through the surface treatment unit 7 is continuously moved and cleaned several times. Each cleaning space R may be partitioned by a partition plate 25 except for a passage W through which a jig can pass. It is to perform an independent cleaning operation for each cleaning space (R). 2 is a representation of a part of the cleaning unit 9.

According to an embodiment of the present invention, the cleaning chamber 19 is composed of 6 to 8 unit cleaning chambers 19a, 19b, 19c, 19d, 19e, 19f, 19g, 19h, and each unit cleaning chamber 19a, etc. It can be installed in the interior lighting (27). In addition, two or more types of lighting colors of the internal lighting 27 installed in the unit cleaning chamber 19a, etc. may be combined. For example, a daylight color LED lighting may be installed in some unit cleaning chambers 19a, 19b, 19c, 19d, 19e, and a fluorescent color LED lighting may be installed in the remaining unit cleaning chambers 19f, 19g, 19h. This is to facilitate the identification of foreign substances by the naked eye, and to allow the manager to immediately determine the progress of the substrate P.

The washing water supply unit 21 supplies washing water into the washing chamber 19. Washing water may be separately supplied to each unit washing chamber 19a. The washing water supplied to each unit washing chamber 19a may have different components. The wall of the cleaning chamber 19 is configured to be able to see the inside because it is a transparent window, and an opening/closing door 29 may be installed on the wall.

Meanwhile, an opening/closing shutter 26 for selectively opening or closing the passage W may be installed in the diaphragm 25 of the cleaning chamber 19. The opening/closing shutter 26 is an elongate plate body suitable for the passage and is rotatably installed with the vertical pole 28 as an axis. The vertical pole 28 is rotatably installed by a shutter cylinder 28a installed on the ceiling of the cleaning chamber 19. That is, the opening and closing shutter 26 opens or closes the passage by the shutter cylinder 28a. This is to prevent the cleaning liquid scattering from the cleaning chamber 19 from spreading to other adjacent spaces.

The jig detection sensor 30 senses that the jig 5 moving along the guide 32 approaches the diaphragm 25 and gives a signal, and the shutter cylinder 28a opens the open/close shutter 26 by this signal. Open and close

The opening/closing shutter 26 may be respectively installed in each unit cleaning chamber 19a, or may be installed only at the start and end points of the cleaning unit 9, if necessary. And in some cases, it may be installed in other parts, such as a surface treatment unit or a drying unit.

"와 같은 기다란 타원 형태로 되어 있으며, 수직선에 대하여 경사지게 배열되어 있다. 그리고 분사노즐(33)은 에어와 순수를 동시에 분사하는 이류체 분사노즐을 포함할 수 있다. 이류체 분사노즐은 분사되는 세정수의 입자를 더 작게 함으로써 세밀한 세정을 가능하게 한다. 이류체 분사노즐은 세정부 전체에 대하여 일부 구간에만 설치될 수 있다. The washing water spraying unit 23 is for spraying and supplying the supplied washing water to the moving surface of the substrate P. The washing water injection unit 23 includes a washing water injection pipe 31 installed to be perpendicular to the ground, and a plurality of injection nozzles 33 disposed along the washing water injection pipe 31 at regular intervals. The spray nozzle 33 may be installed to spray the washing water in an oblique direction with respect to the transfer direction M of the substrate. According to an embodiment of the present invention, as shown in FIG. 4, the injection area 35 of the injection nozzle is "

"It is in the form of an elongated ellipse, and is arranged obliquely with respect to a vertical line. And the injection nozzle 33 may include a two-fluid injection nozzle that simultaneously injects air and pure water. Fine cleaning is possible by making the number of particles smaller The air jet nozzle can be installed in only a part of the cleaning section.

Hereinafter, the substrate drying unit 11 will be described with reference to FIG. 5.

The substrate drying unit 11 is installed at the rear end of the substrate cleaning unit 9 and includes a drying chamber 37, a compressed air supply unit 39, and a compressed air injection unit 41. The drying chamber 37 is installed at the rear end of the cleaning chamber 19, and a plurality of independent drying spaces T that allow the substrate P passing through the cleaning chamber 19 to be dried several times while continuously moving. Provides.

The compressed air supply unit 39 supplies compressed air into the drying chamber 37. The compressed air injection unit 41 sprays and supplies the supplied compressed air to the substrate P using the substrate injection nozzle 43. According to the present invention, in order to prevent stains, the temperature of compressed air is adjusted to a temperature below room temperature and then sprayed.

The wall of the drying chamber 37, like the cleaning chamber 19, has a transparent window so that the interior can be seen, and an opening and closing door may be installed on the wall to access the interior.

According to an embodiment of the present invention, the compressed air injection unit 41 may include a clamp injection unit 45 to inject compressed air to the clamp 6 holding the substrate. Thereby, washing water is blown out of the clamp 6 having a complicated structure.

The clamp injection unit 45 includes a clamp injection nozzle 47 provided separately from the substrate injection nozzle 43. The clamp injection nozzle 47 may receive compressed air separately from the compressed air supply unit 39.

The clamp injection unit 45 may detect the substrate P entering the drying chamber 37 with a sensor and inject compressed air to the clamp 6 in a purge manner at a precise time and position.

The substrate injection nozzle 43 is installed along the extension direction of the plurality of nozzle bars 49 installed inclined at a predetermined angle with respect to the transfer direction of the substrate. The substrate spray nozzle 43 may be in the form of an air knife.

The substrate drying unit 11 may also be composed of several unit drying chambers 37a, 37b, 37c, 37d, and 37e. In some unit drying chambers (for example, 37a, 37b, 37c), relatively low temperature air is supplied to remove the washing water, and the remaining unit drying chambers (37d, 37e) are dried by supplying relatively high temperature air. Can be done.

Here, the low temperature may be a temperature equivalent to room temperature and may be 20 to 35°C, and the high temperature may be 60 to 85°C. A cooling device (not shown) may be added to create low-temperature air. By supplying low temperature air, stains on the substrate can be minimized or removed.

The configuration shown and described above is only a preferred embodiment based on the technical idea of the present invention. Those skilled in the art will be able to implement various modifications based on common technical knowledge, but it should be noted that this may be included in the protection scope of the present invention.

1: main chamber 3: substrate supply unit
5: jig 6: clamp
7: surface treatment unit 9: cleaning unit
11: drying unit 13: jig transfer unit
15: substrate recovery unit 17: buffer unit
19: washing chamber 21: washing water supply
23: washing water injection part 25: diaphragm
26: opening and closing shutter 27: lighting
30a: shutter cylinder 31: washing water injection pipe
33: (washing water) spray nozzle 35: spray area
37: drying chamber 39: compressed air supply
41: compressed air injection unit 43: substrate injection nozzle
45: clamp injection unit 47: clamp injection nozzle
49: nozzle bar 51: air nozzle
P: substrate W: passage

Claims (5)

A main chamber installed in the form of a box on the upper part of the base frame to provide a working space that is continuous in a straight line; A substrate supply unit supplying a substrate into the main chamber; A plurality of jigs for gripping the edge of the thin substrate with a clamp so that the work can be performed in a state that is held taut; A jig transfer device installed in the main chamber and configured to continuously transfer the jig holding the substrate; A surface treatment unit for spraying a surface treatment liquid onto the surface of the substrate transferred inside the main chamber by the jig transfer device; A substrate cleaning unit for spraying and supplying cleaning water to the surface of the substrate passing through the surface treatment unit; As used in a non-contact vertical processing system of a substrate having a substrate drying unit for removing cleaning water from the surface of the substrate passing through the substrate cleaning unit;
A cleaning chamber that provides a plurality of cleaning spaces for cleaning several times while the substrate passing through the surface treatment unit is continuously moved; A washing water supply unit supplying washing water into the washing chamber; A cleaning water spraying unit for spraying and supplying the cleaning water to the moving substrate surface; A drying chamber installed at a rear end of the cleaning chamber and providing a drying space for drying a substrate that has passed through the cleaning chamber continuously and drying several times; A compressed air supply unit for supplying compressed air into the drying chamber; Comprising a compressed air injection unit for supplying the supplied compressed air to the substrate;
The walls of the cleaning chamber and the drying chamber are made of transparent windows so that the inside can be seen; A substrate cleaning and drying apparatus in a vertical continuous processing system for substrates, characterized in that an opening and closing door is installed on the wall.
The method of claim 1,
The washing water spraying unit is a washing water spray pipe installed to be perpendicular to the ground; Including; a plurality of spray nozzles arranged at regular intervals along the washing water spray pipe;
The spray nozzle is a substrate cleaning and drying apparatus in a vertical continuous processing system of a substrate, characterized in that installed to spray the washing water in a direction oblique to the transfer direction of the substrate.
The method of claim 1, wherein the compressed air injection unit comprises a spray nozzle;
The injection nozzle;
The spray area is "

A substrate cleaning and drying apparatus in a vertical continuous processing system of a substrate, characterized in that it has an elongated oval shape, is arranged obliquely with respect to a vertical line, and has a two-fluid spray nozzle in some sections.
The method of claim 1,
The compressed air injection unit includes a clamp injection unit to inject compressed air to a clamp holding the substrate, thereby blowing cleaning water from the clamp. A substrate cleaning and drying apparatus in a vertical continuous processing system of a substrate.
The method of claim 1,
The substrate drying unit is composed of several unit drying chambers;
In some unit drying chambers, the washing water is removed by supplying low-temperature air with a temperature of 20 to 35°C;
A substrate cleaning and drying apparatus in a vertical continuous processing system of a substrate, characterized in that the remaining unit drying chambers are dried by supplying high-temperature air having a temperature of 60 to 85°C.

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