JP2004056039A - Surface treatment apparatus for printed wiring board - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To prevent a printed wiring board from being dried by shortening a passage time of the printed wiring board passing through a liquid drainer, and achieve liquid draining without bringing a treatment solution into a next tank or bringing the treatment solution from a previous tank. <P>SOLUTION: The surface treatment apparatus for a printed wiring board conveys the printed wiring board 1 horizontally, and successively moving the printed wiring board 1 through a first treatment tank 13 and a second treatment tank 14 each containing a different treatment solution, and the treatment solution is sprayed to front and back surfaces of the printed wiring board 1 to achieve surface treatment. In the surface treatment apparatus, there is formed an opening 11 in a tank partition plate 2 serving to partition the adjacent first and second treatment tanks 13, 14, through which the printed wiring board 1 passes, and there is further provided a liquid draining unit 3 for spraying compressed air 10 to the front and back surfaces of the printed wiring board 1 passing a region of the opening 11. There is performed liquid draining for the residiual treatment solution on the printed wiring board 1 before it is conveyed to the second treatment tank 14. <P>COPYRIGHT: (C)2004,JPO

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a surface treatment apparatus for a printed wiring board, and in particular, when performing surface treatment while conveying the printed wiring board in a horizontal direction, a treatment attached to the surface of the printed wiring board between a pretreatment tank and a post-treatment tank. The present invention relates to an improvement of a liquid draining mechanism for preventing a liquid from being taken in or taken out.
[0002]
[Prior art]
Conventionally, in a manufacturing process of a printed wiring board, a soft etching liquid is sprayed on a printed wiring board conveyed by a conveyor device to perform a soft etching of a copper surface, and then a soft etching liquid accumulated on the printed wiring board by a draining roller. Then, there is a step of cleaning the printed wiring board by transporting the printed wiring board to a washing tank.
[0003]
Usually, a plurality of processing tanks having different processing liquids such as an etching liquid and a cleaning liquid are sequentially transported by a conveyor device to continuously perform surface treatment of a printed wiring board. This conventional surface treatment apparatus will be described with reference to the drawings. FIG. 7 is a configuration diagram of the main part.
[0004]
In FIG. 7, the conventional apparatus is composed of a soft etching tank 30, a liquid draining section 31, and a washing tank 32 in order from the conveying direction of the printed wiring board 21, as shown in, for example, JP-A-1-117389. A partition plate 33 is provided between the soft etching tank 30 and the liquid removing section 31 and between the liquid removing section 31 and the washing tank 32. First, the printed wiring board 21 is carried into the soft etching tank 30 by a roller conveyor constituted by transport rollers 25, and the upper and lower surfaces of the printed wiring board 21 are showered by the soft etching liquid 22 sprayed from the soft etching liquid spray nozzle 24. Is subjected to soft etching. At this time, the soft etching solution 22 a is applied to the upper and lower surfaces of the printed wiring board 21, and the soft etching solution 22 b accumulates in the through holes 23.
[0005]
In this state, the printed wiring board 21 is transported to the liquid removing section 31, and the liquid removing roller 26 removes the soft etching liquid 22 a accumulated on the upper and lower surfaces of the printed wiring board. Subsequently, an air supply unit (not shown) is activated, and air is blown onto the upper surface of the printed wiring board 21 through an air pipe 29 having an air blowing port 28 to blow off the soft etching solution 22b accumulated in the through hole 23. Subsequently, the printed wiring board 21 from which the soft etching solutions 22a and 22b have been removed is transported to a washing tank 32, and washed by a washing spray nozzle 27.
[0006]
[Problems to be solved by the invention]
However, the conventional surface treatment apparatus has the following problems. The first problem is that when the printed wiring board to be conveyed is drained, the printed wiring board is brought into contact with a pair of upper and lower cylindrical liquid draining rollers to perform liquid draining. Abrasions, or cause the generation of foreign matter.
[0007]
The second problem is that the liquid draining part is separated by a processing tank (for example, a soft etching tank) performing a spraying process, a partition plate, and a pair of upper and lower liquid draining rollers. It takes time to blow air on the printed wiring board conveyed to the liquid draining unit, during which time the front and back surfaces of the conveyed printed wiring board and the inside of the through hole dry, and in the next processing tank according to the degree of drying This means that the processing conditions must be changed.
[0008]
The present invention has been made in order to solve these problems, and abolished the use of a draining roller and performed only draining by air blowing, thereby reducing the occurrence of scratches and foreign substances on the printed wiring board by the draining roller. At the same time, the distance of the liquid drain section is shortened, thereby shortening the passage time of the printed wiring board passing through the liquid drain section, preventing the printed wiring board from drying, bringing the processing solution into the next tank and from the previous tank. It is an object of the present invention to provide a surface treatment apparatus for a printed wiring board, which can perform liquid removal without taking out.
[0009]
[Means for Solving the Problems]
The present invention conveys a printed wiring board in a horizontal direction, sequentially moves between a plurality of processing tanks having different processing liquids, and sprays a processing liquid on the front and back surfaces of the printed wiring board to perform surface treatment. In the surface treatment apparatus, an opening through which a printed wiring board passes is provided in a tank partition plate that partitions between the adjacent processing tanks, and a liquid draining unit that blows compressed air to the front and back surfaces of the printed wiring board that passes through the opening area. It is provided so that the processing liquid staying on the printed wiring board before being transported to the next tank can be drained.
[0010]
Further, the liquid draining unit in the present invention is configured to include a partition cover provided so as to cover both sides of the tank partition plate around the opening area, and the partition cover is provided on the pretreatment tank side. An opening serving as an inlet to the liquid draining unit and an opening serving as an outlet from the liquid draining unit are provided on the post-treatment tank side.
[0011]
Further, the liquid draining unit of the present invention has a pair of headers attached to the tank partition plate so as to sandwich the printed wiring board to be conveyed up and down at the opening, and the header has a hollow portion into which compressed air is sent. A plurality of air spray holes are provided for blowing compressed air from the cavity vertically to the printed wiring board,
The air spray holes are arranged in a row above and below the opening, respectively.
The liquid draining unit is provided with suction ports for suctioning and removing the processing liquid mist generated during the liquid draining on both sides of the partition plate.
[0012]
Further, in the present invention, a viscometer for measuring the viscosity of the processing liquid is installed in a processing liquid tank for storing the processing liquid for spraying, and air pressure is adjusted in the middle of a compressed air pipe for supplying compressed air to a liquid draining unit. A unit is provided, and the air pressure adjusting unit adjusts the pressure of the compressed air according to a signal from the viscometer, and performs liquid drainage at a compressed air pressure according to the viscosity of the processing liquid. And the inside of the through hole is drained at the same time as the draining of both sides.
[0013]
BEST MODE FOR CARRYING OUT THE INVENTION
Next, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a configuration diagram of a surface treatment apparatus for a printed wiring board according to an embodiment of the present invention. In the surface treatment apparatus of the present invention, as shown in FIG. 1, the printed wiring board 1 is conveyed horizontally by a conveyor roller 12 and firstly enters a first treatment tank 13 (for example, a soft etching tank), and is sprayed with a treatment liquid. Soft etching is performed by an etchant shower sprayed from the nozzle 16. Subsequently, before the printed wiring board 1 is transported to the second processing tank 14 (for example, a washing tank), the printed wiring board 1 is drained from the tank partition plate 2 that separates the first processing tank 13 and the second processing tank 14 from each other. Pass through unit 3. Then, a shower of a cleaning liquid is sprayed from the washing spray nozzle 17 onto the printed wiring board 1 sent to the second processing tank 14 to perform surface treatment of the printed wiring board 1.
[0014]
In the present invention, the liquid draining unit provided between the first processing tank and the second processing tank makes a pair of upper and lower cylindrical liquid draining rollers rotate and contact the surface of the printed wiring board as in the related art to perform liquid draining. Instead, the liquid is drained only by the compressed air spouted from the opening of the tank partition plate. Next, a specific structure of the liquid draining unit, which is a feature of the present invention, will be described with reference to FIGS. 2, 3, and 4. FIG.
[0015]
FIG. 2 is a configuration diagram of the liquid draining unit shown in FIG. As shown in FIG. 2, the liquid draining unit 3 is provided at an intersection where the tank partition plate 2 that vertically separates the first processing tank 13 and the second processing tank 14 and the horizontal transfer surface of the printed wiring board 1 are orthogonal to each other. And is surrounded by a partition cover 15. The partition cover 15 is provided so as to surround the tank partition plate 2 from both left and right sides around the intersection, and to surround the horizontal transport surface of the printed wiring board 1 from above and below, and constitutes the liquid drain unit 3. .
[0016]
The tank partition plate 2 is provided with an opening 11 large enough to allow the printed wiring board 1 to be horizontally conveyed. The opening 11 is provided with a large number of small-diameter air spray holes 5 for ejecting the compressed air 10 vertically from both the front and back surfaces of the printed wiring board 1 passing therethrough. A compressed air pipe 9 for supplying compressed air 10 is connected to the air spray hole 5, and a suction port for discharging a mist of the processing liquid by jetting the compressed air 10 is provided in the partition cover 15. 6 are provided on the first processing tank 13 side and the second processing tank 14 side, respectively, with the tank partition plate 2 interposed therebetween. The mist of the processing liquid is supplied from the suction port 6 to the mist catcher 7 provided outside the partition cover 15. This prevents the diffusion of the processing liquid between the processing tanks having different spray processing liquids.
[0017]
Next, the structure of the liquid drain unit will be described in detail with reference to FIGS. FIG. 3 is a front view, and FIG. 4 is a side view. 3 and 4, the opening 11 formed in the tank partition plate 2 is dimensioned as close as possible to the extent that it does not hinder the printed wiring board 1 passing both in width and height. The opening 11 is formed by vertically providing a rectangular parallelepiped header 8 having substantially the same thickness as the tank partition plate 2. A cavity 4 is formed inside each of the pair of upper and lower headers 8, a compressed air pipe 9 for sending compressed air is connected to the cavity 4, and the header 4 is vertically directed toward both the front and back surfaces of the printed wiring board 1. A plurality of air spray holes 5 for jetting compressed air 10 are formed in a line on the surface of the upper and lower headers 8 on the opening 11 side. The liquid draining unit 3 is configured by installing the header 8 having such a structure up and down with respect to the transport printed wiring board 1.
[0018]
Next, the operation of the liquid draining unit will be described. As shown in FIG. 2, the printed wiring board 1 conveyed in the first processing tank 13 by the conveying roller 12 is etched on both front and back surfaces by jetting the processing liquid from the processing liquid spray nozzle 16. The processing liquid is sent from a processing liquid tank (not shown) to the compressed air pipe 9 via a pump, and is jetted from a processing liquid spray nozzle 16. Conventionally, the etching liquid adhering to the surface of the printed wiring board was drained immediately by passing through a drip roller here, but in the present invention, since the drip roller is not provided, the printed wiring board 1 is not provided. Is transported to the liquid draining unit 3 provided in the tank partition 2 as it is after etching.
[0019]
In the liquid draining unit 3, compressed air 10 is jetted from the air spray holes 5 of the header 8 toward the front and back surfaces of the printed wiring board 1 and in a straight line in a direction perpendicular to the conveying surface, so that the printed wiring board 1 is separated from the tank partition plate. Non-contact drainage takes place in a short time passing through two very short gaps. The draining is performed not only on the processing liquid adhering to the front and back surfaces of the printed wiring board, but also on the processing liquid accumulated in the through holes. In addition, at the time of draining, the processed etching liquid (mist) scattered by the compressed air 10 is always sucked from the suction port 6 through the mist catcher 7, and all the mist in the partition cover 15 is discharged. This prevents the mist from being taken out of the first processing tank 13 and at the same time prevents the mist from being brought into the second processing tank 14. Next, the printed wiring board 1 that has passed through the liquid draining unit 3 is conveyed to the washing tank of the second processing tank 14 and washed by the washing spray nozzle 17.
[0020]
Next, another embodiment of the present invention will be described. In this embodiment, the basic configuration is the same as that of the above-described embodiment, but the pressure and flow rate of compressed air supplied to the cavity of the header provided on the tank partition plate that separates the spray processing tanks having different surface treatments are provided. The device is further devised so that it can be controlled. FIG. 5 is a configuration diagram of the control system.
[0021]
As shown in FIG. 5, the processing liquid in the processing liquid tank 19 is pressurized by the pump P and jetted from the processing liquid spray nozzle 16 toward both the front and back surfaces of the printed wiring board 1 being conveyed (the upper surface in the figure). Side only). The primary side compressed air pipe is connected to the header 8 of the liquid draining unit 3 through the air pressure adjusting unit 18 and the compressed air pipe 9, and the compressed air 10 pressure-adjusted by the air pressure adjusting unit 18 is supplied to the air of the header 8. The spray is sprayed from the spray hole 5 toward both the front and back surfaces of the printed wiring board 1 (only the upper surface is shown in the figure) to drain the processing liquid attached to the printed wiring board 1 and the processing liquid accumulated in the through holes. .
[0022]
Further, a viscometer 20 is provided in the processing liquid tank 19, and the air pressure is controlled by the air pressure adjusting unit 18 based on a signal from the viscometer 20. As shown in FIG. 6, the air pressure adjusting unit 18 is composed of a normal solenoid valve, a regulator, and the like. The pressure and flow rate of the compressed air 10 blown out from the liquid draining unit 3 according to the change in the viscosity of the processing liquid in the processing liquid tank 19. Can be adjusted. By doing so, it is possible to drain the processing liquid retained on the printed wiring board during the spray processing in the processing tank under the air pressure of the optimal condition according to the characteristics of the processing liquid. The maximum draining effect is obtained. The measuring device for checking the characteristics of the treatment liquid is not limited to the viscometer, and a measuring device capable of detecting other characteristics may be used.
[0023]
【The invention's effect】
As described above, according to the surface liquid treatment apparatus of the present invention, when performing liquid drainage of a printed wiring board to be transported, the printed wiring board is brought into rotary contact with a pair of upper and lower cylindrical liquid drainage rollers to drain the liquid. This eliminates the need to carry out the process, so that the front and back surfaces of the printed wiring board are not scratched, and the cause of the generation of foreign matters can be eliminated.
[0024]
In addition, when the printed wiring board passes through the liquid draining section, the time required to pass through the liquid draining section can be extremely short, so that the front and back surfaces of the transport printed wiring board and the inside of the through holes do not dry during that time, and It is no longer necessary to change the processing conditions in the next processing tank according to the degree of the processing.
[0025]
As described above, the present invention makes it possible to carry out the liquid removal without bringing the processing liquid to the next tank or taking it out of the previous tank by using only the liquid removal by air blowing without using the liquid removal roller. I have.
[Brief description of the drawings]
FIG. 1 is a configuration diagram showing an embodiment of the present invention.
FIG. 2 is a configuration diagram of a liquid drain unit according to the present invention.
FIG. 3 is a front view showing details of a liquid draining unit according to the present invention.
FIG. 4 is a side view showing details of a liquid draining unit according to the present invention.
FIG. 5 is a configuration diagram of an air pressure control system according to another embodiment of the present invention.
FIG. 6 is an explanatory view of the air pressure adjusting unit of FIG. 5;
FIG. 7 is a configuration diagram showing a main part of a conventional surface treatment apparatus.
[Explanation of symbols]
REFERENCE SIGNS LIST 1 printed wiring board 2 tank partition plate 3 liquid drain unit 4 cavity 5 air spray hole 6 suction port 7 mist catcher 8 header 9 compressed air pipe 10 compressed air 11 opening 12 transport roller 13 first processing tank 14 second processing tank 15 Partition cover 16 Treatment liquid spray nozzle 17 Rinse spray nozzle 18 Air pressure adjustment unit 19 Treatment liquid tank 20 Viscometer 21 Printed wiring board 22, 22a, 22b Soft etching liquid 23 Through hole 24 Etching liquid spray nozzle 25 Transport roller 26 Drip roller 27 Rinse spray nozzle 28 Air spray port 29 Air pipe 30 Soft etching tank 31 Drainer 32 Rinse tank 33 Partition plate

Claims (8)

In a surface treatment apparatus for a printed wiring board, which conveys a printed wiring board in a horizontal direction, sequentially moves between a plurality of processing tanks having different processing liquids, and sprays a processing liquid on the front and back surfaces of the printed wiring board to perform a surface treatment. An opening through which a printed wiring board passes is provided in a tank partition plate that separates the adjacent processing tanks, and a liquid draining unit that blows compressed air to the front and back surfaces of the printed wiring board that passes through the opening area is provided. A treatment liquid retained on the printed wiring board before being conveyed to the surface of the printed wiring board. 2. The printed wiring board according to claim 1, wherein the liquid drain unit is configured to include a partition cover provided so as to cover both sides of the tank partition plate with the opening area as a center. 3. Surface treatment equipment. The partition cover is provided with an opening serving as an inlet to the liquid drain unit on the pretreatment tank side and an opening serving as an outlet from the liquid drain unit on the post-treatment tank side. Item 3. A surface treatment apparatus for a printed wiring board according to item 2. The liquid drain unit has a pair of headers attached to the tank partition plate so as to sandwich the printed wiring board to be conveyed up and down in the opening, a hollow portion into which compressed air is sent to the header, and a hollow portion. 2. The printed wiring board surface treatment apparatus according to claim 1, wherein a plurality of air spray holes for blowing compressed air vertically to the printed wiring board are provided. The surface treatment device for a printed wiring board according to claim 4, wherein the air spray holes are arranged in a line above and below the opening, respectively. 2. The printed wiring according to claim 1, wherein the liquid draining unit has suction ports for suctioning and removing a processing liquid mist generated at the time of liquid draining on both sides of the tank partition plate. Plate surface treatment equipment. A viscometer for measuring the viscosity of the processing liquid is installed in a processing liquid tank for storing the processing liquid for spraying, and an air pressure adjusting unit is provided in the middle of a compressed air pipe for supplying compressed air to a liquid draining unit, and an air pressure 2. The apparatus according to claim 1, wherein the adjusting unit adjusts the pressure of the compressed air based on a signal from the viscometer, and performs liquid drainage at a compressed air pressure corresponding to the viscosity of the processing liquid. . 8. The printed wiring board surface treatment apparatus according to claim 1, wherein when the liquid is drained by the liquid draining unit, the liquid in the through hole is drained simultaneously with the liquid draining on both the front and back surfaces of the printed wiring board.

Images