KR20230041575A - An ultrasonic inspection apparatus for defective elements capable of drying an inspection object and an inspection method using the same - Google Patents

Abstract

The present invention relates to an ultrasonic inspection system detecting a defect of an object to be inspected through ultrasonic scanning. The ultrasonic inspection system includes: a conveyor module conveying the object to be inspected in a first direction; an ultrasonic scanning module performing ultrasonic scanning for the object to be inspected, which is conveyed by the conveyor module, and including an ultrasonic probe array formed to correspond to arrangement of the object to be inspected, wherein a medium for transmitting ultrasonic waves is filled between the ultrasonic probe array and the object to be inspected; and a dry module drying the object to be inspected in which the ultrasonic scanning is completed by the ultrasonic scanning module, in a predetermined method. The dry module includes a hot chamber unit forming a sealed space and drying the object to be inspected by heating the object to be inspected, which is provided through an unloading unit, in the predetermined method. The purpose of the present invention is to provide the ultrasonic inspection system having high inspection accuracy and rapid inspection speed at the same time.

Description

An ultrasonic inspection apparatus for defective elements capable of drying an inspection object and an inspection method using the same}

The present invention relates to an ultrasonic inspection apparatus for defective elements capable of drying an object to be inspected and an inspection method using the same. More specifically, it relates to a system and method for inspecting whether or not a defect exists inside a packaged object without damaging it using an ultrasonic probe array.

A technology that acquires an internal image of an examination target by using a signal having a frequency in the ultrasonic wave range can detect internal defects without deforming the medical field or manufacturing results targeting internal organs or fetuses during pregnancy. It is widely used in the field of non-destructive testing (NDT).

Defect detection by ultrasonic inspection may also be performed on a semiconductor device having a complicated circuit pattern. Conventionally, ultrasonic inspection may be performed for purposes such as selecting only some of finished semiconductor devices and calculating a defect rate. However, in relation to autonomous driving technology that has recently been developed, standards for defect inspection of semiconductors for autonomous vehicles are gradually being strengthened in order to prevent vehicle accidents due to defective devices.

As a prior art, Korea Patent Publication No. 10-2014-0001138 ''ultrasound inspection device and ultrasound inspection method' is disclosed. The prior art discloses a structure capable of acquiring stable inspection images by forming an adjustable distance between a lens and a surface of a workpiece (meaning 'object under examination') through a holder and a height adjusting means.

However, since the prior art does not disclose a structure for simultaneously inspecting a plurality of objects, a problem in which a work speed is inevitably low occurs in a field requiring total inspection.

Therefore, in areas where a very high level of manufacturing quality is required, such as autonomous driving, 100% inspection of semiconductor devices, rather than selective inspection, is performed with high inspection precision so that potential defective elements of semiconductor devices can be detected in advance. It may be required to develop an improved ultrasonic inspection device that can reduce the time required for inspection.

(Patent Document 1) Korean Patent Publication No. 10-2014-0001138

The technical problem to be solved by the present invention is to propose an ultrasonic inspection system having high inspection precision and high inspection speed at the same time and a method using the same. In particular, an optimized structure for simultaneously inspecting and drying a plurality of objects is proposed.

One embodiment of the present invention for solving the above problems is an ultrasonic inspection apparatus for detecting defects of an object through ultrasonic scanning, comprising: a conveyor module for conveying the object in a first direction; An ultrasound scanning module that performs ultrasound scanning on an object transported by the conveyor module, comprising an ultrasound probe array formed to correspond to an arrangement of the object under examination, and transmitting ultrasound between the ultrasound probe array and the object under examination. The ultrasonic scanning module, which is filled with a solvent medium; and a drying module that dries the subject for which ultrasonic scanning has been completed by the ultrasonic scanning module in a preset manner, forming an airtight space and applying heat to the subject provided through the unloading unit in a preset manner, A drying module including a hot chamber unit for drying the test object; Including, the hot chamber unit, the main body forming a hollow space; a cover covering the main body to form an enclosed space; and a seating jig positioned within the main body and on which at least one object under examination is seated. The seating jig is formed in the same arrangement as the shuttle jig provided on the transfer unit of the conveyor module for transporting the object in the first direction, and the arrangement forms the object under examination in an M*N matrix. Provided is an ultrasonic inspection device in the form of seating in an arrayed state (M and N are natural numbers).

In addition, the hot chamber unit is formed in a hot air circulation method, and may be operated at a preset temperature and time.

In addition, the drying module may include an air drying unit provided at a rear end of the ultrasonic probe array and spraying air to the test object in an air knife method; may further include.

In addition, the air drying unit is provided on the conveyor module, is positioned adjacent to the upper side of the object to be inspected, is formed to have a predetermined inclination downward, and air can be sprayed downward along the inclination.

In addition, the ultrasound scanning module may include a first ultrasound probe array configured to ultrasound scan an upper surface of the object; and a second ultrasound probe array for ultrasound scanning the lower surface of the subject. And, based on the first direction, between the first and second ultrasound probe arrays, inversion of flipping the object for which ultrasound scanning has been completed by the first ultrasound probe array in a preset manner module; Further, the air drying unit may be provided at a rear end of the first and second ultrasonic probe arrays, respectively.

In addition, the ultrasonic inspection system may include a loader magazine module in which at least one subject is loaded in a preset arrangement; and an unloader magazine module provided with the unloading unit disposed at a rear end of the conveyor module in the first direction. The conveyor module is configured to receive a test object from the loader magazine module through a loading unit located at a front end side, and the unloading unit moves the test object on the conveyor module to the hot chamber unit, The object to be inspected in the hot chamber unit may be loaded in a preset arrangement.

In addition, the unloading unit may be configured in the form of an articulated robot arm.

In addition, the conveyor module may include a first section in which the loader magazine module operates; a second section in which ultrasonic scanning is performed by the first ultrasonic probe array; a third section in which the subject is flipped by the inversion module; a fourth section in which ultrasonic scanning is performed by the second ultrasonic probe array; and a fifth section in which the unloader magazine module operates. , and the first to fifth sections may be sequentially formed along the first direction.

In addition, the ultrasonic probe array may be formed in such a manner that a water storage tank is provided and water supplied from the water storage tank is provided on the test subject.

In addition, the conveyor module may include a transfer unit extending in the first direction; and a shuttle jig disposed on the transfer unit to be movable and transporting the test object in the first direction in a state in which it is seated. The shuttle jig is formed to seat the subject in an M*N matrix arrangement (M and N are natural numbers), and the ultrasound probe array includes parallel ultrasound probes corresponding to the M rows. structure can be arranged.

The effects of the present invention are as follows.

In the present invention, instead of a single ultrasound probe conventionally used for ultrasound inspection, an ultrasound probe array having a specific structure composed of a plurality of probe elements can be used, so a surface-based inspection using an array structure rather than a conventional line-based inspection. can be performed, so that the accuracy and speed of ultrasound inspection can be improved.

In addition, the ultrasonic inspection system according to the present invention effectively dries the ultrasonic transmission medium used in ultrasonic inspection in conjunction with the movement of the subject, thereby guaranteeing the stability of the inspected subject.

1 is an overall conceptual diagram of an ultrasonic inspection system according to the present invention.
2 is a schematic overall perspective view of an ultrasound inspection system according to the present invention.
3 is a plan view of an ultrasonic inspection system according to the present invention.
4 is a schematic perspective view of an ultrasonic scanning module of an ultrasonic inspection system according to the present invention.
5 is a schematic diagram schematically showing an ultrasonic probe of an ultrasonic inspection system according to the present invention.
6 is a reference diagram for explaining a method of generating an image of an interface pattern of a subject by using an ultrasonic probe array.
7 is a schematic perspective view of an inversion module of an ultrasonic inspection system according to the present invention.
8 is a schematic perspective view of a conveyor module of an ultrasonic inspection system according to the present invention, showing an alignment check module together.
9 shows result data obtained by examining a subject using the ultrasonic inspection system according to the present invention.
10 is a block diagram of a drying module of the ultrasonic inspection system according to the present invention.
11 is a perspective view schematically illustrating a hot chamber part of a drying module of an ultrasonic inspection system according to the present invention.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. The following description is only for specifying the embodiments, and is not intended to limit or limit the scope of rights according to the present invention. What a person skilled in the art can easily infer from the detailed description and examples of the present invention should be construed as belonging to the scope of the present invention.

The terms used in the present invention have been described as general terms widely used in the technical field related to the present invention, but the meanings of the terms used in the present invention are the intentions of technicians working in the field, the emergence of new technologies, examination standards or precedents. etc. may vary. Some terms may be arbitrarily selected by the applicant, and in this case, the meanings of the arbitrarily selected terms will be described in detail. Terms used in the present invention should be interpreted as meanings reflecting the overall context of the specification, not just dictionary meanings.

Terms such as 'consisting' or 'comprising' used in the present invention should not be construed as necessarily including all of the components or steps described in the specification, and if some components or steps are not included, and when additional components or steps are further included, it should also be construed as intended from the term.

Terms to be described later are terms defined in consideration of functions in the present invention, and may vary according to intentions or customs of users, operators, and designers. Therefore, the definition should be made based on the contents throughout this specification.

As used herein, 'subject' includes a semiconductor device to be inspected, includes all objects that can be inspected using ultrasonic irradiation, and is also referred to as a work. In the present application, description is made on the premise that the object under test is planar, but the shape of the object under test is not limited thereto.

Also, 'first direction' as used herein refers to an extension direction of conveyor modules (rails and belts). That is, the extending direction of the conveyor module is used herein to mean the conveying direction of the subject. Also, 'second direction' means the width direction of the conveyor module. Based on the horizontal direction, the first direction and the second direction mean directions perpendicular to each other.

In the term 'matrix' used herein, for convenience of explanation, the first direction means 'column' and the second direction means 'row'.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. A detailed description of matters widely known to those skilled in the art will be omitted.

Overall composition of the ultrasonic inspection system

1 is an overall conceptual diagram of an ultrasonic inspection system according to the present invention.

Referring to FIG. 1, the ultrasonic inspection system according to the present invention includes a loader magazine module 101, a conveyor module 110, an ultrasonic scanning module 120, a reversal module 130, an unloader magazine magazine) module 102, an alignment check module 140, and a drying module 150. The drying module 150 will be separately described later.

The loader magazine module 101 is loaded with at least one test object in a magazine state in a preset arrangement, and is provided with a loading unit 111 for moving the test object. Specifically, the loading unit 111 may transport an object to be examined within an ultrasound examination system. The loading unit 111 may move the object loaded in the form of a magazine on the front side of the ultrasonic inspection system to the conveyor module 110 .

Here, the conveyor module 110 performs the function of 'ultrasonic inspection stage', and the object under examination is moved to the shuttle jig 113 on the conveyor module 110 by the loading unit 111 for ultrasonic inspection. At this time, the loading unit 111 may transport the object to a location for DMC engraving and barcode inspection. As in the illustrated example, the loading unit 111 may be configured in a push-and-pull structure, and the magazine may be located at the front end of the conveyor module 110 in a predetermined unit.

FIG. 2 shows an embodiment in which magazines are composed of 5 rows and the loading unit 111 is configured to seat the magazines stacked with objects through a preset guide unit and then seat them on the conveyor module 110 . As an example, assuming that the loading unit 111 of the ultrasound examination system according to the present invention takes 8 seconds to move a unit subject, and the shuttle jig 113 has a structure capable of seating 8 subjects, the shuttle In placing the test subject on the jig 113, it takes a short time of 64 seconds in total.

The loading unit 111 may be implemented in the form of a robot arm, or may be implemented in another type of mechanical structure having an element carrying function, but is not limited to the form shown in the drawings in advance. specify

The conveyor module 110 receives a test object through the loading unit 111 and performs a function of transporting the test object in a first direction.

The conveyor module 110 is composed of a transfer unit 112, a shuttle jig 113 and a driving unit 114. The transfer unit 112 supports the shuttle jig 113 to be movable and serves to guide the movement of the shuttle jig 113 . To this end, the transfer unit 112 extends in the first direction, and the transfer unit 112 is connected to the driving unit 114 to receive power from the driving unit 114 . By the operation of the driving unit 114, the transfer unit 112 continuously moves in the first direction, but stops at each preset individual section to perform an ultrasonic test.

This will be described with reference to FIGS. 2 and 3 . Regarding the above section, the conveyor module 110 according to the present invention is largely divided into the following five sections (or areas).

The 'first period' is a period in which the loader magazine module 101 operates.

The 'second period' is a period in which ultrasound scanning is performed by the first ultrasound probe array 121 .

The 'third period' is a period in which the subject is flipped by the inversion module 130 .

The 'fourth period' is a period in which ultrasound scanning is performed by the second ultrasound probe array 122 .

The 'fifth period' is a period in which the unloader magazine module 101 operates.

Here, the first to fifth sections are sequentially formed along the first direction, and the processor 160 is interlocked with the driving unit 114 to control the operation of the driving unit 114 according to preset conditions. . For example, while ultrasound scanning is being performed by the first ultrasound probe array 121 in the second section, the driving unit 114 does not operate, thereby maintaining the stationary state of the transfer unit 112. After the ultrasonic inspection is completed on the upper surface of the subject by the first ultrasound probe array 121 and image information is acquired, the processor 160 is configured to transmit an operation signal to the driving unit 114 .

The shuttle jig 113 is coupled to the transfer unit 112 and provides a space in which the subject can be stably seated. That is, the test subject is configured to move in the first direction while seated on the shuttle jig 113 . At this time, the shuttle jig 113 is formed to seat the subject in an M*N matrix arrangement (M and N are natural numbers). 3 to 5 show an exemplary structure in which M=2 and N=4. That is, one unit of the shuttle jig 113 can transfer a total of 8 objects at the same time.

As described above, the shuttle jig 113 simultaneously transports a plurality of objects under test, and the driving unit 114 operates based on the arrangement of the shuttle jig 113. Instead of moving continuously, the shuttle jig is moved discontinuously so that ultrasonic inspection (or scanning) is performed row by row. That is, it can be moved in the first direction by a scanning unit.

The ultrasonic scanning module 120 is a component that performs ultrasonic scanning on an object mounted on the shuttle jig 113 moving on the conveyor module 110 .

The ultrasonic scanning module 120 includes ultrasonic probe arrays 121 and 122 . The ultrasonic probe arrays 121 and 122 may irradiate the object under test with a test signal having a frequency in the ultrasonic range, and accordingly measure an echo signal reflected from the boundary surface of each layer of the object under test. The ultrasonic probe arrays 121 and 122 may be composed of a plurality of probe elements 124d rather than a single probe, and thus perform 'plane-based' scanning rather than 'line-based' scanning. can do.

In the ultrasonic scanning process, ultrasonic signals and echo signals may be transmitted through an ultrasonic transmission medium. For example, when an ultrasonic signal and an echo signal are transmitted through an ultrasonic transmission medium such as water, the attenuation in the high frequency region may be reduced compared to the case where the ultrasonic signal and the echo signal are transmitted through air, so that a more smooth defect inspection can be performed. . In addition to the exemplified water, other appropriate types of materials capable of preventing signal attenuation may be used as a medium for transmitting ultrasound.

The shape of the ultrasonic probe arrays 121 and 122 is formed to correspond to the shape of the shuttle jig 113, so that the ultrasonic inspection efficiency can be maximized. Although the ultrasonic probe arrays 121 and 122 may be configured in the same manner as the arrangement of the shuttle jig 113 described above, considering that ultrasonic probes are expensive, the ultrasonic probe arrays 121 and 122 are ultrasonic probes 121a. , 122a) is preferably arranged in a parallel structure corresponding to the above M row.

Referring to FIG. 4 , the ultrasonic probe arrays 121 and 122 are formed of dual ultrasonic probes with M=2, and thus can simultaneously perform ultrasonic scanning of two units of an object under examination. At this time, the driver 114 is configured to move the shuttle jig 113 by a distance corresponding to the ultrasonic scanning interval. Of course, the ultrasonic probe arrays 121 and 122 may be formed in a structure in which ultrasonic scanning is performed while the shuttle jig 113 is moved in the first direction by the driving unit 114 in a fixed state, but on the contrary, ultrasonic The probe arrays 121 and 122 may be combined with a separate driving device to perform ultrasonic scanning while the ultrasonic probe arrays 121 and 122 move in a first direction or in a direction opposite to the first direction. This can be optimally designed according to the designer's choice.

Meanwhile, the semiconductor substrate of the object under test may have an upper surface semiconductor pattern formed on an upper surface of the substrate and a lower surface semiconductor pattern formed on a lower surface of the substrate. Illustratively, according to the semiconductor packaging design, a substantial detailed circuit pattern among the top and bottom patterns may be formed on one surface, and an additional pattern such as a heat dissipation structure may be formed on the other surface.

Considering this point, the ultrasonic scanning module 120 may be designed in various ways. For example, the ultrasonic scanning module 120 may be designed in a simultaneous up-and-down measurement method, and as a result, a top image of the top semiconductor pattern and a bottom image of the bottom semiconductor pattern may be generated.

However, when ultrasonic scanning of the upper and lower surfaces is simultaneously performed by an ultrasonic probe array and an additional ultrasonic probe array in the vertical simultaneous measurement method, the overall image is blurred due to the effect of ultrasonic scattering due to the three-dimensional structure of the detailed circuit pattern. Since there is a problem in obtaining, it is more preferable to design the top and bottom separate measurement method rather than the top and bottom simultaneous measurement method. Hereinafter, the description will be made on the premise of the 'upper and lower separate measurement method'.

Unlike the case of the above-mentioned simultaneous up and down measurement method, the 'upper and lower separate measurement method' performs ultrasonic scanning on the upper surface semiconductor pattern to generate an upper surface image, and then ultrasonic scanning is performed on the lower surface semiconductor pattern. is the way it is created.

In relation to the top and bottom separate measurement method, in the ultrasonic scanning process, after the ultrasonic scanning of the upper surface is performed by the ultrasonic probe arrays 121 and 122, an additional ultrasonic probe additionally provided to irradiate the ultrasonic signal for defect inspection on the lower surface Additional ultrasound scanning of the lower surface may be performed by the array.

The present invention provides structures of the ultrasonic scanning module 120 and the inversion module 130 optimized for the vertical separate measurement method.

The ultrasound scanning module 120 is composed of a first ultrasound probe array 121 that ultrasound scans the upper surface of the subject and a second ultrasound probe array 122 that ultrasound scans the lower surface of the subject. Here, 'upper surface' and 'lower surface' are defined based on the state of the subject before entering the ultrasonic scanning module 120, and may be divided into 'one surface' and 'other surface'.

The first ultrasonic probe array 121 will be described in detail.

5 (a) and (b) show an exemplary structure of the ultrasonic probe array, and (c) shows an operating method of the ultrasonic probe array. As shown, since the ultrasonic probe array has an array structure, it may have higher precision and scan speed compared to a single probe structure.

The ultrasonic probe arrays 121 and 122 may include a plurality of probe elements 121d arranged in a row at a constant pitch, and the size of each of the plurality of probe elements 121d and the plurality of probe elements ( 121d) may be determined according to a scanning time required for each sheet of the subject.

The plurality of probe elements 121d may be configured in the form of an oscillator to generate ultrasonic signals for defect inspection using a method such as phased array ultrasonics. A scanning speed may vary according to a pitch indicating an arrangement interval of the plurality of probe elements 121d and a size of each probe element 121d. When other factors are equal, as the pitch increases, the scanning speed may increase but the scanning resolution may decrease.

When a total inspection of a large number of devices is required, as in the case of power module devices for autonomous vehicles, there may be cases in which requirements for the time required for each device, that is, the scanning speed, are set. At this time, detailed specifications of the ultrasonic probe array, such as a pitch between probe elements or a size of each probe element, may be changed to meet the required scanning speed.

Referring to (c) of FIG. 5 , the ultrasound probe arrays 121 and 122 may perform ultrasound scanning on a subject. For a device having a constant size, for example, 190 mm * 140 mm, plane scanning may be performed by one line at each scan interval.

6 is a reference diagram for explaining a method of generating an image of an interface pattern of a subject by using an ultrasonic probe array. Referring to FIG. 6 , an ultrasound scanning process 210 and an echo generation process 220 are illustrated in relation to a method of generating an image of an interface pattern of a subject using an ultrasound probe array.

Regarding the ultrasound scanning process 210, ultrasound scanning of the subject by the ultrasound probe arrays 121 and 122 may be performed through an ultrasound transmission medium. Specifically, the ultrasonic signal for defect inspection may be irradiated to the upper surface semiconductor pattern through an ultrasonic transmission medium filled between the ultrasonic probe array and the object to be inspected in order to prevent attenuation of the ultrasonic signal for defect inspection generated in the high frequency region, The medium for transmitting ultrasound may be a liquid, and the liquid may be water or a mixture having other properties that facilitate ultrasound transmission.

Ultrasonic signals for defect inspection by the ultrasonic probe arrays 121 and 122 may be irradiated to the object to be inspected through the medium and reflected at the interface between materials. As an example, the object under test may have a three-layer structure of an upper surface semiconductor pattern, a semiconductor substrate, and a lower surface semiconductor pattern, and ultrasonic signal reflection may occur at an interlayer interface or a medium-device interface.

As in the echo generation process 220, the reflected ultrasonic signal, that is, the ultrasonic echo signal, may reflect the properties of the interface material. As shown, ultrasonic echo signals having different characteristics may be generated for each type of boundary surface, and in particular, when a defect exists inside the object under test, a corresponding ultrasonic echo signal may be generated at the boundary of the corresponding defect.

Accordingly, the processor 160 may generate an interface pattern image indicating whether there is no abnormality in the interface pattern or internal defects such as cracks or peeling by analyzing the ultrasound echo signal from the object under test.

Referring back to FIGS. 2 and 3 , the inversion module 130 is positioned between the first and second ultrasonic probe arrays 121 and 122 in the first direction. Subjects whose ultrasound scanning has been completed by the first ultrasound probe array 121 are inverted vertically by the inversion module 130 and are provided to the second ultrasound probe array 122 in an inverted state. Through this series of processes, the upper and lower separate measurement methods can be effectively applied.

Referring to FIG. 7 in detail, the reversal module 130 is configured to flip the object for which the first ultrasonic scanning (meaning top surface scanning) has been completed by the first ultrasonic probe array 121. . As described above, the subject moves while being mounted on the shuttle jig 113, and ultrasonic scanning of one unit of the shuttle jig 113 is all completed and the shuttle jig 113 enters the third section. When this is completed, the inversion module 130 operates.

Specifically, the inversion module 130 is composed of a flipping unit 131 and a pickup unit 132.

The flipping unit 131 is disposed outside the transfer unit 112 and is configured to flip the object under test so that the upper and lower sides are reversed. It includes a supporter 131a and a rotating body 131b for supporting the object moved in the second direction from the pick-up unit 132 . However, the structure shown in FIG. 7 is an exemplary structure of the flipping unit 131, and any structure can be employed as long as it can stably rotate the object under test.

The support 131a is formed in a shape corresponding to the shuttle jig 113, and is configured to invert the upper and lower surfaces of the test object in a state in which a 2*4 object is accommodated. The rotating body 131b includes a rotating shaft and is disposed in a direction parallel to the first direction in order to minimize pickup efficiency and a movement line of the pickup unit 132 .

The pick-up unit 132 is provided on the upper side of the conveyor module 110, moves the subject on the shuttle jig 113 to the flipping unit 131, and flips the subject upside down by the flipping unit 131. It serves to move to the original position on the shuttle jig 113. That is, the pick-up unit 132 couples the test object on the shuttle jig 113 in a predetermined manner, lifts it upward, moves in the second direction, and moves to the support body 131a of the flipping unit 131. Move the subject to the top. The pick-up unit 132 may be configured to take out the objects loaded in the first row of the shuttle jig 113 . In the case of the shuttle jig 113 accommodating 2*4 objects, it is necessary to withdraw the objects in the first row and then the objects in the second row.

An exemplary operation of the inversion module 130 is described. First, the pick-up unit 132 takes out 4 columns (meaning 4) of objects located in 1 row of the shuttle jig 113, and then moves them onto the support 131a of the flipping unit 131 (meaning movement in the second direction). Then, the pick-up unit 132 again moves upwards on the conveyor module 110 to take out four rows of objects located in the second row of the shuttle jig 113, and then moves them onto the support 131a. At this time, the four columns of objects located in the second row may be moved to a position parallel to the first row already moved to the support 131a.

Next, the upper and lower surfaces of all the objects are reversed by inverting the objects in the first row arranged on the support 131a and then inverting the objects in the second row. Finally, the pick-up unit 132 moves the objects arranged in a 2*4 pattern on the support 131a onto the shuttle jig 113 again, thereby completing preparations for entering the second ultrasound probe array 122 .

The second ultrasonic probe array 122 may perform ultrasonic scanning again on the object whose upper and lower surfaces are inverted, thereby completing the separate upper and lower measurement method. Since the process performed in the second ultrasound probe array 122 is the same as that of the first ultrasound probe array 121 described above, duplicate descriptions will be omitted.

The shuttle jig 113, which has been ultrasonically scanned by the second ultrasonic probe array 122, enters the fifth section by the transfer unit 112. The fifth section refers to the rear end of the transfer unit 112, and the object under examination for which the upper and lower surfaces have been ultrasonically scanned is loaded again in a preset arrangement by the unloading unit 115 of the unloader magazine module 101. At this time, it can be loaded in the form of a magazine.

The ultrasound inspection system according to the present invention includes an alignment check module 140 to check the alignment of the object under ultrasound examination. The alignment confirmation module 140 is composed of first to third alignment units 141 , 142 , and 143 . This will be described with reference to FIG. 8 .

The first alignment unit 141 is provided on the shuttle jig 113 through the index sensor 141a provided at the lower side of the shuttle jig 113 and the detection hole 113a formed at a preset position in each of the shuttle jig 113. It is configured to check whether the sample is in the correct position. The index position can be maintained through the two-step speed control of the drive unit 114 . Here, the driving unit 114 is composed of a servo motor and can control index moving. Accordingly, the shuttle jig 113 can be moved only by a predetermined distance.

The index sensors 141a may be formed as a pair to be spaced apart from each other in the first direction, and the distance between the pair of index sensors 141a may correspond to the distance between the objects to be inspected.

The second aligning unit 142 uses a detection camera 142a configured to recognize a preset reference mark on each shuttle jig 113 to check whether the subject is in the correct position on the shuttle jig 113. is configured to FIG. 5 shows a 2*4 matrix shuttle jig 113, which has a structure in which a total of 8 objects can be mounted. After marking the reference mark corresponding to the shape of the subject in advance in each of the eight spaces, the reference mark is recognized using the detection camera 142a while the subject is mounted on the shuttle jig 113. When the subject is out of the reference mark marked in advance, it is determined that the subject is not in the correct position, and the position may be rearranged.

The second alignment unit 142 is preferably provided before the shuttle jig 113 enters the ultrasound scanning module 120 and before the first ultrasound probe array 121, and the accuracy of ultrasound scanning can be maximized. .

The third aligning unit 143 is formed to correct reference marks preset in each shuttle jig 113 based on image information generated by the ultrasonic probe arrays 121 and 122 . The information obtained from the ultrasonic probe arrays 121 and 122 is transmitted to the processor 160, and image information is generated. Since the reference mark is also confirmed in the image information, the position of the reference mark itself is displayed in the correct position. to check if it has been done. If the position of the reference mark is not in the correct position, the position of the reference mark displayed on the shuttle jig 113 may be corrected.

Meanwhile, the ultrasound examination system according to the present invention includes a processor 160 (see FIG. 1). The processor 160 controls components of the ultrasound examination system and simultaneously performs calculation processing to generate image information based on information transmitted from the ultrasound scanning module 120 .

The processor 160 may generate an internal image of the object to be examined by utilizing an echo signal reflected from the object to be inspected. The processor 160 may be implemented in the form of a CPU, GPU, AP, or a combination thereof having an arithmetic processing function, and may be provided with DRAM, flash memory, SSD, or other various types of memory as needed.

Referring to FIG. 9 , when an internal image of the object under examination, that is, an image of a boundary pattern, is generated, it is possible to determine what kind of manufacturing defects the object has. For example, it can be determined whether manufacturing defects such as direct bonded copper (DBC) cracks, solder voids, EMC (epoxy mold compound) peeling, spacer distortion, DMC voids, and ceramic pattern peeling exist from the interface pattern image.

Specifically, (a) of FIG. 9 shows a state in which DBC cracks occur, (b) shows a state in which solder voids occur, and (c) shows a state in which EMC peeling occurs. And, (d) can confirm the twisted state of the spacer.

Drying module of ultrasonic inspection system

Hereinafter, the drying module 150 of the ultrasonic inspection system according to the present invention will be described with reference to FIGS. 10 and 11 .

First, referring to FIG. 10 , the drying module 150 includes a first air drying unit 151 , a second air drying unit 152 and a hot chamber unit 153 . The drying module 150 is configured to be controlled in conjunction with the processor 160 .

The processor 160 is configured to control all of the output, direction, and time of air discharged from the first and second air dryers 152 . In addition, the heating state of the hot chamber unit 153 is also configured to be controlled together.

Since the ultrasound scanning module 120 according to the present invention supplies a medium for transmitting ultrasound in a waterfall manner (see FIG. 4 ), it is necessary to dry the medium for transmitting ultrasound. To this end, air drying units 151 and 152 are provided at the rear end of the first and second ultrasonic probe arrays 122 to spray air to the test subject in an air knife manner. In addition, the ultrasonic probe array is provided with a water storage tank (not shown), and is formed in such a way that water supplied from the water storage tank is provided on the object to be inspected.

The air drying units 151 and 152 are provided on the conveyor module 110, are positioned adjacent to the upper side of the object under test, are formed to have a predetermined inclination downward, and are configured to spray air downward along the inclination. do. By blowing air through the air drying units 151 and 152, the medium for ultrasonic transmission remaining in the subject may be dried.

The air drying unit disposed at the rear end of the second section in which the first ultrasonic probe array 121 operates is referred to as the first air drying unit 151 . The air drying unit disposed at the rear end of the fourth section in which the second ultrasonic probe array 122 operates is referred to as the second air drying unit 152 .

In the fifth section, an additional drying process is performed. A hot chamber unit 153 is provided on the outside of the conveyor module 110, and objects positioned on the shuttle jig are not directly loaded in the form of a magazine by the unloading unit 115, but in the hot chamber unit 153. After the drying process is performed, it may be configured to be loaded in a magazine form.

Referring to FIG. 11, the hot chamber part 153 will be described in detail. The hot chamber part 153 includes a main body 153b, a cover 153a, and a seating jig 153c.

The main body 153b is configured to form a hollow space, and the cover 153a covers the hollow space formed in the main body to form an airtight space. The hot chamber unit 153 is connected to a heating means (not shown), and the heating means is configured to be controlled by the processor 160 .

Since the subject is dried in a closed state by the body 153b and the cover 153a, drying efficiency can be maximized. A seating jig 153c is provided inside the main body 153b, on which the object to be inspected is seated. The seating jig 153c is preferably formed with ventilation holes so that heated air can be circulated in the vertical direction.

The seating jig 153c is formed in the same arrangement as the shuttle jig, and the arrangement may be configured in a manner in which the object under test is seated in an M*N matrix arrangement. Through this, it can be effectively moved from the shuttle jig 113 to the seating jig 153c by the unloading unit 115.

In addition, the hot chamber unit 153 is formed in a hot air circulation method and is operated at a preset temperature and time. As an example, a maximum temperature of 180 degrees and an operating time of 125 seconds or less may be set. The maximum temperature and operating time may be set differently according to the characteristics of the subject. When the maximum temperature is exceeded, the operation of the heating unit is automatically turned off, and a temperature sensor (not shown) connected to the processor 160 is preferably provided inside the hot chamber unit 153 .

Referring to the shape of the hot chamber part 153, the main body 153b may be configured in a box shape having a square horizontal cross section. Since the shuttle jig 113 and the seating jig 153c are formed in a shape corresponding to each other, it is preferable that the main body 153b is also configured in a shape corresponding to the seating jig 153c. The cover 153a may be made of a transparent material so that the inside of the body 153b can be checked from the outside. Accordingly, a worker or manager can visually check the drying process in the hot chamber unit 153 from the outside.

Of course, although the details that can be confirmed visually are somewhat limited, matters related to work safety, such as occurrence of fire or sparks in the main body 153b due to malfunction of the heating means, can be sufficiently confirmed. .

Meanwhile, the unloading unit 115 may be configured in the form of an articulated robot arm. Specifically, it may be configured in a belt and eject pusher method. The unloading unit 115 is responsible for primary movement from the shuttle jig 113 to the seating jig 153c, and performs secondary movement from the seating jig 153c to the unloader magazine module 102. Here, the primary movement is movement for drying work, and the secondary movement is movement for magazine loading.

The above embodiment in the present invention is an example, and the present invention is not limited thereto. Anything that has substantially the same configuration as the technical concept described in the claims of the present invention and achieves the same effect is included in the technical scope of the present invention.

101: loader magazine module
102: unloader magazine module
110: conveyor module
120: ultrasonic scanning module
130: inversion module
140: alignment check module
150: drying module
151: first air drying unit
152: second air drying unit
153: hot chamber part
160: processor

Claims (10)

An ultrasonic inspection device that detects defects in an object through ultrasonic scanning,
a conveyor module for transporting the subject in a first direction;
an ultrasonic scanning module that performs ultrasonic scanning on an object transported by the conveyor module; and
A drying module that passes through the ultrasonic scanning module and dries the object wet by the medium for transmitting ultrasonic waves in a preset manner,
The drying module,
A hot chamber unit forming an airtight space and drying the test object by applying heat to the test object provided through the unloading unit in a preset manner.
ultrasound examination device. The method of claim 1,
The hot chamber part,
A body forming a hollow space;
a cover covering the main body to form an enclosed space; and
a seating jig located in the main body and on which at least one test object is seated; containing
ultrasound examination device. The method of claim 1,
The hot chamber part,
Formed in a hot air circulation method, operated at a preset temperature and time,
ultrasound examination device. The method of claim 1,
The ultrasonic scanning module,
An ultrasonic probe array formed to correspond to the arrangement of the test object transported by the conveyor module; includes,
The drying module,
An air drying unit provided at a rear end of the ultrasonic probe array and spraying air to the test object in an air knife manner; further comprising
ultrasound examination device. The method of claim 4,
The ultrasonic probe array,
a first ultrasound probe array that ultrasound scans the top surface of the object; and
a second ultrasound probe array for ultrasound scanning the lower surface of the subject; Including,
The air drying unit,
It is provided on the conveyor module, is provided at the rear end of the first and second ultrasonic probe arrays, is located on the upper side adjacent to the object under test, and is formed to have a predetermined inclination toward the lower side, and air flows downward along the inclination. sprayed towards
ultrasound examination device. The method of claim 5,
The ultrasonic inspection device,
a loader magazine module in which at least one subject is loaded in a preset arrangement;
An unloader magazine module provided with the unloading unit disposed at a rear end of the conveyor module in the first direction; and
a reversal module for flipping an object for which ultrasound scanning has been completed by the first ultrasound probe array between the first and second ultrasound probe arrays in a preset manner based on the first direction; Including more,
The conveyor module,
It is configured to receive the test subject from the loader magazine module through a loading unit located on the front end side,
The unloading unit,
Moving the test object on the conveyor module to the hot chamber unit and loading the test object in the hot chamber unit in a preset arrangement.
ultrasound device. The method of claim 6,
The unloading unit,
Consisting of an articulated robot arm method,
ultrasound examination device. The method of claim 6,
The conveyor module,
a first section in which the loader magazine module operates;
a second section in which ultrasonic scanning is performed by the first ultrasonic probe array;
a third section in which the subject is flipped by the inversion module;
a fourth section in which ultrasonic scanning is performed by the second ultrasonic probe array; and
a fifth section in which the unloader magazine module operates; is divided into
The first to fifth sections,
Formed sequentially along the first direction,
ultrasound examination device. The method of claim 1,
The ultrasonic probe array,
A water storage tank is provided, and formed in such a way that water supplied from the water storage tank is provided on the test subject.
ultrasound examination device. The method of claim 2,
The conveyor module,
a transfer unit extending in the first direction; and
a shuttle jig that is movably disposed on the transfer unit and transfers the test object in the first direction in a seated state; Including,
The seating jig,
It is formed in the same arrangement form as the shuttle jig, but the arrangement form is made in the form of seating the subject in an arrangement state of an M*N matrix (M and N are natural numbers),
The ultrasonic probe array,
Ultrasonic probes are arranged in a parallel structure corresponding to the M row,
ultrasound examination device.

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