KR20240009606A - A defect device automatic inspection apparatus that sequentially inspects upper and lower surfaces using an inversion module and inspection method using the same and an inspection method using thereof - Google Patents

Abstract

The present invention is an ultrasonic inspection device that detects defects in an object through ultrasonic scanning, comprising: a loader magazine module in which at least one object is loaded in a preset arrangement and provided with a loading unit for moving the object; A conveyor module that receives an object to be examined by the loading unit located at the front end and transports the object in a first direction; an ultrasonic scanning module that performs ultrasonic scanning on an object positioned on the conveyor module and includes an ultrasonic probe array formed to correspond to the arrangement of the object; An unloader magazine module that loads the object on the conveyor module in a preset arrangement through an unloading unit disposed at the rear end of the conveyor module, based on the first direction; and a reversal module for flipping the subject on which ultrasonic scanning has been completed between the first and second ultrasonic probe arrays in a preset manner. It provides an ultrasonic inspection device including.

Description

A defect device automatic inspection apparatus that sequentially inspects upper and lower surfaces using an inversion module and inspection method using the same and an inspection method using the same }

The present invention relates to an automatic inspection device for defective elements that sequentially inspects the upper and lower surfaces using an inversion module, and an inspection method using the same. More specifically, it relates to a system and method for inspecting whether defects exist inside a packaged object using an inversion module and an ultrasonic probe array without damaging it.

A technology that acquires internal images of an object to be examined using signals with a frequency in the ultrasonic wave region can identify internal defects without modifying the medical field or manufacturing results targeting internal organs of the body or the fetus during pregnancy. It is used in a variety of fields such as non-destructive testing (NDT).

Defect detection using ultrasonic inspection can also be performed on semiconductor devices forming complex circuit patterns. Conventionally, ultrasonic inspection could be performed for purposes such as selecting only a portion of finished semiconductor devices and calculating the defect rate. However, in relation to autonomous driving technology that has been developing recently, the standards for defect inspection of semiconductors for autonomous vehicles are gradually being strengthened to prevent vehicle accidents due to device defects.

As a prior art, Korean Patent Publication No. 10-2014-0001138, ‘Ultrasonic inspection device and ultrasonic inspection method,’ is disclosed. The prior art discloses a structure capable of obtaining a stable inspection image by adjusting the distance between the lens and the surface of the work (meaning 'subject') through a holder and a height adjustment means.

However, since the above-mentioned prior art does not disclose a structure for simultaneously examining multiple subjects, the problem arises that the work speed must be significantly low in fields that require full inspection.

Therefore, in fields that require a very high level of manufacturing quality, such as autonomous driving, full inspection of semiconductor devices, rather than screening, is performed with high inspection precision to detect potential defective elements of semiconductor devices in advance. Development of improved ultrasonic inspection devices that can reduce inspection time may be required.

(Patent Document 1) Korean Patent Publication No. 10-2014-0001138

The technical problem to be solved by the present invention is to propose an ultrasonic inspection system that simultaneously has high inspection precision and fast inspection speed, and a method using the same. In particular, we would like to propose an optimized structure for examining multiple subjects simultaneously.

One embodiment of the present invention to solve the above problems is an ultrasonic inspection system that detects defects in a subject through ultrasonic scanning, wherein at least one subject is loaded in a preset arrangement, and the subject is A loader magazine module provided with a loading unit that moves the; A conveyor module that receives an object to be examined by the loading unit located at the front end and transports the object in a first direction; an ultrasonic scanning module that performs ultrasonic scanning on an object positioned on the conveyor module and includes an ultrasonic probe array formed to correspond to the arrangement of the object; An unloader magazine module that loads the object on the conveyor module in a preset arrangement through an unloading unit disposed at the rear end of the conveyor module, based on the first direction; It includes: a conveyor module extending in the first direction and moving the object in the first direction; and a shuttle jig disposed on the transfer unit and transporting the subject in the first direction in a seated state. It includes: the shuttle jig is formed to seat the subject in an array of M*N matrix (M and N are natural numbers), and the ultrasonic probe array is arranged in parallel with the ultrasonic probes corresponding to the M rows. An ultrasonic inspection system arranged in a structure is provided.

Additionally, the ultrasonic probe array may be formed as a dual ultrasonic probe where M is 2.

In addition, the ultrasonic scanning module includes: a first ultrasonic probe array for ultrasonic scanning the upper surface of the subject; and a second ultrasonic probe array for ultrasonic scanning the lower surface of the subject. It includes, based on the first direction, between the first and second ultrasonic probe arrays, a reversal for flipping the subject for which ultrasonic scanning has been completed by the first ultrasonic probe array in a preset manner. module; It may further include, wherein the second ultrasonic probe array may be formed to receive the subject in an upside-down state by the inversion module.

In addition, the inversion module includes: a flipping unit disposed on the outside of the transfer unit 112 and flipping the object to be inverted; and a pickup unit provided on the upper side of the conveyor module and moving the subject on the shuttle jig to the flipping unit, and moving the subject upside down by the flipping unit to its original position on the shuttle jig; may include.

In addition, the flipping unit and the pickup unit are formed to extend in the first direction and are configured in a form corresponding to the 1*N matrix, and the pickup unit shuttles the object a number of times corresponding to the M rows. The reciprocating movement may be performed between the jig and the flipping unit, and the reciprocating direction may be a second direction perpendicular to the first direction.

In addition, the ultrasonic inspection system includes an alignment confirmation module that determines whether the object on the shuttle jig is in the correct position; It further includes, wherein the alignment confirmation module is configured to check whether the object on the shuttle jig is in the correct position through an index sensor provided on the lower side of the shuttle jig and a detection hole formed at a preset position in each of the shuttle jig. 1 Alignment section; It includes, and the first alignment unit may be based on control of the transfer speed of the shuttle jig by the conveyor module.

In addition, the alignment confirmation module includes a second alignment unit that checks whether the object on the shuttle jig is in the correct position using a detection camera configured to recognize a reference mark preset in each of the shuttle jigs; It may further include, wherein the ultrasonic scanning module may be disposed at a rear end of the second alignment unit based on the first direction.

In addition, the alignment confirmation module includes a third alignment unit formed to correct reference marks preset on each of the shuttle jigs based on image information generated by the ultrasonic probe array; It may further include.

Meanwhile, the present invention is a method using the above-described ultrasonic inspection system, (a1) using an index sensor provided on the lower side of the shuttle jig and a detection hole formed at a preset position in each of the shuttle jig, and controlling the transfer speed of the shuttle jig. A first alignment step of determining whether the subject is in the correct position based on; (a2) a second alignment step of checking whether the subject is in the correct position using a detection camera configured to recognize a reference mark preset on each of the shuttle jigs; and (a3) a third alignment step formed to correct reference marks preset on each of the shuttle jigs based on image information generated by the ultrasonic probe array; Provides a method including.

In addition, after step (a2) and before step (a3), (a21) adjusting the height of the ultrasonic probe array based on the result of step (a2); (a22) performing ultrasonic scanning on the upper surface of the subject through a first ultrasonic probe array of the ultrasonic scanning module; (a23) performing primary drying on the subject in a preset manner; (a24) inverting the top and bottom of the subject through an inversion module; (a25) performing ultrasonic scanning on the lower surface of the subject through a second ultrasonic probe array of the ultrasonic scanning module; and (a26) performing secondary drying on the subject in a preset manner; It includes, and steps (a21) to (a26) may be performed sequentially through a conveyor module that transports the subject in the first direction.

The effects of the present invention are as follows.

Instead of a single ultrasonic probe that was conventionally used for ultrasonic inspection, an ultrasonic probe array with a specific structure consisting of multiple probe elements can be used, so surface-based inspection using an array structure rather than the conventional line-based inspection can be performed. This can improve the accuracy and speed of ultrasonic testing.

In particular, if the direction in which the ultrasonic signal for defect inspection is irradiated is specified to reduce the influence of ultrasonic scattering due to the protruding shape of the detailed circuit pattern, it may be possible to detect potential defects that exist near the detailed circuit pattern.

1 is an overall conceptual diagram of an ultrasonic inspection system according to the present invention.
Figure 2 is a schematic overall perspective view of the ultrasonic inspection system according to the present invention.
Figure 3 is a plan view of an ultrasonic inspection system according to the present invention.
Figure 4 is a perspective view schematically showing the conveyor module of the ultrasonic inspection system according to the present invention, together with the alignment confirmation module.
Figure 5 is a perspective view schematically showing the ultrasonic scanning module of the ultrasonic inspection system according to the present invention.
Figure 6 is a perspective view schematically showing the inversion module of the ultrasonic inspection system according to the present invention.
Figure 7 is a perspective view schematically showing the hot chamber part of the drying module of the ultrasonic inspection system according to the present invention.
Figure 8 is a schematic diagram schematically showing the ultrasonic probe of the ultrasonic inspection system according to the present invention.
Figure 9 is a reference diagram for explaining a method of generating a boundary pattern image of a subject using an ultrasonic probe array.
Figure 10 is a flowchart of a method for determining whether an object on a shuttle jig is in the correct position according to the present invention.
Figure 11 is a schematic diagram of the entire process of the ultrasonic inspection system according to the present invention.
FIG. 12 is a flowchart for explaining the schematic diagram of FIG. 11.
Figure 13 shows the result data of examining a subject using the ultrasonic inspection system according to the present invention.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. The description below is only intended to specify embodiments and is not intended to limit or limit the scope of rights according to the present invention. What a person skilled in the art related to the present invention can easily infer from the detailed description and examples of the invention should be construed as falling within the scope of rights according to the present invention.

The terms used in the present invention are described as general terms widely used in the technical field related to the present invention, but the meaning of the terms used in the present invention is the intention of the technician working in the field, the emergence of new technology, examination standards, or precedents. It may vary depending on etc. Some terms may be arbitrarily selected by the applicant, in which case the meaning of the arbitrarily selected terms will be explained in detail. Terms used in the present invention should be construed not only in their dictionary meaning, but in a meaning that reflects the overall context of the specification.

Terms such as 'consists of' or 'includes' used in the present invention should not necessarily be interpreted as including all of the components or steps described in the specification, and if some components or steps are not included, And if additional components or steps are further included, they should also be interpreted as intended from the corresponding terms.

The terms described below are terms defined in consideration of functions in the present invention, and may vary depending on the intentions or practices of users, operators, and designers. Therefore, the definition should be made based on the contents throughout this specification.

The 'subject' used herein includes semiconductor devices that are the subject of inspection, as well as all objects that can be inspected using ultrasonic irradiation, and is also called a work. In this application, the explanation is made on the premise that the subject has a planar shape, but the shape of the subject is not limited thereto.

Additionally, the 'first direction' used herein refers to the direction in which the conveyor module (rail and belt) extends. In other words, the extension direction of the conveyor module is used herein to mean the transport direction of the subject. Additionally, 'second direction' refers to the width direction of the conveyor module. Based on the horizontal direction, the first direction and the second direction mean mutually perpendicular directions.

In the term 'matrix' used herein, for convenience of explanation, the first direction is used to mean 'column' and the second direction is used to mean 'row'.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. Detailed descriptions of matters widely known to those skilled in the art related to the present invention will be omitted.

Overall configuration of ultrasonic inspection system

Figure 1 is an overall conceptual diagram of the ultrasonic inspection system according to the present invention, Figure 2 is a schematic overall perspective view of the ultrasonic inspection system according to the present invention, and Figure 3 is a plan view of the ultrasonic inspection system according to the present invention.

Referring to Figures 1 to 3, the ultrasonic inspection system according to the present invention largely includes a loader magazine module 101, a conveyor module 110, an ultrasonic scanning module 120, a reversal module 130, and an unloader magazine. (unloader magazine) module 102.

The loader magazine module 101 loads at least one subject in a magazine state, which is a preset arrangement, and is provided with a loading unit 111 for moving the subject. Specifically, the loading unit 111 may transport the subject within the ultrasound examination system. The loading unit 111 can move the object loaded in the form of a magazine at the front end of the ultrasonic inspection system to the conveyor module 110.

Here, the conveyor module 110 performs the function of an 'ultrasonic examination stage', and the subject is moved to the shuttle jig 113 on the conveyor module 110 by the loading unit 111 for ultrasonic examination. At this time, the loading unit 111 may transport the subject to a location for DMC engraving and barcode inspection. As in the illustrated example, the loading unit 111 may be configured in a push-and-pull structure, and the magazine may be located on the front side of the conveyor module 110 in predetermined units.

In Figure 2, the magazine is composed of 5 rows, and the loading unit 111 is configured to transport the magazine in which the object is stacked through a preset guide unit and then seat it on the conveyor module 110. As an example, the loading unit 111 of the ultrasonic inspection system according to the present invention takes 8 seconds to move a unit subject, and assuming that the shuttle jig 113 is a structure capable of seating 8 subjects, the shuttle jig 113 In placing the subject on the jig 113, it takes a short time of 64 seconds in total.

The loading unit 111 may be implemented in the form of a robot arm, or may be implemented in another form of mechanical structure with an element transport function, and is not limited to the form shown in the drawings. Specify.

The conveyor module 110 receives the subject through the loading unit 111 and performs the function of transporting the subject in the first direction.

The conveyor module 110 consists of a transfer unit 112, a shuttle jig 113, and a drive unit 114. The transfer unit 112 supports the shuttle jig 113 to be movable and functions to guide the movement of the shuttle jig 113. To this end, the transfer unit 112 extends in the first direction, and the transfer unit 112 is connected to the drive unit 114 to receive power from the drive unit 114. By the operation of the driving unit 114, the transfer unit 112 moves continuously in the first direction, but stops at each preset individual section to perform ultrasonic inspection.

Regarding the above sections, the conveyor module 110 according to the present invention is largely divided into the following five sections (or areas).

The 'first section' is a section in which the loader magazine module 101 operates.

The 'second section' is a section where ultrasonic scanning is performed by the first ultrasonic probe array 121.

The 'third section' is a section in which the subject is flipped by the inversion module 130.

The 'fourth section' is a section where ultrasonic scanning is performed by the second ultrasonic probe array 122.

The 'fifth section' is a section in which the unloader magazine module 101 operates.

Here, the first to fifth sections are formed sequentially along the first direction, and the processor 160 is configured to control the operation of the driver 114 in conjunction with the driver 114 according to preset conditions. . For example, while ultrasonic scanning is performed by the first ultrasonic probe array 121 in the second section, the driving unit 114 does not operate, thereby maintaining the stationary state of the transfer unit 112. After the ultrasonic examination of the upper surface of the subject is completed by the first ultrasonic probe array 121 and the acquisition of image information is completed, the processor 160 is configured to transmit an operation signal to the driving unit 114.

The shuttle jig 113 is coupled to the transfer unit 112 and provides a space where the subject can be stably seated. That is, the subject is configured to move in the first direction while seated on the shuttle jig 113. At this time, the shuttle jig 113 is formed to seat the subject in an arrangement of an M*N matrix (M and N are natural numbers). 2-4, an example structure is shown where M=2, N=4. In other words, one unit of shuttle jig 113 can transport a total of eight subjects simultaneously.

As described above, the shuttle jig 113 transports a plurality of subjects simultaneously, and the driving unit 114 operates based on the arrangement of the shuttle jig 113. Instead of moving it continuously, the shuttle jig is moved discontinuously so that ultrasonic inspection (or scanning) is performed one row at a time. That is, it can be moved in the first direction by the scanning unit.

The ultrasonic scanning module 120 is configured to perform ultrasonic scanning on a subject mounted on a shuttle jig 113 moving on the conveyor module 110.

The ultrasonic scanning module 120 includes an ultrasonic probe array (121, 122). The ultrasonic probe arrays 121 and 122 can irradiate a test object with a test signal having a frequency in the ultrasonic range and thereby measure echo signals reflected from the boundary surfaces of each layer of the test object. The ultrasonic probe arrays 121 and 122 may be composed of a plurality of probe elements 124d rather than a single probe, thereby performing 'plane-based' scanning rather than 'line-based' scanning. can do.

In the ultrasonic scanning process, ultrasonic signals and echo signals can be transmitted through an ultrasonic transmission medium. For example, when ultrasonic signals and echo signals are transmitted through an ultrasonic transmission medium such as water, attenuation in the high frequency region can be reduced compared to when transmitted through air, so defect inspection can be performed more smoothly. . In addition to the water exemplified, other suitable types of materials that can prevent signal attenuation can be used as a medium for ultrasonic transmission.

The shape of the ultrasonic probe arrays 121 and 122 is formed to correspond to the shape of the shuttle jig 113, so that ultrasonic inspection efficiency can be maximized. The ultrasonic probe arrays 121 and 122 may be configured in the same manner as the arrangement of the shuttle jig 113 described above. However, considering that the ultrasonic probes are expensive, the ultrasonic probe arrays 121 and 122 are configured with the ultrasonic probes 121a. , 122a) is preferably arranged in a parallel structure corresponding to the M row above.

Referring to FIG. 5, the ultrasonic probe arrays 121 and 122 are formed of dual ultrasonic probes with M=2, and can perform ultrasonic scanning of two units of objects at the same time. At this time, the driving unit 114 is configured to move the shuttle jig 113 by a distance corresponding to the ultrasonic scanning interval. Of course, the ultrasonic probe arrays 121 and 122 may be formed in a structure in which ultrasonic scanning is performed while the shuttle jig 113 is moved in the first direction by the drive unit 114 while the ultrasonic probe arrays 121 and 122 are fixed. The probe arrays 121 and 122 may be combined with a separate driving device to perform ultrasonic scanning while the ultrasonic probe arrays 121 and 122 move in the first direction or in a direction opposite to the first direction. This can be optimally designed depending on the designer's choice.

Meanwhile, the semiconductor substrate of the object under test may have an upper semiconductor pattern formed on the upper surface of the substrate and a lower semiconductor pattern formed on the lower surface of the substrate. For example, depending on the semiconductor packaging design, a substantive detailed circuit pattern among the top and bottom patterns may be formed on one side, and ancillary patterns such as a heat dissipation structure may be formed on the other side.

Considering this, the ultrasonic scanning module 120 can be designed in various ways. For example, the ultrasonic scanning module 120 can be designed in a top-bottom simultaneous measurement method, and as a result, a top image for the top semiconductor pattern and a bottom image for the bottom semiconductor pattern can be generated.

However, when ultrasonic scanning of the upper and lower surfaces is performed simultaneously by an ultrasonic probe array and an additional ultrasonic probe array in the upper and lower simultaneous measurement method, the overall image is blurred due to the influence of ultrasonic scattering due to the three-dimensional structure of the detailed circuit pattern. Since there is a problem with acquisition, it is more desirable to design it with a separate upper and lower measurement method rather than a simultaneous upper and lower measurement method. Below, the explanation is based on the premise of ‘separate measurement method for top and bottom’.

In the 'top and bottom separate measurement method', unlike the above-mentioned top and bottom simultaneous measurement method, after ultrasonic scanning of the upper semiconductor pattern is performed to generate a top image, ultrasonic scanning of the bottom semiconductor pattern is performed to create a bottom image. This is how it is created.

In relation to the upper and lower separate measurement method, in the ultrasonic scanning process, after ultrasonic scanning of the upper surface is performed by the ultrasonic probe arrays 121 and 122, an additional ultrasonic probe is additionally provided to irradiate an ultrasonic signal for defect inspection to the lower surface. Additional ultrasonic scanning of the lower surface can be performed by the array.

The present invention provides an ultrasonic scanning module 120 and an inversion module 130 structure optimized for separate upper and lower measurement methods.

The ultrasonic scanning module 120 consists of a first ultrasonic probe array 121 that ultrasonic scans the upper surface of the subject and a second ultrasonic probe array 122 that ultrasonic scans the lower surface of the subject. Here, the 'upper surface' and 'lower surface' are defined based on the state of the subject before entering the ultrasonic scanning module 120, and may be divided into 'one side' and 'the other side'.

The first ultrasound probe array 121 will be described in detail.

Figures 8 (a) and (b) show an exemplary structure of an ultrasonic probe array, and (c) shows an operation method of the ultrasonic probe array. As shown, because the ultrasonic probe array has an array structure, it can have higher precision and scan speed than a single probe structure.

The ultrasonic probe arrays 121 and 122 may include a plurality of probe elements 121d arranged in a row at a constant pitch, and the size and size of each of the plurality of probe elements 121d and a plurality of probe elements ( The size of the constant pitch of 121d) can be determined according to the scanning time required for each sheet of the subject.

The plurality of probe elements 121d are configured in the form of an oscillator and can generate ultrasonic signals for defect inspection using a method such as phased array ultrasonics. The scanning speed may vary depending on the pitch indicating the arrangement spacing of the plurality of probe elements 121d and the size of each probe element 121d. When other factors are equal, as the pitch increases, the scanning speed may increase but the scanning resolution may decrease.

When full inspection of a large number of devices is required, such as in the case of power module devices for autonomous vehicles, requirements for the time required for each device, that is, scanning speed, may be set. At this time, detailed specifications of the ultrasonic probe array, such as the pitch between probe elements or the size of each probe element, may be changed to meet the required scanning speed.

Referring to (c) of FIG. 8, the ultrasonic probe arrays 121 and 122 can perform ultrasonic scanning on a subject. Planar scanning can be performed on a device having a certain size, for example, 190 mm * 140 mm, one line at each scan interval.

Figure 9 is a reference diagram for explaining a method of generating a boundary pattern image of a subject using an ultrasonic probe array.

Referring to FIG. 9, an ultrasonic scanning process 210 and an echo generation process 220 are shown in relation to a method of generating a boundary pattern image of an object using an ultrasonic probe array.

Regarding the ultrasonic scanning process 210, ultrasonic scanning of the subject using the ultrasonic probe arrays 121 and 122 may be performed through an ultrasonic transmission medium. Specifically, the ultrasonic signal for defect inspection may be irradiated to the upper semiconductor pattern through an ultrasonic transmission medium charged between the ultrasonic probe array and the object to prevent attenuation of the ultrasonic signal for defect inspection occurring in the high frequency region, The medium for transmitting ultrasonic waves may be a liquid, and the liquid may be water or other mixtures that facilitate ultrasonic transmission.

Ultrasonic signals for defect inspection by the ultrasonic probe arrays 121 and 122 may be irradiated to the subject through a medium and reflected at the interface between materials. As an example, the object under test may have a three-layer structure of a top semiconductor pattern, a semiconductor substrate, and a bottom semiconductor pattern, and ultrasonic signal reflection may occur at the interlayer interface or the medium-device interface.

As in the echo generation process 220, the reflected ultrasonic signal, that is, the ultrasonic echo signal, may reflect the properties of the interface material. As shown, ultrasonic echo signals with different characteristics may be generated for each type of boundary, and in particular, when a defect exists inside the object, a corresponding ultrasonic echo signal may be generated at the boundary of the defect.

Accordingly, the processor 160 can generate an interface pattern image indicating whether there is any abnormality in the interface pattern or whether there is an internal defect such as a crack or peeling by analyzing the ultrasonic echo signal from the object under test.

The inversion module 130 is located between the first and second ultrasonic probe arrays 121 and 122 based on the first direction. The subjects for which ultrasonic scanning has been completed by the first ultrasonic probe array 121 are flipped upside down by the inversion module 130, and are provided to the second ultrasonic probe array 122 in an inverted state. Through this series of processes, the top and bottom separate measurement method can be effectively applied.

Referring to FIG. 6 , the inversion module 130 is configured to flip an object on which primary ultrasonic scanning (meaning upper surface scanning) has been completed by the first ultrasonic probe array 121. As described above, the subject moves while mounted on the shuttle jig 113, and the ultrasonic scanning of one unit of the shuttle jig 113 is completed and the shuttle jig 113 enters the third section. When this is completed, the inversion module 130 operates.

Specifically, the inversion module 130 consists of a flipping unit 131 and a pickup unit 132.

The flipping unit 131 is disposed on the outside of the transfer unit 112 and is configured to flip the subject so that it is upside down. It includes a support body 131a and a rotating body 131b that support the object moved from the pickup unit 132 in the second direction. However, the structure shown in FIG. 6 is an exemplary structure of the flipping unit 131, and any structure can be adopted as long as it can stably rotate the subject.

The support body 131a is formed in a shape corresponding to the shuttle jig 113, and is configured to invert the upper and lower sides of the subject while accommodating a 2*4 subject. The rotating body 131b includes a rotating shaft and is arranged in a direction parallel to the first direction in order to minimize pickup efficiency and the moving line of the pickup unit 132.

The pickup unit 132 is provided on the upper side of the conveyor module 110, moves the subject on the shuttle jig 113 to the flipping unit 131, and flips the subject upside down by the flipping unit 131. It serves to move it to its original position on the shuttle jig (113). That is, the pickup unit 132 couples the object to be inspected on the shuttle jig 113 in a predetermined manner, lifts it upward, and moves in the second direction to support the support 131a of the flipping unit 131. Move the subject upward. The pickup unit 132 may be configured to retrieve objects mounted on one row of the shuttle jig 113. In the case of the shuttle jig 113 that accommodates 2*4 subjects, a process of extracting the subjects in the first row and then the subjects in the second row is necessary.

An exemplary operation of the inversion module 130 will be described. First, the pickup unit 132 pulls out 4 rows (meaning 4) of objects located in the first row of the shuttle jig 113, and then moves them onto the support 131a of the flipping unit 131. (meaning movement in the second direction). Next, the pickup unit 132 moves again to the upper side of the conveyor module 110, takes out the four rows of objects located in the second row of the shuttle jig 113, and then moves them onto the support body 131a. At this time, the subjects in the 4th row located in the 2nd row can be moved to a position parallel to the 1st row that has already been moved to the support 131a.

Next, the first row of objects arranged on the support 131a are inverted, and then the second row of objects are inverted, thereby inverting the upper and lower sides of all the objects. Finally, the pickup unit 132 completes preparations to enter the second ultrasonic probe array 122 by moving the objects arranged in 2*4 on the support 131a back onto the shuttle jig 113.

The second ultrasonic probe array 122 can complete the upper and lower separate measurement method by performing ultrasonic scanning again on the subject whose upper and lower surfaces are inverted. Since the process performed in the second ultrasonic probe array 122 is the same as that in the first ultrasonic probe array 121 described above, overlapping descriptions will be omitted.

The shuttle jig 113, on which ultrasonic scanning has been completed by the second ultrasonic probe array 122, enters the fifth section by the transfer unit 112. The fifth section refers to the rear end of the transfer unit 112, and the unloading unit 115 of the unloader magazine module 101 reloads the subject for which ultrasonic scanning of the upper and lower surfaces has been completed in a preset arrangement. At this time, it can be loaded in magazine form.

Referring to FIG. 5, the ultrasonic scanning module 120 according to the present invention supplies an ultrasonic transmission medium in a waterfall manner, and thus the ultrasonic transmission medium needs to be dried. For this purpose, air drying units 151 and 152 are provided at the rear ends of the first and second ultrasonic probe arrays 122, respectively, to spray air onto the subject in an air knife manner.

At this time, the air drying units 151 and 152 are provided on the conveyor module 110, are located on the upper side adjacent to the subject, and are formed to have a predetermined slope downward, and air flows downward along the slope. It is configured to be sprayed. By blowing air through the air drying units 151 and 152, the ultrasonic transmission medium remaining in the subject can be dried.

Meanwhile, an additional drying process is performed in the fifth section. A hot chamber unit 153 is provided on the outside of the conveyor module 110, and the subject placed in the shuttle jig by the unloading unit 115 is not loaded directly in the form of a magazine, but is loaded in the hot chamber unit 153. After the drying process is performed, it can be configured to be loaded in the form of a magazine.

Here, the unloading unit 115 may be configured in the form of a robot arm, forms a hollow, and a seating jig 153c is provided inside the hot chamber unit 153, which forms a sealed structure through the cover 153c. . The unloading unit 115 moves the object of the shuttle jig 113 onto the seating jig 153c, and then the hot chamber unit 153 operates to perform drying. The arrangement of the seating jig 153c, like the shuttle jig 113, is preferably configured to seat the object in an M*N matrix arrangement.

Alignment confirmation module of ultrasonic inspection system

The ultrasonic inspection system according to the present invention includes an alignment confirmation module 140. The alignment confirmation module 140 consists of first to third alignment units 141, 142, and 143. This will be explained with reference to FIG. 4 .

The first alignment unit 141 is formed through the index sensor 141a provided on the lower side of the shuttle jig 113 and the detection hole 113a formed at a preset position in each of the shuttle jig 113, It is configured to check whether the specimen is in the correct position. The index position can be maintained through two-step speed control of the driving unit 114. Here, the driving unit 114 is composed of a servo motor and can control index moving. Accordingly, the shuttle jig 113 can be moved only a predetermined distance.

The index sensors 141a may be formed in a pair to be spaced apart from each other in the first direction, and the distance between the pair of index sensors 141a may be configured to correspond to the distance between the objects under test.

The second alignment unit 142 uses a detection camera 142a configured to recognize a reference mark preset in each of the shuttle jigs 113 to check whether the subject on the shuttle jig 113 is in the correct position. It is configured to do so. Figure 4 shows a 2*4 matrix of shuttle jigs 113, which have a structure in which a total of 8 subjects can be mounted. After displaying a reference mark corresponding to the shape of the subject in advance in each of the eight spaces, the reference mark is recognized using the detection camera 142a while the subject is mounted on the shuttle jig 113. If the subject deviates from the pre-displayed reference mark, it is determined that the subject is not in the correct position, and the position can be rearranged.

The second alignment unit 142 is preferably provided before the first ultrasonic probe array 121, before the shuttle jig 113 enters the ultrasonic scanning module 120, and can maximize the accuracy of ultrasonic scanning. .

The third alignment unit 143 is formed to correct reference marks preset on each of the shuttle jigs 113 based on image information generated by the ultrasonic probe arrays 121 and 122. The information acquired from the ultrasonic probe arrays 121 and 122 is transmitted to the processor 160 to generate image information. Since the reference mark is confirmed in the image information, the position of the reference mark itself is displayed at the correct position. This is to check whether it has been done. If the position of the reference mark is not in the correct position, the position of the reference mark displayed on the shuttle jig 113 can be corrected.

It is preferable that the first to third alignment units 141, 142, and 143 are performed sequentially. Referring to FIG. 10, a flowchart of a method for determining whether an object under test is in the correct position on a shuttle jig using the first to third alignment units 141, 142, and 143 is shown.

The method includes steps S110 to S130.

Step (S110) uses the index sensor 141a provided on the lower side of the shuttle jig 113 and the detection hole 113a formed at a preset position in each of the shuttle jig 113, and transport of the shuttle jig 113 This is the first alignment step that determines whether the subject is in the correct position based on speed control.

Step (S120) is a second alignment step of checking whether the subject is in the correct position using a detection camera (142a) configured to recognize a reference mark preset in each of the shuttle jigs (113).

Step S130 is a third alignment step formed to correct reference marks preset on each of the shuttle jigs 113 based on image information generated by the ultrasonic probe arrays 121 and 122.

Referring to Figures 11 and 12, the entire alignment process of the ultrasonic inspection system according to the present invention will be described.

The driving unit 114 includes a servomotor 141b and a rotary encoder 141c that control index moving. The driving unit 114 is connected to a transfer unit 112 in the form of a conveyor belt, and a tension adjusting unit 105 that controls the tension of the driving unit 114 is provided on the other side of the driving unit 114.

*A belt tension maintaining part (ROSTA) 104 is located between the driving part 114 and the tension adjusting part 105, and adjusts the tension of the conveying part 112 by moving the roller in the up and down direction.

The side where the driving unit 114 is located is called the front end, and the side where the tension adjusting unit 105 is located is called the rear end. A first alignment unit 141 is provided at the front end, and a second alignment unit 142 is provided at the rear end of the first alignment unit 141. When the correct position of the subject is confirmed by the second alignment unit 142, the shuttle jig 113 is configured to enter the ultrasonic scanning module 120. At this time, the ultrasonic scanning module 120 is configured to control the height of each subject after checking the height between the ultrasonic probe arrays 121 and 122 and the subject.

Lastly, the processor 160 is configured to correct the reference mark displayed on the shuttle jig 113 based on the image information generated by the ultrasonic scanning module 120, and is referred to as the third alignment unit 143.

Referring to FIG. 12, the process performed between the above-described second alignment step (S120) and third alignment step (S130) will be described.

The process includes steps S121 to S126.

Step S121 is a step of adjusting the height of the ultrasonic probe array based on the result of step S120. In the ultrasonic scanning module 120, this means checking the height between the ultrasonic probe arrays 121 and 122 and the subject and then adjusting the height of each subject.

Step S122 is a step in which ultrasonic scanning is performed on the upper surface of the subject through the first ultrasonic probe array 121 of the ultrasonic scanning module 120.

Step S123 is a step in which primary drying is performed on the subject in a preset manner, and in one exemplary structure of the present invention, it is performed through the air drying units 151 and 152.

Step S124 is a step in which the top and bottom of the subject is inverted through the inversion module 130.

Step S125 is a step in which ultrasonic scanning is performed on the lower surface of the subject through the second ultrasonic probe array 122 of the ultrasonic scanning module 120.

Step S126 is a step in which secondary drying is performed on the subject in a preset manner, and the subject is dried by the air drying units 151 and 152 described above.

Meanwhile, the ultrasonic inspection system according to the present invention includes a processor 160. The processor 160 controls the components of the ultrasonic inspection system and simultaneously performs computational processing to generate image information based on information transmitted from the ultrasonic scanning module 120.

The processor 160 may generate an internal image of the subject by using the echo signal reflected from the subject. The processor 160 may be implemented in the form of a CPU, GPU, AP, or a combination thereof with a calculation processing function, and may be provided with DRAM, flash memory, SSD, and various other types of memory as needed.

Referring to FIG. 13, when an internal image of the subject, that is, a boundary pattern image, is generated, it can be determined what types of manufacturing defects the subject has. For example, it can be determined from the interface pattern image whether manufacturing defects such as direct bonded copper (DBC) cracks, solder voids, epoxy mold compound (EMC) delamination, spacer distortion, DMC voids, and ceramic pattern delamination exist.

Specifically, Figure 13 (a) shows a state in which a DBC crack has occurred, (b) shows a state in which a solder void has occurred, and (c) shows a state in which EMC peeling has occurred. And (d) can confirm that the spacer is twisted.

In the present invention, the above embodiment is an example and the present invention is not limited thereto. Anything that has substantially the same structure and achieves the same effect as the technical idea described in the claims of the present invention is included in the technical scope of the present invention.

101: Loader magazine module
102: Unloader magazine module
110: Conveyor module
120: Ultrasonic scanning module
130: Inversion module
140: Alignment confirmation module
160: processor

Claims (10)

An ultrasonic inspection device that detects defects in a subject through ultrasonic scanning,
A loader magazine module in which at least one subject is loaded in a preset arrangement and is provided with a loading unit for moving the subject;
A conveyor module that receives an object to be examined by the loading unit located at the front end and transports the object in a first direction;
an ultrasonic scanning module that performs ultrasonic scanning on an object positioned on the conveyor module and includes an ultrasonic probe array formed to correspond to the arrangement of the object;
An unloader magazine module that loads the object on the conveyor module in a preset arrangement through an unloading unit disposed at the rear end of the conveyor module, based on the first direction; Including,
The conveyor module is,
a transfer unit extending in the first direction and moving the subject in the first direction; and
a shuttle jig disposed on the transfer unit and transporting the subject in the first direction in a seated state; Includes,
The ultrasonic scanning module,
a first ultrasonic probe array for ultrasonic scanning the upper surface of the subject; and
a second ultrasound probe array for ultrasound scanning the lower surface of the subject; Includes,
Based on the first direction, between the first and second ultrasonic probe arrays, a reversal module for flipping the subject for which ultrasonic scanning has been completed by the first ultrasonic probe array in a preset manner; It further includes,
The inversion module is,
a flipping unit disposed outside the transfer unit and flipping the subject so that the subject is flipped upside down; and
A pickup unit provided on the upper side of the conveyor module, moves the subject on the shuttle jig to the flipping unit, and moves the subject upside down by the flipping unit to its original position on the shuttle jig; Including,
Ultrasound inspection device.
In claim 1,
The ultrasonic probe array,
Formed as a dual ultrasonic probe, where M is 2,
Ultrasound inspection device. In claim 1,
The second ultrasonic probe array,
Formed to receive a subject in an upside-down state by the inversion module,
Ultrasound inspection device. In claim 3,
The flipping unit and pickup unit,
It extends in the first direction and is configured in a shape corresponding to the 1*N matrix,
The pickup unit,
The subject is moved back and forth between the shuttle jig and the flipping unit the number of times corresponding to the M row, and the reciprocating direction is a second direction perpendicular to the first direction,
Ultrasound inspection device. In claim 1,
The ultrasonic inspection device,
an alignment confirmation module that determines whether the subject on the shuttle jig is in the correct position; It further includes,
The alignment confirmation module is,
A first alignment unit that checks whether the subject on the shuttle jig is in the correct position through an index sensor provided below the shuttle jig and a detection hole formed at a preset position in each of the shuttle jig; Including,
The first alignment unit,
Based on the transfer speed control of the shuttle jig by the conveyor module,
Ultrasound inspection device. In claim 5,
The alignment confirmation module is,
a second alignment unit that checks whether the subject on the shuttle jig is in the correct position using a detection camera configured to recognize reference marks preset on each of the shuttle jigs; It further includes,
The ultrasonic scanning module,
Based on the first direction, disposed at the rear end of the second alignment unit,
Ultrasound inspection device. In claim 6,
The alignment confirmation module is,
a third alignment unit formed to correct reference marks preset in each of the shuttle jigs based on image information generated by the ultrasonic probe array; Containing more,
Ultrasound inspection device. In claim 1,
The shuttle jig,
It is formed to seat the subject in an array of an M*N matrix (M and N are natural numbers),
The ultrasonic probe array,
Ultrasonic probes are arranged in a parallel structure corresponding to the M row.
Ultrasound inspection device.
A method of using the ultrasonic inspection device according to claim 1,
(a1) A first alignment that uses an index sensor provided on the lower side of the shuttle jig and a detection hole formed at a preset position in each of the shuttle jigs, and determines whether the subject is in the correct position based on the transfer speed control of the shuttle jig. step;
(a2) a second alignment step of checking whether the subject is in the correct position using a detection camera configured to recognize a reference mark preset on each of the shuttle jigs; and
(a3) a third alignment step formed to correct reference marks preset on each of the shuttle jigs based on image information generated by the ultrasonic probe array; Including,
method. In claim 9,
After step (a2) and before step (a3),
(a21) adjusting the height of the ultrasonic probe array based on the results in step (a2);
(a22) performing ultrasonic scanning on the upper surface of the subject through a first ultrasonic probe array of the ultrasonic scanning module;
(a23) performing primary drying on the subject in a preset manner;
(a24) inverting the top and bottom of the subject through an inversion module;
(a25) performing ultrasonic scanning on the lower surface of the subject through a second ultrasonic probe array of the ultrasonic scanning module; and
(a26) performing secondary drying on the subject in a preset manner; Includes,
Steps (a21) to (a26) are,
Performed sequentially through a conveyor module that transports the subject in the first direction,
method.