JP7368654B1 - ultrasound imaging device - Google Patents

Abstract

The present invention provides an ultrasound imaging device having a plurality of probes with improved restrictions on probes to be attached.
[Solution] An ultrasonic imaging device that irradiates an object made of semiconductors stacked in multiple layers with ultrasonic waves and obtains the reflected waves to visualize the laminated interface of the object, which includes a control device, a stage 35 The first three-axis scanner 10 and the second three-axis scanner 20 are arranged above, and the first probe holder 14 is attached to the first three-axis scanner 10 and held in the first probe holder 14. A first probe 15 that irradiates an object with ultrasound using a first irradiation method and a second probe holder 24 are attached to a second three-axis scanner 20. a second probe 25 that irradiates the object with ultrasonic waves using the second irradiation method; either the first probe 15 or the second probe 25 irradiates the object with the ultrasonic waves.
[Selection diagram] Figure 2

Description

The present invention relates to an ultrasound imaging device.

An ultrasonic imaging device irradiates an object to be inspected (subject) with ultrasonic waves from a probe, receives the reflected waves, and images the target interface. Non-Patent Document 1 describes an ultrasound imaging device that has a twin probe equipped with both a single probe using a single scan method for high-definition measurement and an array probe using an electronic scan method for high-speed measurement. Proposed. This makes it possible to omit the work involved in replacing probes, thereby improving work efficiency.

Ultrasonic imaging device FineSAT Hybrid, [online], May 22, 2020, Internet <URL: https://www.hitachi-power-solutions.com/product-site/finesat/products/finesat-hybrid/ index.html＞

The technology disclosed in Non-Patent Document 1 has been widely used, but since a single type probe and an array type probe are attached to one 3-axis scanner at the same time, the array has a large mass due to the load capacity of the 3-axis scanner. There was a restriction that a type probe could not be attached. Therefore, there is a problem that an array type probe having a plurality of probes cannot meet the need to scan an object at a higher speed.

The present invention has been made in view of the above-mentioned problems, and an object of the present invention is to provide an ultrasound imaging apparatus having a plurality of probes that improves the restrictions on the probes to be attached.

In order to achieve the above object, the ultrasonic imaging device of the present invention irradiates an object made of semiconductors stacked in multiple layers with ultrasonic waves, obtains the reflected waves, and images the laminated interface of the object. An ultrasonic imaging device, comprising a control device, a first three-axis scanner and a second three-axis scanner arranged on a stage, and a first probe holder attached to the first three-axis scanner, a first probe that is held in the first probe holder and irradiates the object with the ultrasound by a first irradiation method; a second probe holder is attached to the second three-axis scanner; a second probe that is held in a second probe holder and irradiates the object with the ultrasound using a second irradiation method; the control device is configured such that the first probe includes a plurality of transducers; When an array type probe is selected, the second probe selects a single type probe including a single transducer, and when the first probe selects the single type probe, the second probe The method is characterized in that an array type probe is selected and the object is irradiated with the ultrasound using either the first probe or the second probe. Other aspects of the present invention will be explained in the embodiments described below.

According to the present invention, it is possible to provide an ultrasound imaging device having a plurality of probes with improved restrictions on probes to be attached.

FIG. 1 is a diagram showing the configuration of an ultrasound imaging device according to the present embodiment. FIG. 3 is a diagram showing details of a scanning section according to the present embodiment. It is a figure which shows the example of the combination of a 1st 3-axis scanner and a 2nd 3-axis scanner. 3 is a flowchart illustrating an example of scan processing by the ultrasound imaging device.

Embodiments for implementing the present invention will be described in detail with reference to the drawings as appropriate.
FIG. 1 is a diagram showing the configuration of an ultrasound imaging apparatus 100 according to this embodiment.
The ultrasound imaging device 100 includes a control device 50, a scanning section 30 (mechanical section), and ultrasound probes (first probe 15, second probe 25 (see FIG. 2)). The ultrasound imaging device 100 irradiates ultrasonic waves to irradiation points set at predetermined intervals in an inspection range of a target object via a probe, obtains the reflected waves, and selects objects to be inspected from among the reflected waves. Extract interface echoes that indicate the waveform of the bonded interface, apply processing to generate pixelization information from the signal intensity of the interface echoes to all irradiation points or a specific irradiation point, and then perform processing based on the pixelization information of the generated irradiation points. Generate an image of the bonding interface to find defects.

The control device 50 includes a processing unit 51 that controls the scanning position of the ultrasonic probe, the transmission and reception of ultrasonic waves, etc., and a processing unit 51 that acquires reflected waves from the first probe 15 and the second probe 25 and generates ultrasonic waves. It has an image generation section 52 that generates an image, and an input/output section 53.

The scanning unit 30 includes a first three-axis scanner 10 and a second three-axis scanner 20 on a stage 35. A first probe holder 14 is attached to the first three-axis scanner 10, and a second probe holder 24 is attached to the second three-axis scanner 20. The first three-axis scanner 10 is controlled via a first control section 19 , and the second three-axis scanner 20 is controlled via a second control section 29 .

FIG. 2 is a diagram showing details of the scanning section 30 according to this embodiment. FIG. 2 shows a combination of the first three-axis scanner 10 and the second three-axis scanner 20 viewed from above. The scanning unit 30 has a first X-axis drive shaft 11 and a second X-axis drive shaft 21 arranged on the stage 35 so as to face each other at one end of the stage 35, and to face each other at the other end. A first Y-axis drive shaft 12 and a second Y-axis drive shaft 22 are arranged.

The first X-axis drive shaft 11 is supported by a first Y-axis drive shaft 12 and a first Y-axis guide 13. Similarly, the second X-axis drive shaft 21 is supported by a second Y-axis drive shaft 22 and a second Y-axis guide 23. Details will be described later with reference to FIG.

A first probe holder 14 is placed on the first X-axis drive shaft 11, and a first Z-axis drive shaft 18 is connected to the first probe holder 14. The first probe 15 is fixedly arranged on the shaft drive shaft 18 via a probe fixing part whose position can be adjusted in the Z-axis direction. The first probe 15 irradiates an object such as a semiconductor with ultrasound using a first irradiation method.

A second probe holder 24 is placed on the second X-axis drive shaft 21, and a second Z-axis drive shaft 28 is connected to the second probe holder 24. A second probe 25 is fixedly arranged on the shaft drive shaft 28 via a probe fixing part whose position can be adjusted in the Z-axis direction. The second probe 25 irradiates an object such as a semiconductor with ultrasound using a second irradiation method.

The first probe 15 has a first origin formed by a motion range in the X-axis direction in which the first X-axis drive shaft 11 operates and a motion range in the Y-axis direction in which the first Y-axis drive shaft 12 operates. The range of the first XY plane with 17 as the origin is operated.

The second probe 25 is formed by a motion range in the X-axis direction in which the second X-axis drive shaft 21 operates and a motion range in the Y-axis direction in which the second Y-axis drive shaft 22 operates. The range of the second XY plane with 27 as the origin is operated.

The first XY plane and the second XY plane are a common range (common scan range 37), and this range operates when the first probe 15 or the second probe 25 is in operation. This is the possible scan range.

In the case of FIG. 2, the arrangement of the first 3-axis scanner 10 (see FIG. 1) and the second 3-axis scanner 20 (see FIG. 1) is point symmetrical in plan view with respect to the center of the common scan range 37. It has become. However, there is no need to be limited to this.

When the first probe 15 is an operating probe, the control device 50 controls the first X-axis drive axis 11 and the first Y-axis drive axis of the first three-axis scanner 10 via the first control unit 19. 12 and the first Z-axis drive shaft 18, a command to drive the required amount, move the first probe 15 to the target position, and emit ultrasonic waves to the first probe 15. The first probe 15 captures the reflected waves received from the object and generates an image of the ultrasonic irradiated surface of the object.

Further, when the second probe 25 is used as an operating probe, the control device 50 controls the second X-axis drive axis 21 and the second Y-axis of the second three-axis scanner 20 via the second control unit 29. An operation command signal is given to the drive shaft 22 and the second Z-axis drive shaft 28, the drive shaft is driven by the required amount, the second probe 25 is moved to the target position, and the second probe 25 emits ultrasonic waves. A command is issued to irradiate the object, and the second probe 25 takes in the reflected waves received from the object and generates an image of the ultrasonic irradiated surface of the object.

FIG. 3 is a diagram showing an example of a combination of the first three-axis scanner 10 and the second three-axis scanner 20. The first three-axis scanner 10 includes a first X-axis drive shaft 11, a first Y-axis drive shaft 12, a first Y-axis guide 13, and a first Z-axis drive shaft 18. ing. The first X-axis drive shaft 11 is movable in the Y-axis direction by a first Y-axis drive shaft 12 and a first Y-axis guide 13 via first X-axis supports 11a and 11b. I can do it.

The second three-axis scanner 20 includes a second X-axis drive shaft 21, a second Y-axis drive shaft 22, a second Y-axis guide 23, and a second Z-axis drive shaft 28. ing. The second X-axis drive shaft 21 is movable in the Y-axis direction by a second Y-axis drive shaft 22 and a second Y-axis guide 23 via second X-axis supports 21a and 21b. I can do it.

Configuration example 38 shows a combination of the first three-axis scanner 10 and the second three-axis scanner 20. It can be seen that in configuration example 38, two sets of three-axis scanners can be combined without interfering with their respective movable ranges.

FIG. 4 is a flowchart illustrating an example of scan processing S60 of the ultrasound imaging apparatus 100. In FIG. 4, selection of the first probe 15 and the second probe 25 will be explained in detail. When the operator turns on the power of the ultrasound imaging device 100, the control device 50 gives a standby command signal to the first three-axis scanner 10 and the second three-axis scanner 20, and the first probe holder 14 (including the first probe 15; the same applies hereinafter) and the second probe holder 24 (including the second probe 25; the same applies hereinafter) are placed on standby at the first standby position 16 and the second standby position 26, respectively. .

(Processing S61)
When the operator gives the first probe selection signal to the ultrasound imaging device 100, the control device 50 gives an operation command signal to the first 3-axis scanner 10 and controls the first probe holder 14. Set at the first origin 17. Thereafter, the operator scans the object with the first probe 15.

Specifically, the control device 50 receives the first probe selection signal, operates the first three-axis scanner 10, sets the array type probe as the working probe at the first origin 17, and then selects the array type probe. The probe scans the entire surface of the object. When a defect or the like is confirmed, its X and Y coordinates are stored as a return position.

(Processing S62)
When the operator applies a second probe selection signal to the ultrasound imaging device, the control device 50 applies a standby command signal to the first three-axis scanner 10 to place the first probe holder 14 in the first standby position. The second probe holder 24 is moved to position 16 and placed on standby, and a return command signal is given to the second three-axis scanner 20 to set the second probe holder 24 at a predetermined return position.

Specifically, the control device 50 receives the second probe selection signal, gives a standby command signal to the first three-axis scanner 10, causes the array type probe to stand by as a standby probe at the standby position, and After operating the No. 2 three-axis scanner 20 and setting the single probe as an operating probe to the return position, a high-definition image is generated using the single probe.

(Processing S63)
If a plurality of return positions are stored, the second three-axis scanner 20 is operated to set the single type probe as an active probe at the return position, and then a high-definition image is generated using the single type probe.

Note that the first probe holder 14 and the second probe holder 24 may move in opposite directions. That is, when the operator gives the second probe selection signal to the ultrasound imaging device 100, the control device 50 gives an operation command signal to the second 3-axis scanner 20 and selects the second probe holder. 24 to the second origin 27. The operator then scans the object with the second probe. When the operator gives the first probe selection signal to the ultrasound imaging device 100, the control device 50 gives a standby command signal to the second 3-axis scanner 20 and moves the second probe holder 24 to the second position. The probe is moved to the standby position 26 and placed on standby, and a return command signal is given to the first three-axis scanner 10 to set the first probe holder 14 at a predetermined return position.

Further, the first standby position 16 is set at a predetermined position on the first X-axis drive shaft 11 or the first Y-axis drive shaft 12, and the second standby position 26 is set at a predetermined position on the first X-axis drive shaft 11 or the first Y-axis drive shaft 12. It is set at a predetermined position on the drive shaft 21 or the second Y-axis drive shaft 22.

Thereby, when either the first probe 15 or the second probe 25 is in operation, other probes will not come into contact with it. That is, the axis is set outside the common scan range 37.

As an example of actual use, an array-type probe is selected as the first irradiation method, which is equipped with a plurality of transducers and irradiates the object with ultrasonic waves in an array method, and the second An example is shown in which a single type probe is selected as the second irradiation method for the probe 25, which is equipped with a single transducer and irradiates a single ultrasonic wave to the target object. Note that the first probe 15 and the second probe 25 may have opposite configurations.

The array type probe has a faster scanning speed than the single type probe by electronically scanning the same number of transducers in the Y-axis direction. A single type probe can use a higher frequency than an array type probe, so it is possible to generate a higher definition image.

Furthermore, scan processing will be explained.
The operator gives a first probe selection signal to the ultrasound imaging device, and the ultrasound imaging device 100 gives an operation command signal to the first 3-axis scanner 10 to select an array type probe as the operating probe. and scans the entire surface of the object at high speed. During this process, if the presence of a defect or the like on the object is confirmed, the X and Y coordinates are stored in the storage section within the control device with that position as the return position.

The operator then applies a second probe selection signal to the ultrasound imaging device. The ultrasound imaging apparatus 100 applies a standby command signal to the first three-axis scanner 10, sets the array probe as a standby probe, moves it to the first standby position 16, and makes it standby. The ultrasound imaging device 100 applies an operation command signal to the second three-axis scanner 20, selects a single type probe as the operating probe, sets it to the return position, scans the object, and obtains a high-definition image of the defective part. generate.

In addition, in this example of the scanning method, when switching the working probe from the first probe 15 to the second probe 25, the return position, which is the position where the second probe 25 is set as the working probe, is set to the first probe 15. Although the probe is set at the position immediately before it stands by as a standby probe, the return position may be set as follows.

When the first probe 15 is a working probe, the second origin 27 of the second XY plane, and when the second probe 25 is a working probe, the first origin 17 of the first XY plane or the object Center position. These may be set according to the operating conditions when inspecting an object in a test operation before the actual operation of the ultrasound imaging apparatus.

Further, the first probe holder 14 and the second probe holder 24 are positioned in the Z-axis direction at a position where the probe tips do not come into contact with the object, and are determined according to inspection conditions during test operation.

As described above, the ultrasound imaging apparatus 100 of this embodiment has the following features.
(1) An ultrasonic imaging device 100 that irradiates an object made of semiconductors stacked in multiple layers with ultrasonic waves and obtains the reflected waves to visualize the laminated interface of the object, which includes a control device 50, a stage The first three-axis scanner 10 and the second three-axis scanner 20 are arranged on the first three-axis scanner 10 , and the first probe holder 14 is attached to the first three-axis scanner 10 and held in the first probe holder 14 . A first probe 15 that irradiates an object with ultrasound using a first irradiation method and a second probe holder 24 are attached to a second three-axis scanner 20 and held in the second probe holder 24. a second probe 25 that irradiates the object with ultrasound using a second irradiation method; either the first probe 15 or the second probe 25 irradiates the object with ultrasound. According to this, it is possible to provide an ultrasound imaging device having a plurality of probes with improved restrictions on probes to be attached.

(2) In the ultrasound imaging device 100 of (1) above, when the power of the ultrasound imaging device 100 is turned on, the control device 50 causes the first 3-axis scanner 10 and the second 3-axis scanner 20 to stand by. When a command signal is given, the first probe holder 14 and the second probe holder 24 are made to stand by at the first standby position 16 and the second standby position 26, respectively, and the first probe selection signal is received, When an operation command signal is given to the first three-axis scanner 10, the first probe holder 14 is set at the first origin 17, the object is scanned, and the second probe selection signal is received, the first A standby command signal is given to the 3-axis scanner 10, the first probe holder 14 is moved to the first standby position 16 and put on standby, an operation command signal is given to the second 3-axis scanner 20, Set the second probe holder 24 to a predetermined return position.

(3) In the ultrasound imaging apparatus 100 of (2) above, the first X-axis drive shaft 11 and the first Y-axis drive shaft 12 that drive the first three-axis scanner 10 are mounted on the stage 35. It is equipped with a second X-axis drive shaft 21 and a second Y-axis drive shaft 22 that drive the second three-axis scanner 20, and has a range in the X-axis direction in which the first X-axis drive shaft 11 operates. A first XY plane formed by the range in the Y-axis direction in which the first Y-axis drive shaft 12 operates, a range in the X-axis direction in which the second X-axis drive shaft 21 operates, and the second Y-axis drive shaft 22 A scan range (common scan range 37) that is a common range in which the operating probe moves is formed by the second XY plane formed by the range in the Y-axis direction in which the operating probe moves.

(4) In the ultrasound imaging apparatus 100 of (3) above, the first X-axis drive shaft 11 and the second X-axis drive shaft 21 are arranged so as to face each other at one end of the stage 35. The first Y-axis drive shaft 12 and the second Y-axis drive shaft 22 are arranged to face each other at the other end of the stage 35. The control device 50 sets the first standby position 16 to a predetermined position on the first X-axis drive shaft 11 or the first Y-axis drive shaft 12 near and outside the scan range, and The position 26 is set at a predetermined position on the second X-axis drive shaft 21 or the second Y-axis drive shaft 22 near and outside the scan range.

(5) In the ultrasound imaging device 100 of (3) above, in a test operation before the actual operation of the ultrasound imaging device 100, the return position is determined based on the operating conditions of the ultrasound imaging device 100 with the operating probe. is switched to the standby probe, and the operating probe is placed at the position immediately before waiting at the standby position, or at the center position of the object, or when the first probe 15 is the operating probe, it is placed at the second position on the second XY plane. When the second probe 25 is an operating probe, it is set at the origin 27 of the first XY plane.

(6) In the ultrasound imaging apparatus 100 of (1) above, when the first probe 15 is an array type probe including a plurality of transducers, the second probe 25 is a single type probe including a single transducer. When the first probe 15 is a single type probe, the second probe 25 is an array type probe. According to this, the operator of the ultrasound imaging apparatus 100 does not need to change the probe, and can quickly select between the array type probe and the single type probe. As a result, the array type probe can visualize defects in the multilayer semiconductor, and without the need for replacement work, the array type probe can be put on standby and the single type probe can be operated to obtain detailed images. .

Note that the present invention is not limited to the embodiments described above, and includes various modifications. Further, the embodiments described above have been described in detail to explain the present invention in an easy-to-understand manner, and the present invention is not necessarily limited to having all the configurations described. Further, it is possible to add, delete, or replace a part of the configuration of each embodiment with other configurations.

10 First 3-axis scanner 11 First X-axis drive axis 12 First Y-axis drive axis 13 First Y-axis guide 14 First probe holder 15 First probe 16 First standby position 17 First Origin of 18 First Z-axis drive axis 19 First control unit 20 Second three-axis scanner 21 Second X-axis drive axis 22 Second Y-axis drive axis 23 Second Y-axis guide 24 Second Probe holder 25 Second probe 26 Second standby position 27 Second origin 28 Second Z-axis drive axis 29 Second control section 30 Scan section 35 Stage 37 Common scan range 50 Control device 51 Processing section 52 Image generation Section 53 Input/output section 100 Ultrasonic imaging device

Claims (5)

An ultrasonic imaging device that irradiates an object made of semiconductors stacked in multiple layers with ultrasonic waves and obtains the reflected waves to visualize the laminated interface of the object,
a control device;
a first 3-axis scanner and a second 3-axis scanner arranged on a stage;
a first probe attached to the first three-axis scanner, a first probe that is held in the first probe holder and irradiates the object with the ultrasound using a first irradiation method;
A second probe holder is attached to the second three-axis scanner, and a second probe is held in the second probe holder and irradiates the object with the ultrasound using a second irradiation method. Prepare,
The control device includes:
When the first probe selects an array type probe including a plurality of transducers, the second probe selects a single type probe including a single transducer,
When the first probe selects the single type probe, the second probe selects the array type probe,
An ultrasound imaging apparatus characterized in that the ultrasound imaging device irradiates the object with the ultrasound using either the first probe or the second probe. The ultrasound imaging device according to claim 1,
The control device includes:
When the power of the ultrasound imaging device is turned on, a standby command signal is given to the first three-axis scanner and the second three-axis scanner, and the first probe holder and the second probe holder are turned on. Waiting at a first standby position and a second standby position, respectively,
Upon receiving a first probe selection signal, applying an operation command signal to the first three-axis scanner to set the first probe holder at a first origin and scan the object;
When the second probe selection signal is received, a standby command signal is given to the first 3-axis scanner to move the first probe holder to the first standby position and wait, and the second 3-axis scanner is An ultrasound imaging device characterized in that a second probe holder is set at a predetermined return position by applying an operation command signal. The ultrasound imaging device according to claim 2,
On the stage,
comprising a first X-axis drive axis and a first Y-axis drive axis that drive the first three-axis scanner,
a second X-axis drive shaft and a second Y-axis drive shaft that drive the second three-axis scanner;
a first XY plane formed by the range in the X-axis direction in which the first X-axis drive shaft operates and the range in the Y-axis direction in which the first Y-axis drive shaft operates; and the second X-axis drive A scan range, which is a common range in which the operating probe moves, is defined by a second XY plane formed by the range in the X-axis direction in which the axis operates and the range in the Y-axis direction in which the second Y-axis drive shaft operates. An ultrasonic imaging device characterized by forming. The ultrasound imaging device according to claim 3,
The first X-axis drive shaft and the second X-axis drive shaft are arranged to face each other at one end of the stage,
The first Y-axis drive shaft and the second Y-axis drive shaft are arranged to face each other at the other end of the stage,
The control device includes:
setting the first standby position at a predetermined position on the first X-axis drive axis or the first Y-axis drive axis near and outside the scan range;
The ultrasound imaging apparatus is characterized in that the second standby position is set at a predetermined position on the second X-axis drive axis or the second Y-axis drive axis near and outside the scan range. . The ultrasound imaging device according to claim 3,
In a test operation before the actual operation of the ultrasound imaging device, the return position is determined based on the operating conditions of the ultrasound imaging device.
Switching the operating probe to a standby probe, and placing the operating probe at a position immediately before waiting at a standby position;
Or, at the center position of the object,
or, when the first probe is the working probe, to the second origin of the second XY plane, and when the second probe is the working probe, to the first origin of the first XY plane;
An ultrasound imaging device characterized in that:

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