KR102652732B1 - 점착 필름 - Google Patents

점착 필름 Download PDF

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KR102652732B1
KR102652732B1 KR1020160171410A KR20160171410A KR102652732B1 KR 102652732 B1 KR102652732 B1 KR 102652732B1 KR 1020160171410 A KR1020160171410 A KR 1020160171410A KR 20160171410 A KR20160171410 A KR 20160171410A KR 102652732 B1 KR102652732 B1 KR 102652732B1
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South Korea
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light
substrate
weight
heat conversion
conversion layer
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Korean (ko)
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KR20180069322A (ko
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양용석
황교성
정규진
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쓰리엠 이노베이티브 프로퍼티즈 컴파니
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Priority to KR1020160171410A priority Critical patent/KR102652732B1/ko
Priority to PCT/IB2017/057947 priority patent/WO2018109711A1/en
Priority to TW106144037A priority patent/TWI764962B/zh
Priority to JP2019531941A priority patent/JP7107623B2/ja
Priority to US16/468,355 priority patent/US11434393B2/en
Priority to CN201780077325.1A priority patent/CN110072959B/zh
Publication of KR20180069322A publication Critical patent/KR20180069322A/ko
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    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/10—Adhesives in the form of films or foils without carriers
    • C—CHEMISTRY; METALLURGY
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    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
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    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
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    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
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    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
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    • C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
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    • C09J133/066—Copolymers with monomers not covered by C09J133/06 containing -OH groups
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    • C09J133/12—Homopolymers or copolymers of methyl methacrylate
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    • C09J179/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09J161/00 - C09J177/00
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    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/40—Adhesives in the form of films or foils characterised by release liners
    • C09J7/403—Adhesives in the form of films or foils characterised by release liners characterised by the structure of the release feature
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • C—CHEMISTRY; METALLURGY
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    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/012—Additives activating the degradation of the macromolecular compounds
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    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
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    • H01L2221/68381—Details of chemical or physical process used for separating the auxiliary support from a device or wafer

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  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Laminated Bodies (AREA)
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