KR102638128B1 - 프린팅된 화학적 기계적 연마 패드 - Google Patents

프린팅된 화학적 기계적 연마 패드 Download PDF

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Publication number
KR102638128B1
KR102638128B1 KR1020227025793A KR20227025793A KR102638128B1 KR 102638128 B1 KR102638128 B1 KR 102638128B1 KR 1020227025793 A KR1020227025793 A KR 1020227025793A KR 20227025793 A KR20227025793 A KR 20227025793A KR 102638128 B1 KR102638128 B1 KR 102638128B1
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South Korea
Prior art keywords
polishing pad
layer
polishing
additive material
base material
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Korean (ko)
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KR20220110333A (ko
Inventor
마헨드라 씨. 오릴랄
티모시 마이클슨
카시라만 크리쉬난
라지브 바자즈
나그 비. 파티반들라
다니엘 레드필드
프레드 씨. 레데커
그레고리 이. 멘크
Original Assignee
어플라이드 머티어리얼스, 인코포레이티드
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Publication of KR20220110333A publication Critical patent/KR20220110333A/ko
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
    • B24D18/0045—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for by stacking sheets of abrasive material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/22—Lapping pads for working plane surfaces characterised by a multi-layered structure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B24B37/245—Pads with fixed abrasives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B33—ADDITIVE MANUFACTURING TECHNOLOGY
    • B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y10/00—Processes of additive manufacturing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B33—ADDITIVE MANUFACTURING TECHNOLOGY
    • B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y80/00—Products made by additive manufacturing

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
KR1020227025793A 2014-10-17 2015-10-16 프린팅된 화학적 기계적 연마 패드 Active KR102638128B1 (ko)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
US201462065190P 2014-10-17 2014-10-17
US62/065,190 2014-10-17
US201462066291P 2014-10-20 2014-10-20
US62/066,291 2014-10-20
PCT/US2015/056021 WO2016061506A1 (en) 2014-10-17 2015-10-16 Printed chemical mechanical polishing pad
KR1020177013087A KR102426444B1 (ko) 2014-10-17 2015-10-16 프린팅된 화학적 기계적 연마 패드

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
KR1020177013087A Division KR102426444B1 (ko) 2014-10-17 2015-10-16 프린팅된 화학적 기계적 연마 패드

Publications (2)

Publication Number Publication Date
KR20220110333A KR20220110333A (ko) 2022-08-05
KR102638128B1 true KR102638128B1 (ko) 2024-02-20

Family

ID=55747430

Family Applications (2)

Application Number Title Priority Date Filing Date
KR1020227025793A Active KR102638128B1 (ko) 2014-10-17 2015-10-16 프린팅된 화학적 기계적 연마 패드
KR1020177013087A Active KR102426444B1 (ko) 2014-10-17 2015-10-16 프린팅된 화학적 기계적 연마 패드

Family Applications After (1)

Application Number Title Priority Date Filing Date
KR1020177013087A Active KR102426444B1 (ko) 2014-10-17 2015-10-16 프린팅된 화학적 기계적 연마 패드

Country Status (6)

Country Link
US (2) US10322491B2 (enExample)
JP (1) JP6703985B2 (enExample)
KR (2) KR102638128B1 (enExample)
CN (1) CN107073677B (enExample)
TW (1) TWI689406B (enExample)
WO (1) WO2016061506A1 (enExample)

Families Citing this family (48)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9873180B2 (en) 2014-10-17 2018-01-23 Applied Materials, Inc. CMP pad construction with composite material properties using additive manufacturing processes
US10821573B2 (en) 2014-10-17 2020-11-03 Applied Materials, Inc. Polishing pads produced by an additive manufacturing process
KR102436416B1 (ko) 2014-10-17 2022-08-26 어플라이드 머티어리얼스, 인코포레이티드 애디티브 제조 프로세스들을 이용한 복합 재료 특성들을 갖는 ｃｍｐ 패드 구성
US10875145B2 (en) 2014-10-17 2020-12-29 Applied Materials, Inc. Polishing pads produced by an additive manufacturing process
US10875153B2 (en) 2014-10-17 2020-12-29 Applied Materials, Inc. Advanced polishing pad materials and formulations
TWI689406B (zh) * 2014-10-17 2020-04-01 美商應用材料股份有限公司 研磨墊及製造其之方法
US9776361B2 (en) 2014-10-17 2017-10-03 Applied Materials, Inc. Polishing articles and integrated system and methods for manufacturing chemical mechanical polishing articles
US11745302B2 (en) 2014-10-17 2023-09-05 Applied Materials, Inc. Methods and precursor formulations for forming advanced polishing pads by use of an additive manufacturing process
US10399201B2 (en) 2014-10-17 2019-09-03 Applied Materials, Inc. Advanced polishing pads having compositional gradients by use of an additive manufacturing process
US10618141B2 (en) 2015-10-30 2020-04-14 Applied Materials, Inc. Apparatus for forming a polishing article that has a desired zeta potential
US10593574B2 (en) 2015-11-06 2020-03-17 Applied Materials, Inc. Techniques for combining CMP process tracking data with 3D printed CMP consumables
US10456886B2 (en) 2016-01-19 2019-10-29 Applied Materials, Inc. Porous chemical mechanical polishing pads
US10391605B2 (en) 2016-01-19 2019-08-27 Applied Materials, Inc. Method and apparatus for forming porous advanced polishing pads using an additive manufacturing process
KR102629658B1 (ko) * 2016-01-21 2024-01-29 쓰리엠 이노베이티브 프로퍼티즈 캄파니 금속 접합제 및 유리질 접합제 연마 용품의 제조 방법, 및 연마 용품 전구체
EP3257660A1 (en) 2016-06-13 2017-12-20 Siemens Aktiengesellschaft Method of providing an abrasive means and of additively manufacturing a component
KR102202909B1 (ko) * 2016-11-21 2021-01-14 주식회사 엘지화학 3d 프린팅용 조성물
US10864612B2 (en) * 2016-12-14 2020-12-15 Taiwan Semiconductor Manufacturing Company, Ltd. Polishing pad and method of using
KR101897659B1 (ko) * 2017-01-16 2018-09-13 원광대학교산학협력단 이중기공 세포지지체 제조시스템 및 제조방법, 그리고 세포지지체
IT201700038586A1 (it) * 2017-04-07 2018-10-07 Aros Srl Metodo per la realizzazione di un utensile.
US20180304539A1 (en) 2017-04-21 2018-10-25 Applied Materials, Inc. Energy delivery system with array of energy sources for an additive manufacturing apparatus
US11471999B2 (en) 2017-07-26 2022-10-18 Applied Materials, Inc. Integrated abrasive polishing pads and manufacturing methods
US11072050B2 (en) 2017-08-04 2021-07-27 Applied Materials, Inc. Polishing pad with window and manufacturing methods thereof
WO2019032286A1 (en) 2017-08-07 2019-02-14 Applied Materials, Inc. ABRASIVE DISTRIBUTION POLISHING PADS AND METHODS OF MAKING SAME
CN111684571A (zh) 2018-02-05 2020-09-18 应用材料公司 用于3d打印的cmp垫的压电终点指示
KR20200140931A (ko) * 2018-05-07 2020-12-16 어플라이드 머티어리얼스, 인코포레이티드 친수성 및 제타 전위 조정가능한 화학적 기계적 연마 패드들
WO2020050932A1 (en) 2018-09-04 2020-03-12 Applied Materials, Inc. Formulations for advanced polishing pads
JP7177932B6 (ja) * 2018-11-19 2022-12-16 アプライド マテリアルズ インコーポレイテッド ３ｄ印刷のための低粘度ｕｖ硬化性調合物
CN109483418B (zh) * 2018-12-28 2023-11-17 西安增材制造国家研究院有限公司 金属基微量润滑砂轮及金属基微量润滑砂轮的制作方法
US20200230781A1 (en) * 2019-01-23 2020-07-23 Applied Materials, Inc. Polishing pads formed using an additive manufacturing process and methods related thereto
US11731231B2 (en) * 2019-01-28 2023-08-22 Micron Technology, Inc. Polishing system, polishing pad, and related methods
TWI850338B (zh) * 2019-02-28 2024-08-01 美商應用材料股份有限公司 拋光墊、化學機械拋光系統、及控制拋光墊的背襯層的剛度的方法
CN110076339A (zh) * 2019-03-06 2019-08-02 上海工程技术大学 一种复杂空腔增材制件内外表面的抛光方法
US11851570B2 (en) 2019-04-12 2023-12-26 Applied Materials, Inc. Anionic polishing pads formed by printing processes
CN114126803B (zh) * 2019-05-07 2024-07-16 Cmc材料有限责任公司 具有固定沟槽体积的化学机械平坦化垫
US12006442B2 (en) 2019-09-11 2024-06-11 Applied Materials, Inc. Additive manufacturing of polishing pads
CN110977801A (zh) * 2019-12-20 2020-04-10 中国科学院长春光学精密机械与物理研究所 一种沥青抛光盘制备装置
US11813712B2 (en) 2019-12-20 2023-11-14 Applied Materials, Inc. Polishing pads having selectively arranged porosity
JP2023523022A (ja) * 2020-04-21 2023-06-01 スマート パッド エルエルシー 突出構造を有する化学的機械研磨パッド
US11738517B2 (en) 2020-06-18 2023-08-29 Applied Materials, Inc. Multi dispense head alignment using image processing
US11806829B2 (en) 2020-06-19 2023-11-07 Applied Materials, Inc. Advanced polishing pads and related polishing pad manufacturing methods
US11878389B2 (en) 2021-02-10 2024-01-23 Applied Materials, Inc. Structures formed using an additive manufacturing process for regenerating surface texture in situ
US11951590B2 (en) 2021-06-14 2024-04-09 Applied Materials, Inc. Polishing pads with interconnected pores
WO2023055663A1 (en) * 2021-09-29 2023-04-06 Entegris, Inc. Pad conditioner with polymer backing plate
KR102700222B1 (ko) * 2021-10-12 2024-08-29 에스케이엔펄스 주식회사 연마패드 및 이를 이용한 반도체 소자의 제조방법
TW202407002A (zh) * 2022-06-15 2024-02-16 美商Ｃｍｃ材料有限責任公司 用於製備化學機械拋光墊之雙重固化樹脂
TW202419495A (zh) * 2022-06-15 2024-05-16 美商Ｃｍｃ材料有限責任公司 用於化學機械拋光墊之uv可固化樹脂
US20250121472A1 (en) * 2023-10-12 2025-04-17 Applied Materials, Inc. Polishing articles for hybrid bonding applications
CN120839671A (zh) * 2025-09-22 2025-10-28 华侨大学 一种增材制造铣磨头及其一体化成型的批量制造方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002067171A (ja) * 2000-08-25 2002-03-05 Canon Inc 目的物生成装置、目的物生成方法、及び記憶媒体
JP2008546167A (ja) * 2005-02-18 2008-12-18 ネオパッド テクノロジーズ コーポレイション Ｃｍｐ用のカスタマイズされた研磨パッド、ならびにその製造方法および使用
US20130283700A1 (en) * 2012-04-25 2013-10-31 Rajeev Bajaj Printed Chemical Mechanical Polishing Pad

Family Cites Families (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5919082A (en) * 1997-08-22 1999-07-06 Micron Technology, Inc. Fixed abrasive polishing pad
JP2000061817A (ja) * 1998-08-24 2000-02-29 Nikon Corp 研磨パッド
US7001252B2 (en) * 2000-05-31 2006-02-21 Jsr Corporation Abrasive material
JP2002028849A (ja) * 2000-07-17 2002-01-29 Jsr Corp 研磨パッド
US6592443B1 (en) * 2000-08-30 2003-07-15 Micron Technology, Inc. Method and apparatus for forming and using planarizing pads for mechanical and chemical-mechanical planarization of microelectronic substrates
US6477926B1 (en) * 2000-09-15 2002-11-12 Ppg Industries Ohio, Inc. Polishing pad
GB0103754D0 (en) * 2001-02-15 2001-04-04 Vantico Ltd Three-dimensional structured printing
JP2004281685A (ja) * 2003-03-14 2004-10-07 Mitsubishi Electric Corp 半導体基板の研磨用パッドおよび半導体基板の研磨方法
US20060189269A1 (en) * 2005-02-18 2006-08-24 Roy Pradip K Customized polishing pads for CMP and methods of fabrication and use thereof
WO2005000529A1 (en) * 2003-06-03 2005-01-06 Neopad Technologies Corporation Synthesis of a functionally graded pad for chemical mechanical planarization
US7435161B2 (en) * 2003-06-17 2008-10-14 Cabot Microelectronics Corporation Multi-layer polishing pad material for CMP
KR100640998B1 (ko) 2003-09-19 2006-11-02 엘지.필립스 엘시디 주식회사 액정표시장치용 브라켓 구조
US20060079159A1 (en) * 2004-10-08 2006-04-13 Markus Naujok Chemical mechanical polish with multi-zone abrasive-containing matrix
WO2006057713A2 (en) 2004-11-29 2006-06-01 Rajeev Bajaj Electro-method and apparatus for improved chemical mechanical planarization pad with uniform polish performance
US7846008B2 (en) 2004-11-29 2010-12-07 Semiquest Inc. Method and apparatus for improved chemical mechanical planarization and CMP pad
US7815778B2 (en) 2005-11-23 2010-10-19 Semiquest Inc. Electro-chemical mechanical planarization pad with uniform polish performance
US7530880B2 (en) 2004-11-29 2009-05-12 Semiquest Inc. Method and apparatus for improved chemical mechanical planarization pad with pressure control and process monitor
KR101616535B1 (ko) 2005-02-18 2016-04-29 넥스플래너 코퍼레이션 화학적 기계적인 평탄화를 위해 적합화된 연마 패드와 그 연마 패드의 제조 및 사용 방법
US7875091B2 (en) * 2005-02-22 2011-01-25 Saint-Gobain Abrasives, Inc. Rapid tooling system and methods for manufacturing abrasive articles
JP2006231464A (ja) * 2005-02-24 2006-09-07 Nitta Haas Inc 研磨パッド
US7829000B2 (en) * 2005-02-25 2010-11-09 Hewlett-Packard Development Company, L.P. Core-shell solid freeform fabrication
CN101808780A (zh) * 2007-09-03 2010-08-18 塞米奎斯特股份有限公司 抛光垫
KR101618273B1 (ko) 2008-04-29 2016-05-04 세미퀘스트, 인코포레이티드 연마 패드 조성물, 및 이의 제조 방법 및 용도
JP5596030B2 (ja) 2008-06-26 2014-09-24 スリーエム イノベイティブ プロパティズ カンパニー 多孔質エレメントを有する研磨パッド及びその製造方法と使用方法
US8292692B2 (en) 2008-11-26 2012-10-23 Semiquest, Inc. Polishing pad with endpoint window and systems and method using the same
US9162340B2 (en) 2009-12-30 2015-10-20 3M Innovative Properties Company Polishing pads including phase-separated polymer blend and method of making and using the same
US9211628B2 (en) * 2011-01-26 2015-12-15 Nexplanar Corporation Polishing pad with concentric or approximately concentric polygon groove pattern
KR20130095430A (ko) * 2012-02-20 2013-08-28 케이피엑스케미칼 주식회사 연마패드 및 그 제조방법
KR102252673B1 (ko) 2013-09-25 2021-05-18 쓰리엠 이노베이티브 프로퍼티즈 컴파니 다층화된 폴리싱 패드
US9421666B2 (en) * 2013-11-04 2016-08-23 Applied Materials, Inc. Printed chemical mechanical polishing pad having abrasives therein
TWI689406B (zh) * 2014-10-17 2020-04-01 美商應用材料股份有限公司 研磨墊及製造其之方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002067171A (ja) * 2000-08-25 2002-03-05 Canon Inc 目的物生成装置、目的物生成方法、及び記憶媒体
JP2008546167A (ja) * 2005-02-18 2008-12-18 ネオパッド テクノロジーズ コーポレイション Ｃｍｐ用のカスタマイズされた研磨パッド、ならびにその製造方法および使用
US20130283700A1 (en) * 2012-04-25 2013-10-31 Rajeev Bajaj Printed Chemical Mechanical Polishing Pad

Also Published As

Publication number Publication date
CN107073677B (zh) 2020-05-15
US10322491B2 (en) 2019-06-18
US20190299357A1 (en) 2019-10-03
US20160107288A1 (en) 2016-04-21
CN107073677A (zh) 2017-08-18
TWI689406B (zh) 2020-04-01
WO2016061506A1 (en) 2016-04-21
KR102426444B1 (ko) 2022-07-29
KR20170070177A (ko) 2017-06-21
JP6703985B2 (ja) 2020-06-03
JP2017533831A (ja) 2017-11-16
TW201615389A (zh) 2016-05-01
KR20220110333A (ko) 2022-08-05

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