KR102614299B1 - 감광성 수지 조성물, 감광성 수지 시트, 중공 구조체, 경화물, 중공 구조체의 제조 방법, 전자 부품 및 탄성파 필터 - Google Patents
감광성 수지 조성물, 감광성 수지 시트, 중공 구조체, 경화물, 중공 구조체의 제조 방법, 전자 부품 및 탄성파 필터 Download PDFInfo
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- KR102614299B1 KR102614299B1 KR1020227015121A KR20227015121A KR102614299B1 KR 102614299 B1 KR102614299 B1 KR 102614299B1 KR 1020227015121 A KR1020227015121 A KR 1020227015121A KR 20227015121 A KR20227015121 A KR 20227015121A KR 102614299 B1 KR102614299 B1 KR 102614299B1
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- Prior art keywords
- photosensitive resin
- resin composition
- glass filler
- hollow structure
- oxide
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- 239000011342 resin composition Substances 0.000 title claims abstract description 123
- 229920005989 resin Polymers 0.000 title claims description 66
- 239000011347 resin Substances 0.000 title claims description 66
- 238000004519 manufacturing process Methods 0.000 title claims description 6
- 239000011521 glass Substances 0.000 claims abstract description 89
- 239000000945 filler Substances 0.000 claims abstract description 83
- 239000000758 substrate Substances 0.000 claims abstract description 38
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- 150000001875 compounds Chemical class 0.000 claims abstract description 18
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- 239000003999 initiator Substances 0.000 claims abstract description 14
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 12
- 229910052810 boron oxide Inorganic materials 0.000 claims abstract description 10
- 239000003431 cross linking reagent Substances 0.000 claims abstract description 10
- JKWMSGQKBLHBQQ-UHFFFAOYSA-N diboron trioxide Chemical compound O=BOB=O JKWMSGQKBLHBQQ-UHFFFAOYSA-N 0.000 claims abstract description 10
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims abstract description 10
- 229910052814 silicon oxide Inorganic materials 0.000 claims abstract description 10
- 238000000034 method Methods 0.000 claims description 42
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- PTFCDOFLOPIGGS-UHFFFAOYSA-N Zinc dication Chemical compound [Zn+2] PTFCDOFLOPIGGS-UHFFFAOYSA-N 0.000 claims description 15
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- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims description 7
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- C08F283/04—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to polycarbonamides, polyesteramides or polyimides
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- C—CHEMISTRY; METALLURGY
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- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
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- C08F2/44—Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers
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- C—CHEMISTRY; METALLURGY
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- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
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- C08F2/50—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light with sensitising agents
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
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- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
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- C—CHEMISTRY; METALLURGY
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- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
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- G—PHYSICS
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- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
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| JP6528190B2 (ja) * | 2014-10-30 | 2019-06-12 | 旭ファイバーグラス株式会社 | 透明ａｂｓ樹脂組成物 |
| CN107531031A (zh) * | 2015-05-11 | 2018-01-02 | 日立化成株式会社 | 转印型感光性折射率调整膜、折射率调整图案的形成方法及电子部件 |
| JP6677203B2 (ja) * | 2017-03-28 | 2020-04-08 | 味の素株式会社 | 感光性樹脂組成物、感光性フィルム、支持体付き感光性フィルム、プリント配線板及び半導体装置 |
| US20220155684A1 (en) * | 2019-03-27 | 2022-05-19 | Toray Industries, Inc. | Photosensitive resin composition, photosensitive resin sheet, method for producing hollow structure, and electronic component |
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- 2020-11-10 KR KR1020227015121A patent/KR102614299B1/ko active IP Right Grant
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP2013088740A (ja) | 2011-10-21 | 2013-05-13 | Panasonic Corp | 感光性ペースト |
| JP2015118194A (ja) | 2013-12-18 | 2015-06-25 | 東レ株式会社 | 感光性樹脂組成物、それからなる感光性樹脂フィルム、それから形成された絶縁膜およびそれを有する多層配線基板 |
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| CN114730127A (zh) | 2022-07-08 |
| CN114730127B (zh) | 2023-05-12 |
| KR20220104688A (ko) | 2022-07-26 |
| WO2021100538A1 (fr) | 2021-05-27 |
| JP7111186B2 (ja) | 2022-08-02 |
| JPWO2021100538A1 (fr) | 2021-05-27 |
| TWI834010B (zh) | 2024-03-01 |
| TW202120450A (zh) | 2021-06-01 |
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