WO2021100538A1 - Composition de résine photosensible, feuille de résine photosensible, structure creuse, matériau durci, procédé de production de structure creuse, composant électronique et filtre à ondes élastiques - Google Patents

Composition de résine photosensible, feuille de résine photosensible, structure creuse, matériau durci, procédé de production de structure creuse, composant électronique et filtre à ondes élastiques Download PDF

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Publication number
WO2021100538A1
WO2021100538A1 PCT/JP2020/041824 JP2020041824W WO2021100538A1 WO 2021100538 A1 WO2021100538 A1 WO 2021100538A1 JP 2020041824 W JP2020041824 W JP 2020041824W WO 2021100538 A1 WO2021100538 A1 WO 2021100538A1
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WO
WIPO (PCT)
Prior art keywords
photosensitive resin
resin composition
glass filler
hollow structure
group
Prior art date
Application number
PCT/JP2020/041824
Other languages
English (en)
Japanese (ja)
Inventor
河野友孝
松元亜紀子
金森大典
桂田悠基
Original Assignee
東レ株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 東レ株式会社 filed Critical 東レ株式会社
Priority to CN202080076960.XA priority Critical patent/CN114730127B/zh
Priority to KR1020227015121A priority patent/KR102614299B1/ko
Priority to JP2020567171A priority patent/JP7111186B2/ja
Publication of WO2021100538A1 publication Critical patent/WO2021100538A1/fr

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F283/00—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G
    • C08F283/04—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to polycarbonamides, polyesteramides or polyimides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/44—Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/46—Polymerisation initiated by wave energy or particle radiation
    • C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
    • C08F2/50—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light with sensitising agents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/40—Glass
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/037—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polyamides or polyimides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings

Abstract

L'invention concerne une composition de résine dotée d'une excellente aptitude au traitement de motifs et d'une excellente résistance à la pression, à partir de laquelle un film isolant hautement fiable peut être formé, et applicable à l'utilisation d'un substrat requérant un module d'élasticité élevé et une haute résolution. La composition de résine photosensible selon l'invention contient un polymère (A), une charge de verre (B), un composé photopolymérisable (C), un photo-initiateur (D) et un agent de réticulation thermique (E), la charge de verre (B) contenant au moins deux éléments sélectionnés dans le groupe constitué par l'oxyde de silicium, l'oxyde d'aluminium et l'oxyde de bore, et la charge de verre (B) contenant en outre un oxyde de terres rares.
PCT/JP2020/041824 2019-11-18 2020-11-10 Composition de résine photosensible, feuille de résine photosensible, structure creuse, matériau durci, procédé de production de structure creuse, composant électronique et filtre à ondes élastiques WO2021100538A1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CN202080076960.XA CN114730127B (zh) 2019-11-18 2020-11-10 感光性树脂组合物、感光性树脂片、中空结构体、固化物、中空结构体的制造方法、电子部件、及弹性波滤波器
KR1020227015121A KR102614299B1 (ko) 2019-11-18 2020-11-10 감광성 수지 조성물, 감광성 수지 시트, 중공 구조체, 경화물, 중공 구조체의 제조 방법, 전자 부품 및 탄성파 필터
JP2020567171A JP7111186B2 (ja) 2019-11-18 2020-11-10 感光性樹脂組成物、感光性樹脂シート、中空構造体、硬化物、中空構造体の製造方法、電子部品、及び弾性波フィルター

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019-207632 2019-11-18
JP2019207632 2019-11-18

Publications (1)

Publication Number Publication Date
WO2021100538A1 true WO2021100538A1 (fr) 2021-05-27

Family

ID=75981249

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2020/041824 WO2021100538A1 (fr) 2019-11-18 2020-11-10 Composition de résine photosensible, feuille de résine photosensible, structure creuse, matériau durci, procédé de production de structure creuse, composant électronique et filtre à ondes élastiques

Country Status (4)

Country Link
JP (1) JP7111186B2 (fr)
KR (1) KR102614299B1 (fr)
CN (1) CN114730127B (fr)
WO (1) WO2021100538A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023157918A1 (fr) * 2022-02-17 2023-08-24 東京応化工業株式会社 Procédé de production de structure creuse, stratifié

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117210141B (zh) * 2023-11-07 2024-01-26 明士(北京)新材料开发有限公司 一种耐显影的光敏胶膜及其制备与应用

Citations (2)

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JP2013088740A (ja) * 2011-10-21 2013-05-13 Panasonic Corp 感光性ペースト
JP2015118194A (ja) * 2013-12-18 2015-06-25 東レ株式会社 感光性樹脂組成物、それからなる感光性樹脂フィルム、それから形成された絶縁膜およびそれを有する多層配線基板

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JP4006907B2 (ja) * 1999-11-08 2007-11-14 Ｊｓｒ株式会社 感光性転写フィルム
JP4075277B2 (ja) * 2000-03-22 2008-04-16 Ｊｓｒ株式会社 無機粒子含有感光性組成物および感光性フィルム
JP4613401B2 (ja) * 2000-08-03 2011-01-19 パナソニック株式会社 感光性ペーストの製造方法
TW200531998A (en) * 2004-02-13 2005-10-01 Jsr Corp Inorganic powder-containing resin composition, transferring film, and process for producing elements used in display panels
JP2005227607A (ja) * 2004-02-13 2005-08-25 Jsr Corp 無機粉体含有樹脂組成物、転写フィルムおよびディスプレイパネル用部材の製造方法
CN1969232A (zh) * 2004-06-21 2007-05-23 捷时雅株式会社 含无机粉体的树脂组合物、转印膜以及等离子体显示板用构件的制造方法
JP4661388B2 (ja) * 2004-06-21 2011-03-30 Ｊｓｒ株式会社 無機粉体含有樹脂組成物、転写フィルムおよびプラズマディスプレイパネル用部材の製造方法
JP2006045324A (ja) * 2004-08-03 2006-02-16 Jsr Corp 無機粉体含有樹脂組成物、転写フィルムおよびプラズマディスプレイパネルの製造方法
KR101363126B1 (ko) * 2006-08-21 2014-02-13 제이에스알 가부시끼가이샤 감광성 수지 조성물, 감광성 필름 및 패턴 형성 방법
JP5050784B2 (ja) * 2006-12-14 2012-10-17 Ｊｓｒ株式会社 無機粒子含有感光性樹脂組成物、感光性フィルム、パターン形成方法、およびフラットパネルディスプレイの製造方法
JP5593662B2 (ja) * 2009-09-29 2014-09-24 東レ株式会社 感光性ペースト、絶縁性パターンの形成方法および平面ディスプレイ用パネルの製造方法
JP5660038B2 (ja) * 2010-08-27 2015-01-28 東レ株式会社 感光性ペースト、パターンの形成方法および平面ディスプレイパネル用部材の製造方法
JP6528190B2 (ja) * 2014-10-30 2019-06-12 旭ファイバーグラス株式会社 透明ａｂｓ樹脂組成物
WO2016181422A1 (fr) * 2015-05-11 2016-11-17 日立化成株式会社 Film de réglage d'indice de réfraction photosensible du type à transfert, procédé de formation de modèle d'indice de réfraction et composant électronique
WO2020196139A1 (fr) * 2019-03-27 2020-10-01 東レ株式会社 Composition de résine photosensible, feuille de résine photosensible, procédé de production de structure creuse et composant électronique

Patent Citations (2)

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Publication number Priority date Publication date Assignee Title
JP2013088740A (ja) * 2011-10-21 2013-05-13 Panasonic Corp 感光性ペースト
JP2015118194A (ja) * 2013-12-18 2015-06-25 東レ株式会社 感光性樹脂組成物、それからなる感光性樹脂フィルム、それから形成された絶縁膜およびそれを有する多層配線基板

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023157918A1 (fr) * 2022-02-17 2023-08-24 東京応化工業株式会社 Procédé de production de structure creuse, stratifié

Also Published As

Publication number Publication date
TW202120450A (zh) 2021-06-01
CN114730127B (zh) 2023-05-12
JPWO2021100538A1 (fr) 2021-05-27
JP7111186B2 (ja) 2022-08-02
KR102614299B1 (ko) 2023-12-19
CN114730127A (zh) 2022-07-08
KR20220104688A (ko) 2022-07-26

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