KR102613379B1 - 광검출기 센서 어레이들 - Google Patents
광검출기 센서 어레이들 Download PDFInfo
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- KR102613379B1 KR102613379B1 KR1020217037498A KR20217037498A KR102613379B1 KR 102613379 B1 KR102613379 B1 KR 102613379B1 KR 1020217037498 A KR1020217037498 A KR 1020217037498A KR 20217037498 A KR20217037498 A KR 20217037498A KR 102613379 B1 KR102613379 B1 KR 102613379B1
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- 238000003491 array Methods 0.000 title description 14
- 239000004065 semiconductor Substances 0.000 claims abstract description 71
- 239000000463 material Substances 0.000 claims abstract description 69
- 230000002441 reversible effect Effects 0.000 claims abstract description 40
- 238000010521 absorption reaction Methods 0.000 claims abstract description 27
- 230000031700 light absorption Effects 0.000 claims abstract description 26
- 239000000969 carrier Substances 0.000 claims abstract description 24
- 239000003989 dielectric material Substances 0.000 claims abstract description 20
- 230000004044 response Effects 0.000 claims abstract description 19
- 238000005253 cladding Methods 0.000 claims description 32
- 238000012545 processing Methods 0.000 claims description 15
- 239000002019 doping agent Substances 0.000 claims description 14
- 238000000034 method Methods 0.000 claims description 13
- 238000004519 manufacturing process Methods 0.000 claims description 9
- 238000005530 etching Methods 0.000 claims description 5
- 230000002093 peripheral effect Effects 0.000 claims description 3
- 238000000926 separation method Methods 0.000 claims description 3
- 238000005036 potential barrier Methods 0.000 abstract description 12
- 239000010410 layer Substances 0.000 description 203
- 238000013461 design Methods 0.000 description 18
- 238000010586 diagram Methods 0.000 description 12
- 235000012431 wafers Nutrition 0.000 description 12
- 230000006870 function Effects 0.000 description 10
- 230000003287 optical effect Effects 0.000 description 9
- 239000000758 substrate Substances 0.000 description 9
- 239000012212 insulator Substances 0.000 description 7
- 239000011295 pitch Substances 0.000 description 7
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 6
- 229910052710 silicon Inorganic materials 0.000 description 6
- 239000010703 silicon Substances 0.000 description 6
- 230000005684 electric field Effects 0.000 description 5
- 238000004088 simulation Methods 0.000 description 5
- 230000000875 corresponding effect Effects 0.000 description 4
- 238000001514 detection method Methods 0.000 description 4
- 238000012546 transfer Methods 0.000 description 4
- 230000005540 biological transmission Effects 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- 230000007547 defect Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 230000010354 integration Effects 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 239000002356 single layer Substances 0.000 description 3
- 238000003860 storage Methods 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- 238000009825 accumulation Methods 0.000 description 2
- 230000004888 barrier function Effects 0.000 description 2
- 238000011960 computer-aided design Methods 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 239000000835 fiber Substances 0.000 description 2
- 238000005286 illumination Methods 0.000 description 2
- 238000002955 isolation Methods 0.000 description 2
- 239000013307 optical fiber Substances 0.000 description 2
- 230000000737 periodic effect Effects 0.000 description 2
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 229910003811 SiGeC Inorganic materials 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 230000006399 behavior Effects 0.000 description 1
- 230000003542 behavioural effect Effects 0.000 description 1
- 210000000746 body region Anatomy 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000004590 computer program Methods 0.000 description 1
- 238000005094 computer simulation Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000002596 correlated effect Effects 0.000 description 1
- 230000001351 cycling effect Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000003111 delayed effect Effects 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000005137 deposition process Methods 0.000 description 1
- 239000012777 electrically insulating material Substances 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000005468 ion implantation Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000013386 optimize process Methods 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000009024 positive feedback mechanism Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000003252 repetitive effect Effects 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 230000011664 signaling Effects 0.000 description 1
- 229910021332 silicide Inorganic materials 0.000 description 1
- FVBUAEGBCNSCDD-UHFFFAOYSA-N silicide(4-) Chemical compound [Si-4] FVBUAEGBCNSCDD-UHFFFAOYSA-N 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 230000001052 transient effect Effects 0.000 description 1
Images
Classifications
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- H01L27/1463—
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/80—Constructional details of image sensors
- H10F39/807—Pixel isolation structures
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/10—Integrated devices
- H10F39/12—Image sensors
- H10F39/18—Complementary metal-oxide-semiconductor [CMOS] image sensors; Photodiode array image sensors
-
- H01L27/14616—
-
- H01L27/14623—
-
- H01L27/14647—
-
- H01L27/14683—
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/011—Manufacture or treatment of image sensors covered by group H10F39/12
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/011—Manufacture or treatment of image sensors covered by group H10F39/12
- H10F39/024—Manufacture or treatment of image sensors covered by group H10F39/12 of coatings or optical elements
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/011—Manufacture or treatment of image sensors covered by group H10F39/12
- H10F39/026—Wafer-level processing
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/10—Integrated devices
- H10F39/12—Image sensors
- H10F39/18—Complementary metal-oxide-semiconductor [CMOS] image sensors; Photodiode array image sensors
- H10F39/182—Colour image sensors
- H10F39/1825—Multicolour image sensors having stacked structure, e.g. NPN, NPNPN or multiple quantum well [MQW] structures
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/80—Constructional details of image sensors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/80—Constructional details of image sensors
- H10F39/803—Pixels having integrated switching, control, storage or amplification elements
- H10F39/8037—Pixels having integrated switching, control, storage or amplification elements the integrated elements comprising a transistor
- H10F39/80377—Pixels having integrated switching, control, storage or amplification elements the integrated elements comprising a transistor characterised by the channel of the transistor, e.g. channel having a doping gradient
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/80—Constructional details of image sensors
- H10F39/805—Coatings
- H10F39/8057—Optical shielding
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/80—Constructional details of image sensors
- H10F39/811—Interconnections
Landscapes
- Solid State Image Pick-Up Elements (AREA)
- Light Receiving Elements (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Applications Claiming Priority (7)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US16/387,011 US10964837B2 (en) | 2013-03-15 | 2019-04-17 | Photo detector systems and methods of operating same |
| US16/387,011 | 2019-04-17 | ||
| US16/429,158 | 2019-06-03 | ||
| US16/429,158 US11114480B2 (en) | 2013-03-15 | 2019-06-03 | Photodetector |
| US16/776,572 | 2020-01-30 | ||
| US16/776,572 US11251217B2 (en) | 2019-04-17 | 2020-01-30 | Photodetector sensor arrays |
| PCT/EP2020/060388 WO2020212305A1 (en) | 2019-04-17 | 2020-04-14 | Photodetector sensor arrays |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20220016822A KR20220016822A (ko) | 2022-02-10 |
| KR102613379B1 true KR102613379B1 (ko) | 2023-12-12 |
Family
ID=72837083
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020217037498A Active KR102613379B1 (ko) | 2019-04-17 | 2020-04-14 | 광검출기 센서 어레이들 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US11251217B2 (https=) |
| EP (1) | EP3956929A1 (https=) |
| JP (1) | JP7400164B2 (https=) |
| KR (1) | KR102613379B1 (https=) |
| CN (1) | CN113875008B (https=) |
| IL (1) | IL287245B2 (https=) |
| WO (1) | WO2020212305A1 (https=) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11837669B2 (en) | 2013-03-15 | 2023-12-05 | ActLight SA | Photo detector systems and methods of operating same |
| US11114480B2 (en) | 2013-03-15 | 2021-09-07 | ActLight SA | Photodetector |
| US11735677B2 (en) * | 2020-07-20 | 2023-08-22 | ActLight SA | Photodetectors and photodetector arrays |
| JP7588028B2 (ja) * | 2021-01-26 | 2024-11-21 | 日本ルメンタム株式会社 | 半導体受光素子 |
| KR102567702B1 (ko) * | 2021-06-30 | 2023-08-18 | 한국원자력연구원 | 방사선 검출소자 및 이의 제조방법 |
| US12474453B2 (en) | 2022-01-20 | 2025-11-18 | ActLight SA | Control techniques for photodetector systems |
| CN115207150B (zh) * | 2022-07-21 | 2023-10-10 | 北京工业大学 | 一种全通信波段覆盖的高速光电探测器 |
| US12598374B2 (en) | 2023-09-27 | 2026-04-07 | ActLight SA | Techniques for minimizing power consumption in photodetector measurements |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
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| US20100084729A1 (en) | 2008-08-29 | 2010-04-08 | Gary Steinbrueck | Integrated photodiode for semiconductor substrates |
| US20110133160A1 (en) | 2009-12-08 | 2011-06-09 | Zena Technologies, Inc. | Nanowire structured photodiode with a surrounding epitaxially grown p or n layer |
| US20110220969A1 (en) | 2010-03-12 | 2011-09-15 | Fujio Masuoka | Solid state imaging device |
| US20110272561A1 (en) | 2010-03-23 | 2011-11-10 | Stmicroelectronics S.R.L. | Method of detecting impinging position of photons on a geiger-mode avalanche photodiode, related geiger-mode avalanche photodiode and fabrication process |
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| JP4280822B2 (ja) | 2004-02-18 | 2009-06-17 | 国立大学法人静岡大学 | 光飛行時間型距離センサ |
| JP4345693B2 (ja) | 2004-03-17 | 2009-10-14 | パナソニック電工株式会社 | 光検出素子および光検出素子の制御方法 |
| JP2005347599A (ja) | 2004-06-04 | 2005-12-15 | Fuji Photo Film Co Ltd | カラー受光素子、及び撮像素子 |
| JP2006108379A (ja) * | 2004-10-05 | 2006-04-20 | Sony Corp | 固体撮像素子及びその駆動方法 |
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| KR100879013B1 (ko) | 2007-05-22 | 2009-01-19 | (주)실리콘화일 | 매립형 컬렉터를 구비하는 포토트랜지스터 |
| US8274096B2 (en) * | 2009-02-13 | 2012-09-25 | University Of Rochester | Semiconductor device and method |
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| IT1393781B1 (it) | 2009-04-23 | 2012-05-08 | St Microelectronics Rousset | Fotodiodo operante in modalita' geiger con resistore di soppressione integrato e controllabile ad effetto jfet, schiera di fotodiodi e relativo procedimento di fabbricazione |
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| US10269855B2 (en) | 2013-03-15 | 2019-04-23 | ActLight SA | Photo detector systems and methods of operating same |
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-
2020
- 2020-01-30 US US16/776,572 patent/US11251217B2/en active Active
- 2020-04-14 WO PCT/EP2020/060388 patent/WO2020212305A1/en not_active Ceased
- 2020-04-14 EP EP20719973.8A patent/EP3956929A1/en active Pending
- 2020-04-14 CN CN202080029263.9A patent/CN113875008B/zh active Active
- 2020-04-14 IL IL287245A patent/IL287245B2/en unknown
- 2020-04-14 JP JP2021560901A patent/JP7400164B2/ja active Active
- 2020-04-14 KR KR1020217037498A patent/KR102613379B1/ko active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20100084729A1 (en) | 2008-08-29 | 2010-04-08 | Gary Steinbrueck | Integrated photodiode for semiconductor substrates |
| US20110133160A1 (en) | 2009-12-08 | 2011-06-09 | Zena Technologies, Inc. | Nanowire structured photodiode with a surrounding epitaxially grown p or n layer |
| US20110220969A1 (en) | 2010-03-12 | 2011-09-15 | Fujio Masuoka | Solid state imaging device |
| US20110272561A1 (en) | 2010-03-23 | 2011-11-10 | Stmicroelectronics S.R.L. | Method of detecting impinging position of photons on a geiger-mode avalanche photodiode, related geiger-mode avalanche photodiode and fabrication process |
Also Published As
| Publication number | Publication date |
|---|---|
| IL287245A (en) | 2021-12-01 |
| US11251217B2 (en) | 2022-02-15 |
| IL287245B2 (en) | 2025-08-01 |
| IL287245B1 (en) | 2025-04-01 |
| EP3956929A1 (en) | 2022-02-23 |
| CN113875008A (zh) | 2021-12-31 |
| KR20220016822A (ko) | 2022-02-10 |
| US20200373346A1 (en) | 2020-11-26 |
| CN113875008B (zh) | 2025-08-05 |
| WO2020212305A1 (en) | 2020-10-22 |
| JP7400164B2 (ja) | 2023-12-19 |
| JP2022529637A (ja) | 2022-06-23 |
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