KR102612643B1 - 점착 시트 - Google Patents

점착 시트 Download PDF

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Publication number
KR102612643B1
KR102612643B1 KR1020187035736A KR20187035736A KR102612643B1 KR 102612643 B1 KR102612643 B1 KR 102612643B1 KR 1020187035736 A KR1020187035736 A KR 1020187035736A KR 20187035736 A KR20187035736 A KR 20187035736A KR 102612643 B1 KR102612643 B1 KR 102612643B1
Authority
KR
South Korea
Prior art keywords
adhesive
adhesive sheet
mass
layer
less
Prior art date
Application number
KR1020187035736A
Other languages
English (en)
Korean (ko)
Other versions
KR20180133949A (ko
Inventor
켄 다카노
가즈히로 기쿠치
다카시 스기노
Original Assignee
린텍 가부시키가이샤
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Application filed by 린텍 가부시키가이샤 filed Critical 린텍 가부시키가이샤
Publication of KR20180133949A publication Critical patent/KR20180133949A/ko
Application granted granted Critical
Publication of KR102612643B1 publication Critical patent/KR102612643B1/ko

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/29—Laminated material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/38—Layered products comprising a layer of synthetic resin comprising epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C09J133/062—Copolymers with monomers not covered by C09J133/06
    • C09J133/066—Copolymers with monomers not covered by C09J133/06 containing -OH groups
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C09J133/08—Homopolymers or copolymers of acrylic acid esters
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
    • C09J183/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C09J7/25—Plastics; Metallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/255—Polyesters
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/50—Adhesives in the form of films or foils characterised by a primer layer between the carrier and the adhesive
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
    • C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
    • C09J2301/122—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present only on one side of the carrier, e.g. single-sided adhesive tape
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2463/00—Presence of epoxy resin
    • C09J2463/003—Presence of epoxy resin in the primer coating
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2467/00—Presence of polyester
    • C09J2467/003—Presence of polyester in the primer coating
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2467/00—Presence of polyester
    • C09J2467/006—Presence of polyester in the substrate

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Laminated Bodies (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Die Bonding (AREA)
  • Sealing Material Composition (AREA)
KR1020187035736A 2015-09-01 2016-09-01 점착 시트 KR102612643B1 (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2015172397 2015-09-01
JPJP-P-2015-172397 2015-09-01
KR1020177034192A KR101930197B1 (ko) 2015-09-01 2016-09-01 점착 시트
PCT/JP2016/075604 WO2017038917A1 (ja) 2015-09-01 2016-09-01 粘着シート

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
KR1020177034192A Division KR101930197B1 (ko) 2015-09-01 2016-09-01 점착 시트

Publications (2)

Publication Number Publication Date
KR20180133949A KR20180133949A (ko) 2018-12-17
KR102612643B1 true KR102612643B1 (ko) 2023-12-11

Family

ID=58187756

Family Applications (2)

Application Number Title Priority Date Filing Date
KR1020187035736A KR102612643B1 (ko) 2015-09-01 2016-09-01 점착 시트
KR1020177034192A KR101930197B1 (ko) 2015-09-01 2016-09-01 점착 시트

Family Applications After (1)

Application Number Title Priority Date Filing Date
KR1020177034192A KR101930197B1 (ko) 2015-09-01 2016-09-01 점착 시트

Country Status (5)

Country Link
JP (2) JP6148805B1 (zh)
KR (2) KR102612643B1 (zh)
CN (2) CN110628349A (zh)
TW (2) TWI734893B (zh)
WO (1) WO2017038917A1 (zh)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6966888B2 (ja) * 2017-07-26 2021-11-17 リンテック株式会社 剥離フィルム
WO2019163568A1 (ja) * 2018-02-22 2019-08-29 リンテック株式会社 フィルム状焼成材料、及び支持シート付フィルム状焼成材料
JP7069297B2 (ja) * 2018-03-30 2022-05-17 三井化学東セロ株式会社 電子装置の製造方法
JP6740489B2 (ja) * 2018-06-13 2020-08-12 リンテック株式会社 粘着シート
JP7084671B2 (ja) * 2018-07-30 2022-06-15 フジコピアン株式会社 手裂き可能な吸着テープ
KR20210043557A (ko) 2018-08-10 2021-04-21 린텍 가부시키가이샤 점착 시트용 기재 및 전자 부품 가공용 점착 시트
EP3852134A4 (en) * 2018-09-11 2022-06-15 Mitsui Chemicals Tohcello, Inc. ADHESIVE FILM AND METHOD OF MAKING AN ELECTRONIC DEVICE
JP7223586B2 (ja) * 2019-01-31 2023-02-16 日東電工株式会社 透明導電性フィルム積層体
KR20210146893A (ko) * 2019-03-26 2021-12-06 린텍 가부시키가이샤 박리 시트
JP7285612B2 (ja) * 2019-06-12 2023-06-02 フジコピアン株式会社 耐熱保護用貼着フィルム
EP4082779A4 (en) * 2019-12-25 2024-01-03 Nitto Denko Corporation LAYER BODY

Citations (5)

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Publication number Priority date Publication date Assignee Title
JP2008045091A (ja) * 2006-08-21 2008-02-28 Nitto Denko Corp 加工用粘着シート
JP2011134811A (ja) 2009-12-22 2011-07-07 Nitto Denko Corp 基板レス半導体パッケージ製造用耐熱性粘着シート、及びその粘着シートを用いる基板レス半導体パッケージ製造方法
JP2012059934A (ja) 2010-09-09 2012-03-22 Nitto Denko Corp 樹脂封止用粘着テープ及び樹脂封止型半導体装置の製造方法
JP2013038098A (ja) 2011-08-03 2013-02-21 Nitto Denko Corp ダイシング・ダイボンドフィルム
WO2015029871A1 (ja) 2013-08-29 2015-03-05 三井化学東セロ株式会社 接着フィルムおよび半導体装置の製造方法

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JP4002736B2 (ja) 2001-03-21 2007-11-07 株式会社巴川製紙所 半導体装置組立用マスクシートおよび半導体装置の組み立て方法
JP4837490B2 (ja) * 2006-08-22 2011-12-14 日東電工株式会社 加工用粘着シート
KR101387706B1 (ko) * 2007-08-17 2014-04-23 삼성전자주식회사 반도체 칩 패키지, 그 제조 방법 및 이를 포함하는 전자소자
KR20090121254A (ko) * 2008-05-20 2009-11-25 주식회사 엘지화학 점착 필름, 다이싱 다이본딩 필름 및 반도체 웨이퍼
JP5632695B2 (ja) * 2009-11-26 2014-11-26 日東電工株式会社 ダイシングフィルム付き接着フィルム、及び、該ダイシングフィルム付き接着フィルムを用いた半導体装置の製造方法
WO2011125683A1 (ja) * 2010-03-31 2011-10-13 古河電気工業株式会社 半導体ウエハ加工用粘着シート
TW201305306A (zh) * 2011-07-25 2013-02-01 Nitto Denko Corp 接著片及其用途
JP5824402B2 (ja) * 2012-04-02 2015-11-25 株式会社巴川製紙所 半導体装置製造用マスクシート及びそれを用いた半導体装置の製造方法
JP5877122B2 (ja) * 2012-05-21 2016-03-02 藤森工業株式会社 表面処理フィルム、表面保護フィルム及びそれが貼り合わされた精密電気・電子部品
JP6042251B2 (ja) * 2013-03-28 2016-12-14 リンテック株式会社 粘着シート
JP6147103B2 (ja) * 2013-06-07 2017-06-14 日東電工株式会社 アンダーフィル材、積層シート及び半導体装置の製造方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008045091A (ja) * 2006-08-21 2008-02-28 Nitto Denko Corp 加工用粘着シート
JP2011134811A (ja) 2009-12-22 2011-07-07 Nitto Denko Corp 基板レス半導体パッケージ製造用耐熱性粘着シート、及びその粘着シートを用いる基板レス半導体パッケージ製造方法
JP2012059934A (ja) 2010-09-09 2012-03-22 Nitto Denko Corp 樹脂封止用粘着テープ及び樹脂封止型半導体装置の製造方法
JP2013038098A (ja) 2011-08-03 2013-02-21 Nitto Denko Corp ダイシング・ダイボンドフィルム
WO2015029871A1 (ja) 2013-08-29 2015-03-05 三井化学東セロ株式会社 接着フィルムおよび半導体装置の製造方法

Also Published As

Publication number Publication date
KR20180133949A (ko) 2018-12-17
JP6148805B1 (ja) 2017-06-14
TW201821570A (zh) 2018-06-16
WO2017038917A1 (ja) 2017-03-09
JP2017197749A (ja) 2017-11-02
TWI621684B (zh) 2018-04-21
CN110628349A (zh) 2019-12-31
CN107636100A (zh) 2018-01-26
CN107636100B (zh) 2019-11-22
TW201723119A (zh) 2017-07-01
JP6853731B2 (ja) 2021-03-31
KR20170136644A (ko) 2017-12-11
JPWO2017038917A1 (ja) 2017-09-21
KR101930197B1 (ko) 2018-12-17
TWI734893B (zh) 2021-08-01

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