KR102611272B1 - 정전기 방전 보호 기능이 있는 포토마스크 - Google Patents
정전기 방전 보호 기능이 있는 포토마스크 Download PDFInfo
- Publication number
- KR102611272B1 KR102611272B1 KR1020217013246A KR20217013246A KR102611272B1 KR 102611272 B1 KR102611272 B1 KR 102611272B1 KR 1020217013246 A KR1020217013246 A KR 1020217013246A KR 20217013246 A KR20217013246 A KR 20217013246A KR 102611272 B1 KR102611272 B1 KR 102611272B1
- Authority
- KR
- South Korea
- Prior art keywords
- esd
- edge
- comb
- photomask
- line
- Prior art date
Links
- 239000000758 substrate Substances 0.000 claims abstract description 50
- WYTGDNHDOZPMIW-RCBQFDQVSA-N alstonine Natural products C1=CC2=C3C=CC=CC3=NC2=C2N1C[C@H]1[C@H](C)OC=C(C(=O)OC)[C@H]1C2 WYTGDNHDOZPMIW-RCBQFDQVSA-N 0.000 claims description 22
- 239000004020 conductor Substances 0.000 description 11
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 8
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 8
- 229910052804 chromium Inorganic materials 0.000 description 8
- 239000011651 chromium Substances 0.000 description 8
- 239000000463 material Substances 0.000 description 8
- 230000000694 effects Effects 0.000 description 7
- 238000000034 method Methods 0.000 description 7
- 238000010586 diagram Methods 0.000 description 6
- 229920002120 photoresistant polymer Polymers 0.000 description 5
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 150000001845 chromium compounds Chemical class 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 229910052750 molybdenum Inorganic materials 0.000 description 4
- 239000011733 molybdenum Substances 0.000 description 4
- 229910052759 nickel Inorganic materials 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 4
- 229910052721 tungsten Inorganic materials 0.000 description 4
- 239000010937 tungsten Substances 0.000 description 4
- 238000007599 discharging Methods 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000007689 inspection Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000000206 photolithography Methods 0.000 description 2
- 239000010453 quartz Substances 0.000 description 2
- 229910052594 sapphire Inorganic materials 0.000 description 2
- 239000010980 sapphire Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 230000006978 adaptation Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- -1 but not limited to Substances 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000010891 electric arc Methods 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 230000000116 mitigating effect Effects 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 238000011112 process operation Methods 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/38—Masks having auxiliary features, e.g. special coatings or marks for alignment or testing; Preparation thereof
- G03F1/40—Electrostatic discharge [ESD] related features, e.g. antistatic coatings or a conductive metal layer around the periphery of the mask substrate
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/36—Masks having proximity correction features; Preparation thereof, e.g. optical proximity correction [OPC] design processes
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Preparing Plates And Mask In Photomechanical Process (AREA)
- Semiconductor Integrated Circuits (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/CN2019/072122 WO2020147059A1 (fr) | 2019-01-17 | 2019-01-17 | Photomasque à protection contre les décharges électrostatiques |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20210062699A KR20210062699A (ko) | 2021-05-31 |
KR102611272B1 true KR102611272B1 (ko) | 2023-12-06 |
Family
ID=66938492
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020217013246A KR102611272B1 (ko) | 2019-01-17 | 2019-01-17 | 정전기 방전 보호 기능이 있는 포토마스크 |
Country Status (7)
Country | Link |
---|---|
US (1) | US11493842B2 (fr) |
EP (1) | EP3850431B1 (fr) |
JP (1) | JP7295237B2 (fr) |
KR (1) | KR102611272B1 (fr) |
CN (1) | CN109891317B (fr) |
TW (1) | TWI696883B (fr) |
WO (1) | WO2020147059A1 (fr) |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002055438A (ja) * | 2000-06-01 | 2002-02-20 | United Microelectron Corp | Esd保護機能を有するフォトマスク |
US20030213612A1 (en) | 2002-05-16 | 2003-11-20 | Taiwan Semiconductor Manufacturing Co., Ltd. | Guard ring having electrically isolated lightening bars |
US20070066006A1 (en) * | 2003-12-30 | 2007-03-22 | Semiconductor Manufacturing International (Shanghai) Corporation | Method and Structure for Electrostatic Discharge Protection of Photomasks |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63265246A (ja) * | 1987-04-22 | 1988-11-01 | Nec Corp | レチクル |
JPH05100410A (ja) * | 1991-10-07 | 1993-04-23 | Nec Corp | レチクル |
JP2000098592A (ja) | 1998-09-25 | 2000-04-07 | Seiko Epson Corp | マスク製造 |
EP1055153B1 (fr) * | 1998-12-14 | 2012-01-18 | Nxp B.V. | Photomasque dont le bord est dote d'une zone de protection annulaire contre les decharges electrostatiques |
KR20010088340A (ko) * | 2000-03-10 | 2001-09-26 | 포만 제프리 엘 | 정전기 방전으로부터 레티클을 격리시키는 방법 |
US6365303B1 (en) * | 2000-04-24 | 2002-04-02 | Taiwan Semiconductor Manufacturing Company | Electrostatic discharge damage prevention method on masks |
TW543178B (en) * | 2002-03-15 | 2003-07-21 | Taiwan Semiconductor Mfg | Mask to prevent electrostatic discharge |
CN1212542C (zh) * | 2002-05-15 | 2005-07-27 | 台湾积体电路制造股份有限公司 | 防止静电破坏的光罩 |
JP4673039B2 (ja) | 2004-11-05 | 2011-04-20 | 株式会社東芝 | マスクブランクス基板 |
US7387855B2 (en) | 2005-01-10 | 2008-06-17 | Taiwan Semiconductor Manufacturing Co., Ltd | Anti-ESD photomask blank |
JP2008241921A (ja) * | 2007-03-26 | 2008-10-09 | Toray Ind Inc | フォトマスク、およびフォトマスクの製造方法 |
CN104332466A (zh) * | 2014-04-25 | 2015-02-04 | 上海华虹宏力半导体制造有限公司 | 静电保护器件结构 |
KR101652803B1 (ko) * | 2014-08-27 | 2016-09-01 | (주)마이크로이미지 | 정전기 배출 구조를 가지는 크롬 마스크 |
CN205374980U (zh) * | 2016-02-03 | 2016-07-06 | 中芯国际集成电路制造(北京)有限公司 | 防静电破坏光罩 |
CN108107671B (zh) * | 2016-11-25 | 2022-03-15 | 中芯国际集成电路制造(上海)有限公司 | 一种防静电光罩 |
-
2019
- 2019-01-17 JP JP2021530777A patent/JP7295237B2/ja active Active
- 2019-01-17 WO PCT/CN2019/072122 patent/WO2020147059A1/fr active Application Filing
- 2019-01-17 KR KR1020217013246A patent/KR102611272B1/ko active IP Right Grant
- 2019-01-17 CN CN201980000184.2A patent/CN109891317B/zh active Active
- 2019-01-17 EP EP19909773.4A patent/EP3850431B1/fr active Active
- 2019-03-04 US US16/292,230 patent/US11493842B2/en active Active
- 2019-03-04 TW TW108106959A patent/TWI696883B/zh active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002055438A (ja) * | 2000-06-01 | 2002-02-20 | United Microelectron Corp | Esd保護機能を有するフォトマスク |
US20030213612A1 (en) | 2002-05-16 | 2003-11-20 | Taiwan Semiconductor Manufacturing Co., Ltd. | Guard ring having electrically isolated lightening bars |
US20070066006A1 (en) * | 2003-12-30 | 2007-03-22 | Semiconductor Manufacturing International (Shanghai) Corporation | Method and Structure for Electrostatic Discharge Protection of Photomasks |
Also Published As
Publication number | Publication date |
---|---|
US20200233298A1 (en) | 2020-07-23 |
JP2022509247A (ja) | 2022-01-20 |
WO2020147059A1 (fr) | 2020-07-23 |
US11493842B2 (en) | 2022-11-08 |
TW202028853A (zh) | 2020-08-01 |
EP3850431A4 (fr) | 2022-04-27 |
CN109891317A (zh) | 2019-06-14 |
CN109891317B (zh) | 2020-11-17 |
EP3850431A1 (fr) | 2021-07-21 |
JP7295237B2 (ja) | 2023-06-20 |
EP3850431B1 (fr) | 2023-06-14 |
TWI696883B (zh) | 2020-06-21 |
KR20210062699A (ko) | 2021-05-31 |
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