KR102606448B1 - 박판 형상 기판 유지 장치 및 유지 장치를 구비하는 반송 로봇 - Google Patents

박판 형상 기판 유지 장치 및 유지 장치를 구비하는 반송 로봇 Download PDF

Info

Publication number
KR102606448B1
KR102606448B1 KR1020207021160A KR20207021160A KR102606448B1 KR 102606448 B1 KR102606448 B1 KR 102606448B1 KR 1020207021160 A KR1020207021160 A KR 1020207021160A KR 20207021160 A KR20207021160 A KR 20207021160A KR 102606448 B1 KR102606448 B1 KR 102606448B1
Authority
KR
South Korea
Prior art keywords
shaped substrate
thin plate
plate
purge
holding member
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
KR1020207021160A
Other languages
English (en)
Korean (ko)
Other versions
KR20200116919A (ko
Inventor
카츠노리 사카타
야스히사 사토
Original Assignee
로제 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 로제 가부시키가이샤 filed Critical 로제 가부시키가이샤
Publication of KR20200116919A publication Critical patent/KR20200116919A/ko
Application granted granted Critical
Publication of KR102606448B1 publication Critical patent/KR102606448B1/ko
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7602—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a robot blade or gripped by a gripper for conveyance
    • H01L21/67766—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3402—Mechanical parts of transfer devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J15/00—Gripping heads and other end effectors
    • B25J15/08—Gripping heads and other end effectors having finger members
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
    • B65G47/74—Feeding, transfer, or discharging devices of particular kinds or types
    • B65G47/90—Devices for picking-up and depositing articles or materials
    • B65G47/91—Devices for picking-up and depositing articles or materials incorporating pneumatic, e.g. suction, grippers
    • H01L21/67196—
    • H01L21/67389—
    • H01L21/67772—
    • H01L21/67778—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0464—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the construction of the transfer chamber
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/19—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers
    • H10P72/1924—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by atmosphere control
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3408—Docking arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3411—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3411—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H10P72/3412—Batch transfer of wafers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/78—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using vacuum or suction, e.g. Bernoulli chucks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3404—Storage means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3406—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door or cover

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Manipulator (AREA)
  • Feeding Of Articles By Means Other Than Belts Or Rollers (AREA)
KR1020207021160A 2018-02-06 2019-01-17 박판 형상 기판 유지 장치 및 유지 장치를 구비하는 반송 로봇 Active KR102606448B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2018-018797 2018-02-06
JP2018018797A JP7037379B2 (ja) 2018-02-06 2018-02-06 薄板状基板保持装置、及び保持装置を備える搬送ロボット
PCT/JP2019/001256 WO2019155842A1 (ja) 2018-02-06 2019-01-17 薄板状基板保持装置、及び保持装置を備える搬送ロボット

Publications (2)

Publication Number Publication Date
KR20200116919A KR20200116919A (ko) 2020-10-13
KR102606448B1 true KR102606448B1 (ko) 2023-11-27

Family

ID=67549588

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020207021160A Active KR102606448B1 (ko) 2018-02-06 2019-01-17 박판 형상 기판 유지 장치 및 유지 장치를 구비하는 반송 로봇

Country Status (7)

Country Link
US (1) US11227784B2 (https=)
EP (1) EP3734651B1 (https=)
JP (1) JP7037379B2 (https=)
KR (1) KR102606448B1 (https=)
CN (1) CN111727500B (https=)
TW (1) TWI776016B (https=)
WO (1) WO2019155842A1 (https=)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110612601B (zh) * 2017-05-11 2023-08-22 日商乐华股份有限公司 薄板状衬底保持指状件以及具有该指状件的运送机器人
JP2021048242A (ja) * 2019-09-18 2021-03-25 東京エレクトロン株式会社 搬送装置及び搬送方法
JP7045353B2 (ja) * 2019-10-02 2022-03-31 株式会社アルバック 基板搬送装置、および、基板搬送方法
KR102645912B1 (ko) * 2020-01-15 2024-03-08 니혼도꾸슈도교 가부시키가이샤 유지 장치
JP7467152B2 (ja) * 2020-02-13 2024-04-15 東京エレクトロン株式会社 収容容器及び基板状センサの充電方法
CN115349168B (zh) 2020-03-30 2025-05-06 Tdk株式会社 冲压工具保持装置、冲压工具定位装置、多要素传送装置及元件阵列的制造方法
TWI760096B (zh) * 2021-02-05 2022-04-01 矽碁科技股份有限公司 微型化半導體製程系統
JP2023006718A (ja) * 2021-06-30 2023-01-18 株式会社荏原製作所 搬送装置、および基板処理装置
TWI899491B (zh) * 2021-08-04 2025-10-01 日商東京威力科創股份有限公司 收容容器及基板狀感測器之充電方法
CN116031184B (zh) * 2021-10-25 2026-02-10 大立钰科技有限公司 晶圆存取总成及其晶圆存取装置与晶圆载具
CN115915666A (zh) * 2022-11-20 2023-04-04 江苏亨通线缆科技有限公司 一种数据中心用智能机柜
CN117080135A (zh) * 2023-08-24 2023-11-17 上海广川科技有限公司 一种可净化保护的末端执行器
KR102707098B1 (ko) * 2023-10-24 2024-09-19 야스카와 일렉트릭 코퍼레이션 엔드 이펙터의 웨이퍼 고정용 능동-수동형 그립모듈 및 이를 구비하는 반송로봇
CN120466326B (zh) * 2025-07-07 2026-02-03 江西卓达轴承有限公司 一种轴承保持架安装装置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009170740A (ja) * 2008-01-18 2009-07-30 Rorze Corp 搬送装置
JP2013006222A (ja) 2009-10-14 2013-01-10 Rorze Corp 薄板状物の把持装置、および薄板状物の把持方法
JP2013247283A (ja) * 2012-05-28 2013-12-09 Tokyo Electron Ltd 搬送機構、搬送方法及び処理システム

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA2043266A1 (en) * 1990-09-24 1992-03-25 Gary Hillman Wafer transfer device
JP2000040730A (ja) 1998-07-24 2000-02-08 Dainippon Screen Mfg Co Ltd 基板搬送装置および基板処理装置
JP4086398B2 (ja) * 1999-01-28 2008-05-14 大日本スクリーン製造株式会社 基板洗浄装置
US6354832B1 (en) * 1999-07-28 2002-03-12 Tokyo Electron Limited Substrate processing apparatus and substrate processing method
JP4558981B2 (ja) * 2000-11-14 2010-10-06 株式会社ダイヘン トランスファロボット
JP2003092335A (ja) * 2001-09-18 2003-03-28 Toshiba Corp 基板搬送装置、これを用いた基板処理装置および基板処理方法
CN101097849B (zh) * 2004-07-09 2010-08-25 积水化学工业株式会社 用于处理基板的外周部的方法及设备
JP2007048814A (ja) * 2005-08-08 2007-02-22 Mitsubishi Electric Corp 基板保持装置、半導体製造装置及び半導体装置の製造方法
JP4959457B2 (ja) * 2007-07-26 2012-06-20 東京エレクトロン株式会社 基板搬送モジュール及び基板処理システム
US9254566B2 (en) * 2009-03-13 2016-02-09 Kawasaki Jukogyo Kabushiki Kaisha Robot having end effector and method of operating the same
KR101668823B1 (ko) 2009-05-27 2016-10-24 로제 가부시키가이샤 분위기 치환 장치
JP2011018661A (ja) 2009-07-07 2011-01-27 Panasonic Corp キャリア搬送装置
JP6263972B2 (ja) 2013-11-11 2018-01-24 シンフォニアテクノロジー株式会社 基板搬送装置、ｅｆｅｍ及び半導体製造装置
TWI784799B (zh) * 2013-12-13 2022-11-21 日商昕芙旎雅股份有限公司 設備前端模組（ｅｆｅｍ）系統
JP6349750B2 (ja) 2014-01-31 2018-07-04 シンフォニアテクノロジー株式会社 Ｅｆｅｍ
US9343343B2 (en) * 2014-05-19 2016-05-17 Asm Ip Holding B.V. Method for reducing particle generation at bevel portion of substrate
KR102400424B1 (ko) * 2014-09-05 2022-05-19 로제 가부시키가이샤 로드 포트 및 로드 포트의 분위기 치환 방법
US10515834B2 (en) * 2015-10-12 2019-12-24 Lam Research Corporation Multi-station tool with wafer transfer microclimate systems

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009170740A (ja) * 2008-01-18 2009-07-30 Rorze Corp 搬送装置
JP2013006222A (ja) 2009-10-14 2013-01-10 Rorze Corp 薄板状物の把持装置、および薄板状物の把持方法
JP2013247283A (ja) * 2012-05-28 2013-12-09 Tokyo Electron Ltd 搬送機構、搬送方法及び処理システム

Also Published As

Publication number Publication date
EP3734651B1 (en) 2026-02-25
JP2019140130A (ja) 2019-08-22
CN111727500A (zh) 2020-09-29
EP3734651C0 (en) 2026-02-25
US20210050242A1 (en) 2021-02-18
CN111727500B (zh) 2025-01-28
EP3734651A4 (en) 2021-08-25
TW201937645A (zh) 2019-09-16
JP7037379B2 (ja) 2022-03-16
KR20200116919A (ko) 2020-10-13
WO2019155842A1 (ja) 2019-08-15
US11227784B2 (en) 2022-01-18
TWI776016B (zh) 2022-09-01
EP3734651A1 (en) 2020-11-04

Similar Documents

Publication Publication Date Title
KR102606448B1 (ko) 박판 형상 기판 유지 장치 및 유지 장치를 구비하는 반송 로봇
TWI765025B (zh) 薄板狀基板保持用指板及具備此指板的搬送機器人
KR102626528B1 (ko) 국소 퍼지 기능을 갖는 반송 장치
KR102400424B1 (ko) 로드 포트 및 로드 포트의 분위기 치환 방법
WO2013157462A1 (ja) 収納容器、収納容器のシャッター開閉ユニット、及びこれらを用いたウエハストッカー
CN110277339A (zh) Efem以及efem的气体置换方法
TWI750501B (zh) 基板處理裝置以及基板處理方法
JPH11251421A (ja) 基板収納容器の蓋開閉装置および基板搬入搬出装置

Legal Events

Date Code Title Description
PA0105 International application

St.27 status event code: A-0-1-A10-A15-nap-PA0105

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

A201 Request for examination
P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

E13-X000 Pre-grant limitation requested

St.27 status event code: A-2-3-E10-E13-lim-X000

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701

GRNT Written decision to grant
PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U12-oth-PR1002

Fee payment year number: 1

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000