CN111727500B - 薄板状衬底保持装置以及具有保持装置的运送机器人 - Google Patents

薄板状衬底保持装置以及具有保持装置的运送机器人 Download PDF

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Publication number
CN111727500B
CN111727500B CN201980011784.9A CN201980011784A CN111727500B CN 111727500 B CN111727500 B CN 111727500B CN 201980011784 A CN201980011784 A CN 201980011784A CN 111727500 B CN111727500 B CN 111727500B
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plate
thin plate
mentioned
substrate
holding device
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CN201980011784.9A
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Chinese (zh)
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CN111727500A (zh
Inventor
坂田胜则
佐藤恭久
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Rorze Corp
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Rorze Corp
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3402—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7602—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a robot blade or gripped by a gripper for conveyance
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J15/00—Gripping heads and other end effectors
    • B25J15/08—Gripping heads and other end effectors having finger members
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
    • B65G47/74—Feeding, transfer, or discharging devices of particular kinds or types
    • B65G47/90—Devices for picking-up and depositing articles or materials
    • B65G47/91—Devices for picking-up and depositing articles or materials incorporating pneumatic, e.g. suction, grippers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0464—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the construction of the transfer chamber
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/19—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers
    • H10P72/1924—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by atmosphere control
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3408—Docking arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3411—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3411—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H10P72/3412—Batch transfer of wafers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/78—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using vacuum or suction, e.g. Bernoulli chucks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3404—Storage means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3406—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door or cover

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Manipulator (AREA)
  • Feeding Of Articles By Means Other Than Belts Or Rollers (AREA)
CN201980011784.9A 2018-02-06 2019-01-17 薄板状衬底保持装置以及具有保持装置的运送机器人 Active CN111727500B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2018-018797 2018-02-06
JP2018018797A JP7037379B2 (ja) 2018-02-06 2018-02-06 薄板状基板保持装置、及び保持装置を備える搬送ロボット
PCT/JP2019/001256 WO2019155842A1 (ja) 2018-02-06 2019-01-17 薄板状基板保持装置、及び保持装置を備える搬送ロボット

Publications (2)

Publication Number Publication Date
CN111727500A CN111727500A (zh) 2020-09-29
CN111727500B true CN111727500B (zh) 2025-01-28

Family

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CN201980011784.9A Active CN111727500B (zh) 2018-02-06 2019-01-17 薄板状衬底保持装置以及具有保持装置的运送机器人

Country Status (7)

Country Link
US (1) US11227784B2 (https=)
EP (1) EP3734651B1 (https=)
JP (1) JP7037379B2 (https=)
KR (1) KR102606448B1 (https=)
CN (1) CN111727500B (https=)
TW (1) TWI776016B (https=)
WO (1) WO2019155842A1 (https=)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110612601B (zh) * 2017-05-11 2023-08-22 日商乐华股份有限公司 薄板状衬底保持指状件以及具有该指状件的运送机器人
JP2021048242A (ja) * 2019-09-18 2021-03-25 東京エレクトロン株式会社 搬送装置及び搬送方法
JP7045353B2 (ja) * 2019-10-02 2022-03-31 株式会社アルバック 基板搬送装置、および、基板搬送方法
KR102645912B1 (ko) * 2020-01-15 2024-03-08 니혼도꾸슈도교 가부시키가이샤 유지 장치
JP7467152B2 (ja) * 2020-02-13 2024-04-15 東京エレクトロン株式会社 収容容器及び基板状センサの充電方法
CN115349168B (zh) 2020-03-30 2025-05-06 Tdk株式会社 冲压工具保持装置、冲压工具定位装置、多要素传送装置及元件阵列的制造方法
TWI760096B (zh) * 2021-02-05 2022-04-01 矽碁科技股份有限公司 微型化半導體製程系統
JP2023006718A (ja) * 2021-06-30 2023-01-18 株式会社荏原製作所 搬送装置、および基板処理装置
TWI899491B (zh) * 2021-08-04 2025-10-01 日商東京威力科創股份有限公司 收容容器及基板狀感測器之充電方法
CN116031184B (zh) * 2021-10-25 2026-02-10 大立钰科技有限公司 晶圆存取总成及其晶圆存取装置与晶圆载具
CN115915666A (zh) * 2022-11-20 2023-04-04 江苏亨通线缆科技有限公司 一种数据中心用智能机柜
CN117080135A (zh) * 2023-08-24 2023-11-17 上海广川科技有限公司 一种可净化保护的末端执行器
KR102707098B1 (ko) * 2023-10-24 2024-09-19 야스카와 일렉트릭 코퍼레이션 엔드 이펙터의 웨이퍼 고정용 능동-수동형 그립모듈 및 이를 구비하는 반송로봇
CN120466326B (zh) * 2025-07-07 2026-02-03 江西卓达轴承有限公司 一种轴承保持架安装装置

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CN101097849A (zh) * 2004-07-09 2008-01-02 积水化学工业株式会社 用于处理基板的外周部的方法及设备

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JP2000223460A (ja) * 1999-01-28 2000-08-11 Dainippon Screen Mfg Co Ltd 基板洗浄装置
CN101097849A (zh) * 2004-07-09 2008-01-02 积水化学工业株式会社 用于处理基板的外周部的方法及设备

Also Published As

Publication number Publication date
EP3734651B1 (en) 2026-02-25
JP2019140130A (ja) 2019-08-22
CN111727500A (zh) 2020-09-29
EP3734651C0 (en) 2026-02-25
US20210050242A1 (en) 2021-02-18
KR102606448B1 (ko) 2023-11-27
EP3734651A4 (en) 2021-08-25
TW201937645A (zh) 2019-09-16
JP7037379B2 (ja) 2022-03-16
KR20200116919A (ko) 2020-10-13
WO2019155842A1 (ja) 2019-08-15
US11227784B2 (en) 2022-01-18
TWI776016B (zh) 2022-09-01
EP3734651A1 (en) 2020-11-04

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