KR102587363B1 - 도전성 기판 및 도전성 기판 제조방법 - Google Patents

도전성 기판 및 도전성 기판 제조방법 Download PDF

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KR102587363B1
KR102587363B1 KR1020187001675A KR20187001675A KR102587363B1 KR 102587363 B1 KR102587363 B1 KR 102587363B1 KR 1020187001675 A KR1020187001675 A KR 1020187001675A KR 20187001675 A KR20187001675 A KR 20187001675A KR 102587363 B1 KR102587363 B1 KR 102587363B1
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South Korea
Prior art keywords
layer
organic material
nitrogen
conductive substrate
blackening
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KR1020187001675A
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English (en)
Korean (ko)
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KR20180034401A (ko
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다카히로 스다
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스미토모 긴조쿠 고잔 가부시키가이샤
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Publication of KR20180034401A publication Critical patent/KR20180034401A/ko
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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G06F3/0445—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using two or more layers of sensing electrodes, e.g. using two layers of electrodes separated by a dielectric layer
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/14—Metallic material, boron or silicon
    • C23C14/20—Metallic material, boron or silicon on organic substrates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D7/00—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
    • B05D7/14—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials to metal, e.g. car bodies
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D7/00—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
    • B05D7/24—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials for applying particular liquids or other fluent materials
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/58—After-treatment
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G06F3/0446—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using a grid-like structure of electrodes in at least two directions, e.g. using row and column electrodes
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Human Computer Interaction (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Metallurgy (AREA)
  • Mechanical Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Wood Science & Technology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Laminated Bodies (AREA)
KR1020187001675A 2015-07-31 2016-07-25 도전성 기판 및 도전성 기판 제조방법 KR102587363B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2015-152895 2015-07-31
JP2015152895 2015-07-31
PCT/JP2016/071703 WO2017022543A1 (ja) 2015-07-31 2016-07-25 導電性基板、導電性基板の製造方法

Publications (2)

Publication Number Publication Date
KR20180034401A KR20180034401A (ko) 2018-04-04
KR102587363B1 true KR102587363B1 (ko) 2023-10-10

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ID=57944084

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Application Number Title Priority Date Filing Date
KR1020187001675A KR102587363B1 (ko) 2015-07-31 2016-07-25 도전성 기판 및 도전성 기판 제조방법

Country Status (5)

Country Link
JP (1) JP6428942B2 (ja)
KR (1) KR102587363B1 (ja)
CN (1) CN107850965B (ja)
TW (1) TWI702522B (ja)
WO (1) WO2017022543A1 (ja)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013237881A (ja) 2012-05-11 2013-11-28 Ishihara Chem Co Ltd 無電解銅メッキ方法
US20140248771A1 (en) 2008-11-19 2014-09-04 Micron Technology, Inc. Methods for forming a conductive material and methods for forming a conductive structure

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JP2004213114A (ja) 2002-12-27 2004-07-29 Pentel Corp 静電容量型デジタル式タッチパネル
JP5111362B2 (ja) * 2006-03-15 2013-01-09 日本パーカライジング株式会社 銅材料用表面処理液、銅材料の表面処理方法、表面処理皮膜付き銅材料、および積層部材
TWI425530B (zh) * 2010-09-30 2014-02-01 Far Eastern New Century Corp 具有高光穿透度之透明導電膜及其製備方法
JP5473990B2 (ja) * 2011-06-17 2014-04-16 日東電工株式会社 導電性積層体、パターン配線付き透明導電性積層体、および光学デバイス。
JP6099875B2 (ja) * 2011-11-22 2017-03-22 東レ株式会社 積層体の製造方法
JP5775494B2 (ja) * 2012-02-28 2015-09-09 富士フイルム株式会社 銀イオン拡散抑制層形成用組成物、銀イオン拡散抑制層用フィルム、配線基板、電子機器、導電膜積層体、およびタッチパネル
JP2013206315A (ja) 2012-03-29 2013-10-07 Toppan Printing Co Ltd フィルム状タッチパネルセンサー及びその製造方法
CN102621736A (zh) * 2012-04-09 2012-08-01 友达光电股份有限公司 一种对触控面板中的黑矩阵进行图案化的方法
KR101521681B1 (ko) * 2012-04-24 2015-05-19 삼성전기주식회사 터치패널
JP2013235315A (ja) * 2012-05-07 2013-11-21 Dainippon Printing Co Ltd タッチパネルセンサ
JP5849059B2 (ja) * 2012-07-06 2016-01-27 富士フイルム株式会社 タッチパネル用導電性フィルムおよびタッチパネル
JP5224203B1 (ja) * 2012-07-11 2013-07-03 大日本印刷株式会社 タッチパネルセンサ、タッチパネル装置および表示装置
WO2014035197A1 (ko) * 2012-08-31 2014-03-06 주식회사 엘지화학 전도성 구조체 및 이의 제조방법
US9766652B2 (en) * 2012-08-31 2017-09-19 Lg Chem, Ltd. Conductive structure and method for manufacturing same
JP2014219963A (ja) * 2013-04-12 2014-11-20 信越ポリマー株式会社 センサーシート作製用シート及びその製造方法、タッチパッド用センサーシート及びその製造方法
JP6129769B2 (ja) * 2013-05-24 2017-05-17 富士フイルム株式会社 タッチパネル用透明導電膜、透明導電膜の製造方法、タッチパネル及び表示装置
JP6369750B2 (ja) * 2013-09-10 2018-08-08 日立金属株式会社 積層配線膜およびその製造方法ならびにＮｉ合金スパッタリングターゲット材
KR102170097B1 (ko) * 2013-10-31 2020-10-26 스미토모 긴조쿠 고잔 가부시키가이샤 도전성 기판 및 도전성 기판 제조방법
TWM490025U (en) * 2014-06-20 2014-11-11 Koatech Tech Corporation Display

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20140248771A1 (en) 2008-11-19 2014-09-04 Micron Technology, Inc. Methods for forming a conductive material and methods for forming a conductive structure
JP2013237881A (ja) 2012-05-11 2013-11-28 Ishihara Chem Co Ltd 無電解銅メッキ方法

Also Published As

Publication number Publication date
JP6428942B2 (ja) 2018-11-28
CN107850965B (zh) 2021-01-29
WO2017022543A1 (ja) 2017-02-09
KR20180034401A (ko) 2018-04-04
JPWO2017022543A1 (ja) 2018-05-31
TW201719361A (zh) 2017-06-01
CN107850965A (zh) 2018-03-27
TWI702522B (zh) 2020-08-21

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