KR102585601B1 - 기판 처리 방법 및 기판 처리 장치 - Google Patents

기판 처리 방법 및 기판 처리 장치 Download PDF

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Publication number
KR102585601B1
KR102585601B1 KR1020210084674A KR20210084674A KR102585601B1 KR 102585601 B1 KR102585601 B1 KR 102585601B1 KR 1020210084674 A KR1020210084674 A KR 1020210084674A KR 20210084674 A KR20210084674 A KR 20210084674A KR 102585601 B1 KR102585601 B1 KR 102585601B1
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KR
South Korea
Prior art keywords
substrate
gas
sublimation process
flow rate
periphery
Prior art date
Application number
KR1020210084674A
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English (en)
Korean (ko)
Other versions
KR20220023287A (ko
Inventor
마사유키 오쓰지
마사히코 가토
유 야마구치
Original Assignee
가부시키가이샤 스크린 홀딩스
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Application filed by 가부시키가이샤 스크린 홀딩스 filed Critical 가부시키가이샤 스크린 홀딩스
Publication of KR20220023287A publication Critical patent/KR20220023287A/ko
Application granted granted Critical
Publication of KR102585601B1 publication Critical patent/KR102585601B1/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02057—Cleaning during device manufacture
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F26—DRYING
    • F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
    • F26B21/00—Arrangements or duct systems, e.g. in combination with pallet boxes, for supplying and controlling air or gases for drying solid materials or objects
    • F26B21/06—Controlling, e.g. regulating, parameters of gas supply
    • F26B21/12—Velocity of flow; Quantity of flow, e.g. by varying fan speed, by modifying cross flow area
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F26—DRYING
    • F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
    • F26B5/00—Drying solid materials or objects by processes not involving the application of heat
    • F26B5/04—Drying solid materials or objects by processes not involving the application of heat by evaporation or sublimation of moisture under reduced pressure, e.g. in a vacuum
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67253—Process monitoring, e.g. flow or thickness monitoring

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • General Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Molecular Biology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Drying Of Solid Materials (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
KR1020210084674A 2020-08-20 2021-06-29 기판 처리 방법 및 기판 처리 장치 KR102585601B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2020-139221 2020-08-20
JP2020139221A JP7446181B2 (ja) 2020-08-20 2020-08-20 基板処理方法および基板処理装置

Publications (2)

Publication Number Publication Date
KR20220023287A KR20220023287A (ko) 2022-03-02
KR102585601B1 true KR102585601B1 (ko) 2023-10-10

Family

ID=80283006

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020210084674A KR102585601B1 (ko) 2020-08-20 2021-06-29 기판 처리 방법 및 기판 처리 장치

Country Status (4)

Country Link
JP (1) JP7446181B2 (zh)
KR (1) KR102585601B1 (zh)
CN (1) CN114076504B (zh)
TW (1) TWI781609B (zh)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013102238A (ja) 2013-02-28 2013-05-23 Dainippon Screen Mfg Co Ltd 基板処理装置および基板処理方法
JP2020047887A (ja) 2018-09-21 2020-03-26 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000021869A (ja) * 1998-06-30 2000-01-21 Tokyo Electron Ltd 真空処理装置
JP3905784B2 (ja) * 2002-03-26 2007-04-18 大日本スクリーン製造株式会社 基板処理装置
JP4853536B2 (ja) * 2009-03-13 2012-01-11 東京エレクトロン株式会社 塗布、現像装置、塗布、現像方法及び記憶媒体
JP5681560B2 (ja) 2011-05-17 2015-03-11 東京エレクトロン株式会社 基板乾燥方法及び基板処理装置
JP2015185713A (ja) 2014-03-25 2015-10-22 株式会社東芝 基板処理装置及び基板処理方法
KR20160065226A (ko) 2014-11-07 2016-06-09 세메스 주식회사 기판 처리 장치 및 기판 처리 방법
JP6709555B2 (ja) * 2015-03-05 2020-06-17 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置
JP2019054112A (ja) * 2017-09-15 2019-04-04 株式会社Ｓｃｒｅｅｎホールディングス 基板乾燥方法および基板乾燥装置
JP7107754B2 (ja) * 2017-09-22 2022-07-27 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置
JP7286359B2 (ja) 2018-06-22 2023-06-05 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法、基板処理装置、および乾燥前処理液
JP7122911B2 (ja) 2018-08-31 2022-08-22 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置
JP7100564B2 (ja) 2018-11-09 2022-07-13 株式会社Ｓｃｒｅｅｎホールディングス 基板乾燥方法および基板処理装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013102238A (ja) 2013-02-28 2013-05-23 Dainippon Screen Mfg Co Ltd 基板処理装置および基板処理方法
JP2020047887A (ja) 2018-09-21 2020-03-26 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置

Also Published As

Publication number Publication date
TWI781609B (zh) 2022-10-21
CN114076504B (zh) 2022-11-22
JP2022035121A (ja) 2022-03-04
CN114076504A (zh) 2022-02-22
JP7446181B2 (ja) 2024-03-08
TW202209419A (zh) 2022-03-01
KR20220023287A (ko) 2022-03-02

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