KR102545501B1 - 고주파 특성 검사 장치 및 고주파 특성 검사 방법 - Google Patents

고주파 특성 검사 장치 및 고주파 특성 검사 방법 Download PDF

Info

Publication number
KR102545501B1
KR102545501B1 KR1020200101545A KR20200101545A KR102545501B1 KR 102545501 B1 KR102545501 B1 KR 102545501B1 KR 1020200101545 A KR1020200101545 A KR 1020200101545A KR 20200101545 A KR20200101545 A KR 20200101545A KR 102545501 B1 KR102545501 B1 KR 102545501B1
Authority
KR
South Korea
Prior art keywords
substrate
inspection
main surface
inspection jig
frequency characteristic
Prior art date
Application number
KR1020200101545A
Other languages
English (en)
Korean (ko)
Other versions
KR20210027096A (ko
Inventor
히로미치 마츠이
마사루 스즈카와
마코토 데라오카
히로타카 다케야마
Original Assignee
야마하 파인 테크 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 야마하 파인 테크 가부시키가이샤 filed Critical 야마하 파인 테크 가부시키가이샤
Publication of KR20210027096A publication Critical patent/KR20210027096A/ko
Application granted granted Critical
Publication of KR102545501B1 publication Critical patent/KR102545501B1/ko

Links

Images

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2832—Specific tests of electronic circuits not provided for elsewhere
    • G01R31/2834—Automated test systems [ATE]; using microprocessors or computers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/14—Measuring as part of the manufacturing process for electrical parameters, e.g. resistance, deep-levels, CV, diffusions by electrical means

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • General Health & Medical Sciences (AREA)
  • Biochemistry (AREA)
  • Analytical Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Testing Electric Properties And Detecting Electric Faults (AREA)
  • Measurement Of Resistance Or Impedance (AREA)
  • Inorganic Insulating Materials (AREA)
KR1020200101545A 2019-08-30 2020-08-13 고주파 특성 검사 장치 및 고주파 특성 검사 방법 KR102545501B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019158277A JP7303543B2 (ja) 2019-08-30 2019-08-30 高周波特性検査装置、及び高周波特性検査方法
JPJP-P-2019-158277 2019-08-30

Publications (2)

Publication Number Publication Date
KR20210027096A KR20210027096A (ko) 2021-03-10
KR102545501B1 true KR102545501B1 (ko) 2023-06-21

Family

ID=74733252

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020200101545A KR102545501B1 (ko) 2019-08-30 2020-08-13 고주파 특성 검사 장치 및 고주파 특성 검사 방법

Country Status (4)

Country Link
JP (1) JP7303543B2 (ja)
KR (1) KR102545501B1 (ja)
CN (1) CN112444728B (ja)
TW (1) TWI786426B (ja)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018037538A (ja) * 2016-08-31 2018-03-08 株式会社東京精密 プローバ
US20180164344A1 (en) 2016-12-12 2018-06-14 Mitsubishi Electric Corporation Semiconductor inspection jig

Family Cites Families (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61164168A (ja) * 1985-01-16 1986-07-24 Toshiba Corp プリント回路基板検査装置
JPS63184400A (ja) * 1987-01-27 1988-07-29 ティーディーケイ株式会社 電子部品リ−ド端子及び基板の曲がり、ずれ検出方法及び装置
JPH0262974A (ja) * 1988-08-30 1990-03-02 Fanuc Ltd 印刷配線基板の両面同時検査装置
JPH0427874A (ja) * 1990-05-22 1992-01-30 Mitsubishi Electric Corp 高周波素子測定用プローブヘッド
JP2533805Y2 (ja) * 1990-06-20 1997-04-23 富山日本電気株式会社 プリント基板自動電気検査装置
US5432461A (en) * 1991-06-28 1995-07-11 Photon Dynamics, Inc. Method of testing active matrix liquid crystal display substrates
JP3011401B2 (ja) * 1996-08-29 2000-02-21 日本電産リード株式会社 上側治具位置決め機構付きプリント基板検査装置および上側治具位置決め方法
US5736279A (en) * 1996-11-06 1998-04-07 International Business Machines Corporation Accurate drilling of probe holes in the insulating plate of an electrical test head
JP3328553B2 (ja) 1997-07-25 2002-09-24 松下電器産業株式会社 回路基板検査装置
EP0962777A3 (en) * 1998-06-02 2002-12-11 Nihon Densan Read Kabushiki Kaisha, (Nidec-Read Corporation) Printed circuit board testing apparatus
CN100587933C (zh) * 2002-10-28 2010-02-03 东京毅力科创株式会社 探针痕迹读取装置和探针痕迹读取方法
US7342402B2 (en) * 2003-04-10 2008-03-11 Formfactor, Inc. Method of probing a device using captured image of probe structure in which probe tips comprise alignment features
JP4497354B2 (ja) * 2004-04-20 2010-07-07 ヤマハファインテック株式会社 プリント基板における導電パターンの製造方法および製造装置
JP2006138808A (ja) * 2004-11-15 2006-06-01 Mitsubishi Electric Corp 基板検査装置
US20060273815A1 (en) * 2005-06-06 2006-12-07 Applied Materials, Inc. Substrate support with integrated prober drive
KR100679167B1 (ko) * 2005-07-15 2007-02-06 (주)티에스이 동축케이블을 이용한 반도체 웨이퍼 테스트용 프로브 카드
JP2010048565A (ja) * 2008-08-19 2010-03-04 Nidec-Read Corp 基板検査装置用の検査用プローブの移動制御装置
JP2010048599A (ja) * 2008-08-20 2010-03-04 Tokyo Electron Ltd 微小構造体の検査装置および微小構造体の検査方法
JP5273590B2 (ja) 2009-02-20 2013-08-28 日産自動車株式会社 燃料電池
JP2010256614A (ja) * 2009-04-24 2010-11-11 Videocon Global Ltd アレイ基板検査機能付レーザーリペア装置
US20120105087A1 (en) * 2010-11-03 2012-05-03 Gordon Mackenzie Apparatus for testing circuit boards of computing devices and methods for same
JP5943523B2 (ja) * 2014-03-03 2016-07-05 オー・エイチ・ティー株式会社 接触型回路パターン検査装置及びその検査方法
TWM502849U (zh) * 2015-01-12 2015-06-11 Hauman Technologies Corp 能根據待測物及針尖之影像自動調校點測位置之設備
JP6478891B2 (ja) * 2015-10-07 2019-03-06 三菱電機株式会社 プローブ位置検査装置
TWI794324B (zh) * 2017-11-24 2023-03-01 日商日本電產理德股份有限公司 基板檢查裝置、檢查位置補正方法、位置補正資訊產生方法、以及位置補正資訊產生系統
CN111742233B (zh) * 2018-02-26 2023-06-09 雅马哈精密科技株式会社 定位装置及定位方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018037538A (ja) * 2016-08-31 2018-03-08 株式会社東京精密 プローバ
US20180164344A1 (en) 2016-12-12 2018-06-14 Mitsubishi Electric Corporation Semiconductor inspection jig

Also Published As

Publication number Publication date
JP2021038926A (ja) 2021-03-11
CN112444728A (zh) 2021-03-05
TWI786426B (zh) 2022-12-11
JP7303543B2 (ja) 2023-07-05
CN112444728B (zh) 2024-05-17
KR20210027096A (ko) 2021-03-10
TW202109068A (zh) 2021-03-01

Similar Documents

Publication Publication Date Title
US8013621B2 (en) Inspection method and program for inspecting electrical characteristics of a semiconductor wafer
KR101759793B1 (ko) 기판 검사 장치 및 그 제어 방법
KR101024266B1 (ko) 촬상 위치 보정 방법, 촬상 방법, 기판 촬상 장치 및, 컴퓨터 프로그램이 기록된 기록 매체
US8098412B2 (en) Method for detecting the center of wafer and storage medium storing a program for executing the method
US8836354B2 (en) Apparatus for thermal testing of a printed circuit board
KR101966513B1 (ko) 회로 기판의 검사 방법, 검사 장치, 및 프로그램
CN111486787A (zh) 一种测试定位方法以及测试定位系统
JP5825569B2 (ja) プローブ装置のアライメント支援装置及びアライメント支援方法
KR102545501B1 (ko) 고주파 특성 검사 장치 및 고주파 특성 검사 방법
CN108662992B (zh) 表面量测方法及表面量测系统
JP4867219B2 (ja) 検査装置及び検査装置の位置決め方法
KR102536717B1 (ko) Pcba 검사장치
KR102170610B1 (ko) 위치 보정 방법, 검사 장치 및 프로브 카드
JP2003098216A (ja) 回路基板検査装置
JPH08262114A (ja) 回路基板検査装置におけるプローブの移動制御方法
KR20220056584A (ko) Pcba 검사장치
JP6900261B2 (ja) 処理装置、基板検査装置、処理方法および基板検査方法
JP6596341B2 (ja) 検査装置および検査方法
JP4695106B2 (ja) チャックトップの高さを求める方法及びこの方法を記録したプログラム記録媒体
KR102449983B1 (ko) Pcba 검사장치
EP4036589B1 (en) Inspection apparatus, control method, and storage medium
JP2006023229A (ja) プローブカードの品質評価方法及びその装置、プローブ検査方法
KR102382569B1 (ko) Pcba 검사장치의 pcba 검사방법
JP5962566B2 (ja) コンタクトプローブの検査方法、検査装置
JP3062255B2 (ja) 回路基板検査装置における被検査回路基板の基準位置検出方法

Legal Events

Date Code Title Description
E902 Notification of reason for refusal
E902 Notification of reason for refusal
E701 Decision to grant or registration of patent right