KR102545004B1 - 방사선 경화형 다이싱용 점착 테이프 - Google Patents

방사선 경화형 다이싱용 점착 테이프 Download PDF

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Publication number
KR102545004B1
KR102545004B1 KR1020197030030A KR20197030030A KR102545004B1 KR 102545004 B1 KR102545004 B1 KR 102545004B1 KR 1020197030030 A KR1020197030030 A KR 1020197030030A KR 20197030030 A KR20197030030 A KR 20197030030A KR 102545004 B1 KR102545004 B1 KR 102545004B1
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KR
South Korea
Prior art keywords
sensitive adhesive
pressure
dicing
radiation
adhesive tape
Prior art date
Application number
KR1020197030030A
Other languages
English (en)
Korean (ko)
Other versions
KR20200101831A (ko
Inventor
사또시 오따
Original Assignee
후루카와 덴키 고교 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 후루카와 덴키 고교 가부시키가이샤 filed Critical 후루카와 덴키 고교 가부시키가이샤
Publication of KR20200101831A publication Critical patent/KR20200101831A/ko
Application granted granted Critical
Publication of KR102545004B1 publication Critical patent/KR102545004B1/ko

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Dicing (AREA)
KR1020197030030A 2017-12-27 2018-12-25 방사선 경화형 다이싱용 점착 테이프 KR102545004B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2017-250326 2017-12-27
JP2017250326 2017-12-27
PCT/JP2018/047507 WO2019131603A1 (ja) 2017-12-27 2018-12-25 放射線硬化型ダイシング用粘着テープ

Publications (2)

Publication Number Publication Date
KR20200101831A KR20200101831A (ko) 2020-08-28
KR102545004B1 true KR102545004B1 (ko) 2023-06-20

Family

ID=67063743

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020197030030A KR102545004B1 (ko) 2017-12-27 2018-12-25 방사선 경화형 다이싱용 점착 테이프

Country Status (6)

Country Link
JP (1) JP7222919B2 (zh)
KR (1) KR102545004B1 (zh)
CN (1) CN110582839B (zh)
SG (1) SG11201911458PA (zh)
TW (1) TWI727244B (zh)
WO (1) WO2019131603A1 (zh)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2021200714A1 (zh) * 2020-03-30 2021-10-07
JP7072735B1 (ja) * 2021-03-31 2022-05-20 株式会社寺岡製作所 粘着組成物及び粘着テープ

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010135494A (ja) * 2008-12-03 2010-06-17 Furukawa Electric Co Ltd:The ダイシングテープ
JP2014072221A (ja) * 2012-09-27 2014-04-21 Furukawa Electric Co Ltd:The 放射線硬化型ダイシング用粘着テープ

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3951091B2 (ja) 2000-08-04 2007-08-01 セイコーエプソン株式会社 半導体装置の製造方法
JP2005236245A (ja) 2004-01-23 2005-09-02 Seiko Epson Corp 半導体装置およびその製造方法、半導体チップおよびその製造方法、並びに電子機器
JP2006202926A (ja) 2005-01-19 2006-08-03 Sekisui Chem Co Ltd ダイシングテープ
JP4549239B2 (ja) * 2005-06-22 2010-09-22 日東電工株式会社 ダイシング用粘着シート
KR20110099106A (ko) * 2008-11-19 2011-09-06 덴끼 가가꾸 고교 가부시키가이샤 전자 부품의 제조 방법
JP5681374B2 (ja) * 2010-04-19 2015-03-04 日東電工株式会社 ダイシングテープ一体型半導体裏面用フィルム
JP5911284B2 (ja) * 2011-12-12 2016-04-27 日東電工株式会社 積層シート、及び、積層シートを用いた半導体装置の製造方法
JP6261115B2 (ja) * 2013-09-19 2018-01-17 日東電工株式会社 粘着シート
JP5607847B1 (ja) * 2013-11-29 2014-10-15 古河電気工業株式会社 半導体加工用粘着テープ

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010135494A (ja) * 2008-12-03 2010-06-17 Furukawa Electric Co Ltd:The ダイシングテープ
JP2014072221A (ja) * 2012-09-27 2014-04-21 Furukawa Electric Co Ltd:The 放射線硬化型ダイシング用粘着テープ

Also Published As

Publication number Publication date
TWI727244B (zh) 2021-05-11
SG11201911458PA (en) 2020-01-30
WO2019131603A1 (ja) 2019-07-04
CN110582839A (zh) 2019-12-17
KR20200101831A (ko) 2020-08-28
JP7222919B2 (ja) 2023-02-15
JPWO2019131603A1 (ja) 2020-11-19
TW201930517A (zh) 2019-08-01
CN110582839B (zh) 2023-06-06

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