KR102483032B1 - 접착제 조성물, 접착 시트, 및 봉지체 - Google Patents

접착제 조성물, 접착 시트, 및 봉지체 Download PDF

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Publication number
KR102483032B1
KR102483032B1 KR1020197026351A KR20197026351A KR102483032B1 KR 102483032 B1 KR102483032 B1 KR 102483032B1 KR 1020197026351 A KR1020197026351 A KR 1020197026351A KR 20197026351 A KR20197026351 A KR 20197026351A KR 102483032 B1 KR102483032 B1 KR 102483032B1
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KR
South Korea
Prior art keywords
component
adhesive
adhesive composition
adhesive sheet
mass
Prior art date
Application number
KR1020197026351A
Other languages
English (en)
Korean (ko)
Other versions
KR20200015453A (ko
Inventor
겐타 니시지마
다츠키 하세가와
미키히로 가시오
Original Assignee
린텍 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 린텍 가부시키가이샤 filed Critical 린텍 가부시키가이샤
Publication of KR20200015453A publication Critical patent/KR20200015453A/ko
Application granted granted Critical
Publication of KR102483032B1 publication Critical patent/KR102483032B1/ko

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J123/00—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
    • C09J123/26—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers modified by chemical after-treatment
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • H01L27/32—
    • H01L51/50—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/02—Details
    • H05B33/04—Sealing arrangements, e.g. against humidity
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • General Chemical & Material Sciences (AREA)
  • Theoretical Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
KR1020197026351A 2017-05-31 2018-05-30 접착제 조성물, 접착 시트, 및 봉지체 KR102483032B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2017-107482 2017-05-31
JP2017107482 2017-05-31
PCT/JP2018/020734 WO2018221574A1 (ja) 2017-05-31 2018-05-30 接着剤組成物、接着シート、及び封止体

Publications (2)

Publication Number Publication Date
KR20200015453A KR20200015453A (ko) 2020-02-12
KR102483032B1 true KR102483032B1 (ko) 2022-12-29

Family

ID=64455333

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020197026351A KR102483032B1 (ko) 2017-05-31 2018-05-30 접착제 조성물, 접착 시트, 및 봉지체

Country Status (4)

Country Link
JP (1) JP7138407B2 (ja)
KR (1) KR102483032B1 (ja)
TW (1) TWI758483B (ja)
WO (1) WO2018221574A1 (ja)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008163344A (ja) 2008-01-22 2008-07-17 Nitto Denko Corp 電子部品固定用反応性接着剤組成物及びその接着シート

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6361017A (ja) * 1986-08-29 1988-03-17 Sumitomo Chem Co Ltd 液状エポキシ封止材
JP3380468B2 (ja) * 1998-06-26 2003-02-24 クレハエラストマー株式会社 ゴムシート
JP3621337B2 (ja) * 1999-12-21 2005-02-16 株式会社巴川製紙所 半導体装置用接着剤組成物及び接着シート
JP4503429B2 (ja) * 2004-02-10 2010-07-14 リンテック株式会社 半導体装置の製造方法
WO2011062167A1 (ja) 2009-11-18 2011-05-26 味の素株式会社 樹脂組成物
KR101045262B1 (ko) * 2009-12-21 2011-06-29 제일모직주식회사 스텔스 다이싱용 반도체용 접착 조성물 및 이를 이용한 접착 필름
WO2016047289A1 (ja) * 2014-09-24 2016-03-31 東亞合成株式会社 接着剤組成物及びこれを用いた接着剤層付き積層体
JP2016125042A (ja) * 2015-01-08 2016-07-11 横浜ゴム株式会社 接着剤組成物、これを用いる光制御パネル、その製造方法、光学結像装置
US10865329B2 (en) * 2015-04-29 2020-12-15 Lg Chem, Ltd. Adhesive film for semiconductor
WO2018047868A1 (ja) * 2016-09-07 2018-03-15 リンテック株式会社 接着剤組成物、封止シート、及び封止体
KR102272538B1 (ko) * 2016-09-07 2021-07-02 린텍 가부시키가이샤 접착제 조성물, 봉지 시트 및 봉지체

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008163344A (ja) 2008-01-22 2008-07-17 Nitto Denko Corp 電子部品固定用反応性接着剤組成物及びその接着シート

Also Published As

Publication number Publication date
JP7138407B2 (ja) 2022-09-16
TWI758483B (zh) 2022-03-21
WO2018221574A1 (ja) 2018-12-06
JPWO2018221574A1 (ja) 2020-04-02
TW201903103A (zh) 2019-01-16
KR20200015453A (ko) 2020-02-12

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