KR102468554B1 - 지문 인식 모듈 및 지문 인식 모듈의 제조 방법 - Google Patents

지문 인식 모듈 및 지문 인식 모듈의 제조 방법 Download PDF

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Publication number
KR102468554B1
KR102468554B1 KR1020197014898A KR20197014898A KR102468554B1 KR 102468554 B1 KR102468554 B1 KR 102468554B1 KR 1020197014898 A KR1020197014898 A KR 1020197014898A KR 20197014898 A KR20197014898 A KR 20197014898A KR 102468554 B1 KR102468554 B1 KR 102468554B1
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South Korea
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fingerprint
fingerprint sensor
sensor device
recognition module
cover structure
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Korean (ko)
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KR20190096977A (ko
Inventor
닐스 룬드버그
지민 모
매츠 슬로트너
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핑거프린트 카드즈 아나카툼 아이피 에이비
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    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/073—Special arrangements for circuits, e.g. for protecting identification code in memory
    • G06K19/07309—Means for preventing undesired reading or writing from or onto record carriers
    • G06K19/07345—Means for preventing undesired reading or writing from or onto record carriers by activating or deactivating at least a part of the circuit on the record carrier, e.g. ON/OFF switches
    • G06K19/07354—Means for preventing undesired reading or writing from or onto record carriers by activating or deactivating at least a part of the circuit on the record carrier, e.g. ON/OFF switches by biometrically sensitive means, e.g. fingerprint sensitive
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
    • G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
    • G06V40/12—Fingerprints or palmprints
    • G06V40/13—Sensors therefor
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07701—Constructional details, e.g. mounting of circuits in the carrier the record carrier comprising an interface suitable for human interaction
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/0772—Physical layout of the record carrier
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/08—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code using markings of different kinds or more than one marking of the same kind in the same record carrier, e.g. one marking being sensed by optical and the other by magnetic means
    • G06K19/10—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code using markings of different kinds or more than one marking of the same kind in the same record carrier, e.g. one marking being sensed by optical and the other by magnetic means at least one kind of marking being used for authentication, e.g. of credit or identity cards
    • G06K19/14—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code using markings of different kinds or more than one marking of the same kind in the same record carrier, e.g. one marking being sensed by optical and the other by magnetic means at least one kind of marking being used for authentication, e.g. of credit or identity cards the marking being sensed by radiation
    • G06K19/145—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code using markings of different kinds or more than one marking of the same kind in the same record carrier, e.g. one marking being sensed by optical and the other by magnetic means at least one kind of marking being used for authentication, e.g. of credit or identity cards the marking being sensed by radiation at least one of the further markings being adapted for galvanic or wireless sensing, e.g. an RFID tag with both a wireless and an optical interface or memory, or a contact type smart card with ISO 7816 contacts and an optical interface or memory
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/08—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code using markings of different kinds or more than one marking of the same kind in the same record carrier, e.g. one marking being sensed by optical and the other by magnetic means
    • G06K19/10—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code using markings of different kinds or more than one marking of the same kind in the same record carrier, e.g. one marking being sensed by optical and the other by magnetic means at least one kind of marking being used for authentication, e.g. of credit or identity cards
    • G06K19/18—Constructional details
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V10/00—Arrangements for image or video recognition or understanding
    • G06V10/94—Hardware or software architectures specially adapted for image or video understanding
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
    • G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
    • G06V40/12—Fingerprints or palmprints
    • G06V40/13—Sensors therefor
    • G06V40/1306—Sensors therefor non-optical, e.g. ultrasonic or capacitive sensing
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
    • G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
    • G06V40/12—Fingerprints or palmprints
    • G06V40/13—Sensors therefor
    • G06V40/1329—Protecting the fingerprint sensor against damage caused by the finger
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19107—Disposition of discrete passive components off-chip wires

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Multimedia (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Human Computer Interaction (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Computer Security & Cryptography (AREA)
  • General Engineering & Computer Science (AREA)
  • Software Systems (AREA)
  • Image Input (AREA)
  • Measurement Of The Respiration, Hearing Ability, Form, And Blood Characteristics Of Living Organisms (AREA)
  • Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)
KR1020197014898A 2016-12-15 2017-12-04 지문 인식 모듈 및 지문 인식 모듈의 제조 방법 Active KR102468554B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
SE1651654 2016-12-15
SE1651654-4 2016-12-15
PCT/SE2017/051210 WO2018111174A1 (en) 2016-12-15 2017-12-04 Fingerprint sensing module and method for manufacturing the fingerprint sensing module

Publications (2)

Publication Number Publication Date
KR20190096977A KR20190096977A (ko) 2019-08-20
KR102468554B1 true KR102468554B1 (ko) 2022-11-18

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Country Status (6)

Country Link
US (1) US10395164B2 (OSRAM)
EP (2) EP3336759B1 (OSRAM)
JP (2) JP7065094B2 (OSRAM)
KR (1) KR102468554B1 (OSRAM)
CN (2) CN108229340B (OSRAM)
WO (1) WO2018111174A1 (OSRAM)

Families Citing this family (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20180165495A1 (en) * 2016-12-09 2018-06-14 Fingerprint Cards Ab Electronic device
US11610429B2 (en) 2016-12-15 2023-03-21 Fingerprint Cards Anacatum Ip Ab Fingerprint sensing module and method for manufacturing the fingerprint sensing module
US10395164B2 (en) * 2016-12-15 2019-08-27 Fingerprint Cards Ab Fingerprint sensing module and method for manufacturing the fingerprint sensing module
US11023702B2 (en) 2016-12-15 2021-06-01 Fingerprint Cards Ab Fingerprint sensing module and method for manufacturing the fingerprint sensing module
US10984304B2 (en) 2017-02-02 2021-04-20 Jonny B. Vu Methods for placing an EMV chip onto a metal card
FR3069081B1 (fr) * 2017-07-17 2021-08-20 Safran Identity & Security Carte electronique comprenant un capteur d'empreinte et procede de fabrication d'une telle carte
EP3454363A4 (en) * 2017-07-20 2019-08-21 Shenzhen Goodix Technology Co., Ltd. CHIP HOUSING STRUCTURE, CHIP MODULE AND ELECTRONIC TERMINAL
US10509936B2 (en) * 2017-08-28 2019-12-17 Superc-Touch Corporation Fingerprint identification apparatus having conductive structure
US20200051938A9 (en) * 2017-12-18 2020-02-13 China Wafer Level Csp Co., Ltd. Fingerprint chip packaging method and fingerprint chip package
TWI705538B (zh) * 2018-06-29 2020-09-21 同欣電子工業股份有限公司 指紋感測封裝模組的製法
USD956760S1 (en) * 2018-07-30 2022-07-05 Lion Credit Card Inc. Multi EMV chip card
WO2020082323A1 (zh) * 2018-10-26 2020-04-30 深圳市汇顶科技股份有限公司 指纹检测打码装置、指纹检测系统和电子设备
SG10201902933WA (en) 2019-04-01 2020-11-27 Advanide Holdings Pte Ltd An improved card with fingerprint biometrics
FR3095285B1 (fr) 2019-04-19 2022-11-11 Linxens Holding Module de capteur biométrique pour carte à puce et procédé de fabrication d’un tel module
FR3095287B1 (fr) * 2019-04-19 2022-11-04 Linxens Holding Module de capteur biométrique pour carte à puce et procédé de fabrication d’un tel module
FR3095536B1 (fr) 2019-04-25 2021-09-24 Idemia Identity & Security France Module de carte à microcircuit avec capteur d’empreinte digitale et coque de protection
KR102138671B1 (ko) * 2019-05-14 2020-08-11 (주)비티비엘 지문센서부가 개선된 스마트카드
US20210081743A1 (en) 2019-08-12 2021-03-18 Federal Card Services, LLC Dual interface metal cards and methods of manufacturing
US12277462B2 (en) 2019-08-14 2025-04-15 Federal Card Services, LLC Metal-containing dual interface smartcards
US11113593B2 (en) 2019-08-15 2021-09-07 Federal Card Services; LLC Contactless metal cards with fingerprint sensor and display
CN110458143B (zh) * 2019-08-21 2022-04-15 京东方科技集团股份有限公司 指纹识别装置、进行指纹识别的方法以及电子设备
US11341385B2 (en) 2019-11-16 2022-05-24 Federal Card Services, LLC RFID enabled metal transaction card with shaped opening and shaped slit
EP3836010B1 (en) * 2019-12-12 2024-07-24 Fingerprint Cards Anacatum IP AB A biometric sensor module for card integration
US11055683B1 (en) * 2020-04-02 2021-07-06 Capital One Services, Llc Computer-based systems involving fingerprint or biometrically-activated transaction cards and methods of use thereof
FR3111215B1 (fr) * 2020-06-04 2022-08-12 Linxens Holding Module de capteur biométrique pour carte à puce et procédé de fabrication d’un tel module
EP3933697B1 (en) * 2020-07-01 2022-06-15 Fingerprint Cards Anacatum IP AB Biometric imaging module and method for manufacturing a biometric imaging module
WO2022086624A1 (en) * 2020-10-23 2022-04-28 Visa International Service Association Integrated biometric sensor and memory for biometric card
SE2051294A1 (en) * 2020-11-06 2022-05-07 Fingerprint Cards Anacatum Ip Ab Integrated biometric sensor module and method for manufacturing a smartcard comprising an integrated biometric sensor module
KR20240018865A (ko) 2022-08-03 2024-02-14 삼성전자주식회사 지문 센서 패키지 및 이를 포함하는 스마트 카드
WO2024049340A1 (en) * 2022-08-29 2024-03-07 Fingerprint Cards Anacatum Ip Ab Biometric imaging device and method for manufacturing the biometric imaging device
FR3144885A1 (fr) 2023-01-09 2024-07-12 Linxens Holding Module de carte à puce renforcé et procédé de fabrication d’une telle carte à puce
KR102758876B1 (ko) * 2023-09-27 2025-01-23 주식회사 이터널 전원 공급 필름 및 이러한 전원 공급 필름을 이용한 지문 인식 카드의 사용자 지문 등록 방법

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20150049925A1 (en) * 2012-04-24 2015-02-19 Zwipe, As Method of Manufacturing an Electronic Card
US20160335470A1 (en) * 2015-05-12 2016-11-17 Amkor Technology, Inc. Fingerprint sensor and manufacturing method thereof

Family Cites Families (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3769332B2 (ja) * 1996-09-13 2006-04-26 大日本印刷株式会社 Ｉｃカードの製造方法
DE19921231A1 (de) 1999-05-07 2000-11-09 Giesecke & Devrient Gmbh Fingerabdrucksensor für Chipkarte
FR2797075B1 (fr) 1999-07-26 2001-10-12 Gemplus Card Int Procede de fabrication de dispositif portable a circuits integres, de type carte a puce de format reduit par rapport au format standard
AU2001293304A1 (en) 2000-09-19 2002-04-02 Nanopierce Technologies, Inc. Method for assembling components and antennae in radio frequency identification devices
NO316776B1 (no) * 2001-12-07 2004-05-03 Idex Asa Pakkelosning for fingeravtrykksensor
DE10221214A1 (de) 2002-05-13 2003-11-27 Orga Kartensysteme Gmbh Chipmodul
US6924496B2 (en) * 2002-05-31 2005-08-02 Fujitsu Limited Fingerprint sensor and interconnect
CZ2005209A3 (cs) 2002-09-10 2005-12-14 Ivi Smart Technologies, Inc. Bezpečné biometrické ověření identity
JP4904769B2 (ja) * 2005-10-21 2012-03-28 富士通セミコンダクター株式会社 半導体装置
CN100590643C (zh) * 2007-01-17 2010-02-17 南茂科技股份有限公司 指纹辨识器的薄膜封装构造
JP2010122015A (ja) * 2008-11-18 2010-06-03 Fujitsu Ltd センサユニット及び電子装置の製造方法
NO20093601A1 (no) * 2009-12-29 2011-06-30 Idex Asa Overflatesensor
WO2011130493A1 (en) * 2010-04-15 2011-10-20 Authentec, Inc. Finger sensor including capacitive lens and associated methods
US8736001B2 (en) * 2010-06-18 2014-05-27 Authentec, Inc. Finger sensor including encapsulating layer over sensing area and related methods
US8717775B1 (en) * 2010-08-02 2014-05-06 Amkor Technology, Inc. Fingerprint sensor package and method
KR20120019729A (ko) * 2010-08-26 2012-03-07 (주)바이오스마트 스폿 용접을 이용하여 제조된 ｉｃ 카드 및 그 제조 방법
JP5069342B2 (ja) * 2010-09-01 2012-11-07 エイエスディ株式会社 指紋読み取りセンサ付ｉｃカードとその製造方法
US9158958B2 (en) * 2010-10-28 2015-10-13 Synaptics Incorporated Signal strength enhancement in a biometric sensor array
US20140210589A1 (en) * 2013-01-29 2014-07-31 Mary Adele Grace Smart card and smart system with enhanced security features
WO2015013530A1 (en) * 2013-07-24 2015-01-29 Synaptics Incorporated Signal strength enhancement in a biometric sensor array
JP6654566B2 (ja) * 2013-08-23 2020-02-26 フィンガープリント カーズ アーベー 指紋検知システムの接続パッド
TWI534962B (zh) * 2013-12-09 2016-05-21 茂丞科技股份有限公司 具有外觀隱藏的耦合電極之近接式感測器及其製造方法
DE102013113901B3 (de) * 2013-12-12 2015-01-08 Innenministerium des Landes Schleswig-Holstein, vertreten durch den Innenminister Verfahren zum Sichtbarmachen von Fingerabdrücken
US9520697B2 (en) * 2014-02-10 2016-12-13 Soraa Laser Diode, Inc. Manufacturable multi-emitter laser diode
TWI530885B (zh) * 2014-03-18 2016-04-21 茂丞科技股份有限公司 具有外露顏料層之全平面感測器及使用其之電子裝置
US9576177B2 (en) * 2014-12-11 2017-02-21 Fingerprint Cards Ab Fingerprint sensing device
US9449212B2 (en) * 2014-12-22 2016-09-20 Fingerprint Cards Ab Capacitive fingerprint sensor with sensing elements comprising timing circuitry
TWI594341B (zh) * 2015-01-19 2017-08-01 神盾股份有限公司 指紋辨識裝置封裝及其製造方法
TW201643772A (zh) 2015-06-08 2016-12-16 指紋卡公司 具有中介結構的指紋感測裝置
CN204808272U (zh) * 2015-07-03 2015-11-25 宸鸿科技(厦门)有限公司 具有指纹识别功能的触控面板
TWM523147U (zh) * 2015-09-10 2016-06-01 茂丞科技股份有限公司 指紋感測單元及指紋感測模組
US9792516B2 (en) * 2016-01-26 2017-10-17 Next Biometrics Group Asa Flexible card with fingerprint sensor
US10395164B2 (en) * 2016-12-15 2019-08-27 Fingerprint Cards Ab Fingerprint sensing module and method for manufacturing the fingerprint sensing module

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20150049925A1 (en) * 2012-04-24 2015-02-19 Zwipe, As Method of Manufacturing an Electronic Card
US20160335470A1 (en) * 2015-05-12 2016-11-17 Amkor Technology, Inc. Fingerprint sensor and manufacturing method thereof

Also Published As

Publication number Publication date
EP3564852A1 (en) 2019-11-06
US20180174018A1 (en) 2018-06-21
CN207601824U (zh) 2018-07-10
EP3336759A1 (en) 2018-06-20
WO2018111174A1 (en) 2018-06-21
JP7065094B2 (ja) 2022-05-11
JP2022106838A (ja) 2022-07-20
CN108229340A (zh) 2018-06-29
CN108229340B (zh) 2021-07-30
JP7289956B2 (ja) 2023-06-12
EP3336759B1 (en) 2019-06-19
KR20190096977A (ko) 2019-08-20
US10395164B2 (en) 2019-08-27
JP2020503606A (ja) 2020-01-30
EP3564852B1 (en) 2023-10-18

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