KR102466267B1 - 전자 디바이스 패키지용 테이프 - Google Patents

전자 디바이스 패키지용 테이프 Download PDF

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Publication number
KR102466267B1
KR102466267B1 KR1020187027742A KR20187027742A KR102466267B1 KR 102466267 B1 KR102466267 B1 KR 102466267B1 KR 1020187027742 A KR1020187027742 A KR 1020187027742A KR 20187027742 A KR20187027742 A KR 20187027742A KR 102466267 B1 KR102466267 B1 KR 102466267B1
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KR
South Korea
Prior art keywords
adhesive layer
tape
metal layer
adhesive
electronic device
Prior art date
Application number
KR1020187027742A
Other languages
English (en)
Korean (ko)
Other versions
KR20180127366A (ko
Inventor
마사미 아오야마
지로우 스기야마
도루 사노
Original Assignee
후루카와 덴키 고교 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 후루카와 덴키 고교 가부시키가이샤 filed Critical 후루카와 덴키 고교 가부시키가이샤
Publication of KR20180127366A publication Critical patent/KR20180127366A/ko
Application granted granted Critical
Publication of KR102466267B1 publication Critical patent/KR102466267B1/ko

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C09J133/08—Homopolymers or copolymers of acrylic acid esters
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J171/00—Adhesives based on polyethers obtained by reactions forming an ether link in the main chain; Adhesives based on derivatives of such polymers
    • C09J171/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
    • C09J171/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Dicing (AREA)
  • Packages (AREA)
  • Laminated Bodies (AREA)
  • Wire Bonding (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
KR1020187027742A 2016-03-31 2016-11-25 전자 디바이스 패키지용 테이프 KR102466267B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2016072253 2016-03-31
JPJP-P-2016-072253 2016-03-31
PCT/JP2016/084928 WO2017168829A1 (ja) 2016-03-31 2016-11-25 電子デバイスパッケージ用テープ

Publications (2)

Publication Number Publication Date
KR20180127366A KR20180127366A (ko) 2018-11-28
KR102466267B1 true KR102466267B1 (ko) 2022-11-14

Family

ID=59963848

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020187027742A KR102466267B1 (ko) 2016-03-31 2016-11-25 전자 디바이스 패키지용 테이프

Country Status (7)

Country Link
JP (1) JP6877404B2 (ja)
KR (1) KR102466267B1 (ja)
CN (1) CN108779374A (ja)
MY (1) MY184452A (ja)
SG (1) SG11201807411VA (ja)
TW (1) TWI643931B (ja)
WO (1) WO2017168829A1 (ja)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7111562B2 (ja) * 2018-08-31 2022-08-02 株式会社ディスコ 加工方法
JP6935379B2 (ja) * 2018-09-25 2021-09-15 古河電気工業株式会社 電子デバイスパッケージ用テープ
JP6852030B2 (ja) * 2018-09-25 2021-03-31 古河電気工業株式会社 電子デバイスパッケージ用テープ
JP7060483B2 (ja) * 2018-09-25 2022-04-26 古河電気工業株式会社 電子デバイスパッケージ用テープ
JP7112997B2 (ja) * 2019-10-30 2022-08-04 古河電気工業株式会社 電子デバイスパッケージ用テープ
KR20220072634A (ko) * 2020-11-25 2022-06-02 (주)이녹스첨단소재 스페이서용 다층 필름 및 이를 이용한 스페이서 형성 방법
JPWO2022208966A1 (ja) * 2021-03-31 2022-10-06

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4055614B2 (ja) * 2003-03-18 2008-03-05 東レ株式会社 金属箔付き積層フィルム及びそれを用いた半導体装置
JP2010225651A (ja) * 2009-03-19 2010-10-07 Sekisui Chem Co Ltd ダイシングテープ及び半導体チップの製造方法
JP2012033626A (ja) * 2010-07-29 2012-02-16 Nitto Denko Corp フリップチップ型半導体裏面用フィルム及びその用途

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5319970A (en) 1976-08-10 1978-02-23 Mitsubishi Heavy Ind Ltd Treating method of exhaust gas
JP4954569B2 (ja) * 2006-02-16 2012-06-20 日東電工株式会社 半導体装置の製造方法
JP2007235022A (ja) 2006-03-03 2007-09-13 Mitsui Chemicals Inc 接着フィルム
CN100559563C (zh) * 2007-06-29 2009-11-11 上海蓝光科技有限公司 Led芯片表面粗糙度的识别和分类方法
JP5487847B2 (ja) 2009-09-25 2014-05-14 日本電気株式会社 電子デバイスパッケージ及びその製造方法、並びに電子機器
JP2011151362A (ja) * 2009-12-24 2011-08-04 Nitto Denko Corp ダイシングテープ一体型半導体裏面用フィルム

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4055614B2 (ja) * 2003-03-18 2008-03-05 東レ株式会社 金属箔付き積層フィルム及びそれを用いた半導体装置
JP2010225651A (ja) * 2009-03-19 2010-10-07 Sekisui Chem Co Ltd ダイシングテープ及び半導体チップの製造方法
JP2012033626A (ja) * 2010-07-29 2012-02-16 Nitto Denko Corp フリップチップ型半導体裏面用フィルム及びその用途

Also Published As

Publication number Publication date
JP6877404B2 (ja) 2021-05-26
KR20180127366A (ko) 2018-11-28
MY184452A (en) 2021-04-01
WO2017168829A1 (ja) 2017-10-05
CN108779374A (zh) 2018-11-09
TW201736548A (zh) 2017-10-16
TWI643931B (zh) 2018-12-11
SG11201807411VA (en) 2018-09-27
JPWO2017168829A1 (ja) 2019-02-14

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