MY184452A - Tape for electronic device packaging - Google Patents
Tape for electronic device packagingInfo
- Publication number
- MY184452A MY184452A MYPI2018702993A MYPI2018702993A MY184452A MY 184452 A MY184452 A MY 184452A MY PI2018702993 A MYPI2018702993 A MY PI2018702993A MY PI2018702993 A MYPI2018702993 A MY PI2018702993A MY 184452 A MY184452 A MY 184452A
- Authority
- MY
- Malaysia
- Prior art keywords
- adhesive layer
- tape
- pressure
- sensitive adhesive
- electronic device
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
- C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
- C09J133/08—Homopolymers or copolymers of acrylic acid esters
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J171/00—Adhesives based on polyethers obtained by reactions forming an ether link in the main chain; Adhesives based on derivatives of such polymers
- C09J171/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
- C09J171/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Dicing (AREA)
- Wire Bonding (AREA)
- Laminated Bodies (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Packages (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016072253 | 2016-03-31 | ||
PCT/JP2016/084928 WO2017168829A1 (ja) | 2016-03-31 | 2016-11-25 | 電子デバイスパッケージ用テープ |
Publications (1)
Publication Number | Publication Date |
---|---|
MY184452A true MY184452A (en) | 2021-04-01 |
Family
ID=59963848
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MYPI2018702993A MY184452A (en) | 2016-03-31 | 2016-11-25 | Tape for electronic device packaging |
Country Status (7)
Country | Link |
---|---|
JP (1) | JP6877404B2 (ja) |
KR (1) | KR102466267B1 (ja) |
CN (1) | CN108779374A (ja) |
MY (1) | MY184452A (ja) |
SG (1) | SG11201807411VA (ja) |
TW (1) | TWI643931B (ja) |
WO (1) | WO2017168829A1 (ja) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7111562B2 (ja) * | 2018-08-31 | 2022-08-02 | 株式会社ディスコ | 加工方法 |
JP6852030B2 (ja) * | 2018-09-25 | 2021-03-31 | 古河電気工業株式会社 | 電子デバイスパッケージ用テープ |
JP7060483B2 (ja) * | 2018-09-25 | 2022-04-26 | 古河電気工業株式会社 | 電子デバイスパッケージ用テープ |
JP6935379B2 (ja) * | 2018-09-25 | 2021-09-15 | 古河電気工業株式会社 | 電子デバイスパッケージ用テープ |
JP7217344B2 (ja) * | 2019-04-26 | 2023-02-02 | 三井化学東セロ株式会社 | 粘着性フィルムおよび電子装置の製造方法 |
JP7112997B2 (ja) * | 2019-10-30 | 2022-08-04 | 古河電気工業株式会社 | 電子デバイスパッケージ用テープ |
KR102698630B1 (ko) * | 2020-11-25 | 2024-08-26 | (주)이녹스첨단소재 | 스페이서용 다층 필름 및 이를 이용한 스페이서 형성 방법 |
WO2022208966A1 (ja) * | 2021-03-31 | 2022-10-06 | 株式会社ユポ・コーポレーション | 記録用紙 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5319970A (en) | 1976-08-10 | 1978-02-23 | Mitsubishi Heavy Ind Ltd | Treating method of exhaust gas |
JP4055614B2 (ja) * | 2003-03-18 | 2008-03-05 | 東レ株式会社 | 金属箔付き積層フィルム及びそれを用いた半導体装置 |
JP4954569B2 (ja) | 2006-02-16 | 2012-06-20 | 日東電工株式会社 | 半導体装置の製造方法 |
JP2007235022A (ja) * | 2006-03-03 | 2007-09-13 | Mitsui Chemicals Inc | 接着フィルム |
CN100559563C (zh) * | 2007-06-29 | 2009-11-11 | 上海蓝光科技有限公司 | Led芯片表面粗糙度的识别和分类方法 |
JP5486831B2 (ja) * | 2009-03-19 | 2014-05-07 | 積水化学工業株式会社 | ダイシングテープ及び半導体チップの製造方法 |
JP5487847B2 (ja) | 2009-09-25 | 2014-05-14 | 日本電気株式会社 | 電子デバイスパッケージ及びその製造方法、並びに電子機器 |
JP2011151362A (ja) * | 2009-12-24 | 2011-08-04 | Nitto Denko Corp | ダイシングテープ一体型半導体裏面用フィルム |
JP5419226B2 (ja) * | 2010-07-29 | 2014-02-19 | 日東電工株式会社 | フリップチップ型半導体裏面用フィルム及びその用途 |
-
2016
- 2016-11-25 MY MYPI2018702993A patent/MY184452A/en unknown
- 2016-11-25 CN CN201680083856.7A patent/CN108779374A/zh active Pending
- 2016-11-25 JP JP2018508371A patent/JP6877404B2/ja active Active
- 2016-11-25 KR KR1020187027742A patent/KR102466267B1/ko active IP Right Grant
- 2016-11-25 SG SG11201807411VA patent/SG11201807411VA/en unknown
- 2016-11-25 WO PCT/JP2016/084928 patent/WO2017168829A1/ja active Application Filing
-
2017
- 2017-03-22 TW TW106109582A patent/TWI643931B/zh active
Also Published As
Publication number | Publication date |
---|---|
TWI643931B (zh) | 2018-12-11 |
KR102466267B1 (ko) | 2022-11-14 |
CN108779374A (zh) | 2018-11-09 |
WO2017168829A1 (ja) | 2017-10-05 |
SG11201807411VA (en) | 2018-09-27 |
KR20180127366A (ko) | 2018-11-28 |
TW201736548A (zh) | 2017-10-16 |
JP6877404B2 (ja) | 2021-05-26 |
JPWO2017168829A1 (ja) | 2019-02-14 |
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