KR102460870B1 - 인쇄회로기판 - Google Patents

인쇄회로기판 Download PDF

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Publication number
KR102460870B1
KR102460870B1 KR1020170136879A KR20170136879A KR102460870B1 KR 102460870 B1 KR102460870 B1 KR 102460870B1 KR 1020170136879 A KR1020170136879 A KR 1020170136879A KR 20170136879 A KR20170136879 A KR 20170136879A KR 102460870 B1 KR102460870 B1 KR 102460870B1
Authority
KR
South Korea
Prior art keywords
substrate
connection
circuit board
printed circuit
insulating layer
Prior art date
Application number
KR1020170136879A
Other languages
English (en)
Korean (ko)
Other versions
KR20190044438A (ko
Inventor
민태홍
김주호
Original Assignee
삼성전기주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 삼성전기주식회사 filed Critical 삼성전기주식회사
Priority to KR1020170136879A priority Critical patent/KR102460870B1/ko
Priority to JP2018113223A priority patent/JP7207688B2/ja
Priority to TW107120929A priority patent/TWI750385B/zh
Publication of KR20190044438A publication Critical patent/KR20190044438A/ko
Priority to KR1020220138858A priority patent/KR20220150855A/ko
Application granted granted Critical
Publication of KR102460870B1 publication Critical patent/KR102460870B1/ko
Priority to JP2022207605A priority patent/JP7480458B2/ja

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/024—Dielectric details, e.g. changing the dielectric material around a transmission line
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
KR1020170136879A 2017-10-20 2017-10-20 인쇄회로기판 KR102460870B1 (ko)

Priority Applications (5)

Application Number Priority Date Filing Date Title
KR1020170136879A KR102460870B1 (ko) 2017-10-20 2017-10-20 인쇄회로기판
JP2018113223A JP7207688B2 (ja) 2017-10-20 2018-06-14 プリント回路基板
TW107120929A TWI750385B (zh) 2017-10-20 2018-06-19 印刷電路板
KR1020220138858A KR20220150855A (ko) 2017-10-20 2022-10-26 인쇄회로기판
JP2022207605A JP7480458B2 (ja) 2017-10-20 2022-12-23 プリント回路基板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020170136879A KR102460870B1 (ko) 2017-10-20 2017-10-20 인쇄회로기판

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR1020220138858A Division KR20220150855A (ko) 2017-10-20 2022-10-26 인쇄회로기판

Publications (2)

Publication Number Publication Date
KR20190044438A KR20190044438A (ko) 2019-04-30
KR102460870B1 true KR102460870B1 (ko) 2022-10-31

Family

ID=66285828

Family Applications (2)

Application Number Title Priority Date Filing Date
KR1020170136879A KR102460870B1 (ko) 2017-10-20 2017-10-20 인쇄회로기판
KR1020220138858A KR20220150855A (ko) 2017-10-20 2022-10-26 인쇄회로기판

Family Applications After (1)

Application Number Title Priority Date Filing Date
KR1020220138858A KR20220150855A (ko) 2017-10-20 2022-10-26 인쇄회로기판

Country Status (3)

Country Link
JP (2) JP7207688B2 (ja)
KR (2) KR102460870B1 (ja)
TW (1) TWI750385B (ja)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20210115486A (ko) * 2020-03-13 2021-09-27 엘지이노텍 주식회사 회로기판
TWI803168B (zh) * 2022-01-25 2023-05-21 欣興電子股份有限公司 電路板線路訊號強化方法及其結構

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017076763A (ja) * 2015-10-16 2017-04-20 日本特殊陶業株式会社 配線基板及びその製造方法
JP2017168606A (ja) * 2016-03-16 2017-09-21 イビデン株式会社 パッケージ基板
JP2017171833A (ja) * 2016-03-25 2017-09-28 日本ゼオン株式会社 接着剤および複合接合体

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06291521A (ja) * 1992-04-21 1994-10-18 Matsushita Electric Ind Co Ltd 高周波多層集積回路
CA2773076A1 (en) 2003-04-15 2004-10-28 Denki Kagaku Kogyo Kabushiki Kaisha Metal base circuit board and its production process
JP2007194516A (ja) * 2006-01-23 2007-08-02 Matsushita Electric Ind Co Ltd 複合配線基板およびその製造方法、ならびに電子部品の実装体および製造方法
US20080302564A1 (en) * 2007-06-11 2008-12-11 Ppg Industries Ohio, Inc. Circuit assembly including a metal core substrate and process for preparing the same
US7741194B2 (en) * 2008-01-04 2010-06-22 Freescale Semiconductor, Inc. Removable layer manufacturing method
JP2013214578A (ja) 2012-03-30 2013-10-17 Ibiden Co Ltd 配線板及びその製造方法
JPWO2016063695A1 (ja) * 2014-10-23 2017-08-10 住友ベークライト株式会社 金属箔張基板、回路基板および発熱体搭載基板
JP2016122790A (ja) 2014-12-25 2016-07-07 イビデン株式会社 多層配線板
KR101781989B1 (ko) * 2015-12-07 2017-09-27 주식회사 심텍 글라스 회로 기판 및 이의 제조 방법
JP6291521B2 (ja) 2016-05-25 2018-03-14 東京計装株式会社 液面計の異常診断方法
JP7307575B2 (ja) 2019-03-28 2023-07-12 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017076763A (ja) * 2015-10-16 2017-04-20 日本特殊陶業株式会社 配線基板及びその製造方法
JP2017168606A (ja) * 2016-03-16 2017-09-21 イビデン株式会社 パッケージ基板
JP2017171833A (ja) * 2016-03-25 2017-09-28 日本ゼオン株式会社 接着剤および複合接合体

Also Published As

Publication number Publication date
JP7480458B2 (ja) 2024-05-10
JP2023036832A (ja) 2023-03-14
KR20220150855A (ko) 2022-11-11
JP7207688B2 (ja) 2023-01-18
TW201918129A (zh) 2019-05-01
TWI750385B (zh) 2021-12-21
KR20190044438A (ko) 2019-04-30
JP2019080037A (ja) 2019-05-23

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A201 Request for examination
E902 Notification of reason for refusal
E701 Decision to grant or registration of patent right
GRNT Written decision to grant