KR102430326B1 - 다이 본딩 장치, 박리 유닛, 콜릿 및 반도체 장치의 제조 방법 - Google Patents

다이 본딩 장치, 박리 유닛, 콜릿 및 반도체 장치의 제조 방법 Download PDF

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Publication number
KR102430326B1
KR102430326B1 KR1020200081390A KR20200081390A KR102430326B1 KR 102430326 B1 KR102430326 B1 KR 102430326B1 KR 1020200081390 A KR1020200081390 A KR 1020200081390A KR 20200081390 A KR20200081390 A KR 20200081390A KR 102430326 B1 KR102430326 B1 KR 102430326B1
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South Korea
Prior art keywords
die
dicing tape
collet
movable stage
stage
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KR1020200081390A
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Korean (ko)
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KR20210032893A (ko
Inventor
히로시 마끼
아끼라 사이또
즈요시 요꼬모리
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파스포드 테크놀로지 주식회사
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    • H01L21/67132—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0442—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0438—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
    • H01L21/52—
    • H01L21/67144—
    • H01L21/6836—
    • H01L21/6838—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0446—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3302—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7402—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/744—Details of chemical or physical process used for separating the auxiliary support from a device or a wafer
    • H10P72/7442—Separation by peeling
    • H10P72/7444—Separation by peeling using a peeling wedge, a knife or a bar
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/78—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using vacuum or suction, e.g. Bernoulli chucks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H01L2221/6839—

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  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Die Bonding (AREA)
KR1020200081390A 2019-09-17 2020-07-02 다이 본딩 장치, 박리 유닛, 콜릿 및 반도체 장치의 제조 방법 Active KR102430326B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2019-168865 2019-09-17
JP2019168865A JP7377654B2 (ja) 2019-09-17 2019-09-17 ダイボンディング装置、剥離ユニット、コレットおよび半導体装置の製造方法

Publications (2)

Publication Number Publication Date
KR20210032893A KR20210032893A (ko) 2021-03-25
KR102430326B1 true KR102430326B1 (ko) 2022-08-08

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KR1020200081390A Active KR102430326B1 (ko) 2019-09-17 2020-07-02 다이 본딩 장치, 박리 유닛, 콜릿 및 반도체 장치의 제조 방법

Country Status (4)

Country Link
JP (1) JP7377654B2 (https=)
KR (1) KR102430326B1 (https=)
CN (1) CN112530834B (https=)
TW (1) TWI719896B (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7658778B2 (ja) * 2021-03-29 2025-04-08 芝浦メカトロニクス株式会社 実装装置
JP2024024567A (ja) * 2022-08-09 2024-02-22 ファスフォードテクノロジ株式会社 半導体製造装置および半導体装置の製造方法
US12456709B2 (en) 2022-12-28 2025-10-28 International Business Machines Corporation Structures and processes for void-free hybrid bonding
JP7497920B1 (ja) * 2023-08-09 2024-06-11 株式会社新川 ピックアップユニット、実装装置、およびピックアップ方法
JP2025074826A (ja) 2023-10-30 2025-05-14 リンテック株式会社 移載装置および移載方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005243834A (ja) * 2004-02-25 2005-09-08 Nitto Denko Corp コレット及びそれを用いたチップのピックアップ方法
JP2008270417A (ja) * 2007-04-18 2008-11-06 Canon Machinery Inc 半導体装置の製造装置及び製造方法
KR101385443B1 (ko) 2013-09-13 2014-04-16 이향이 반도체 칩 픽업 이송용 콜렛

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100526193B1 (ko) * 2003-10-15 2005-11-03 삼성전자주식회사 다이 본더 설비 및 이를 이용한 반도체 칩 부착방법
JP2005322815A (ja) * 2004-05-11 2005-11-17 Matsushita Electric Ind Co Ltd 半導体製造装置および半導体装置の製造方法
JP4664150B2 (ja) * 2005-08-05 2011-04-06 ルネサスエレクトロニクス株式会社 半導体装置の製造方法および半導体製造装置
JP5054933B2 (ja) * 2006-05-23 2012-10-24 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
JP4397429B1 (ja) * 2009-03-05 2010-01-13 株式会社新川 半導体ダイのピックアップ装置及びピックアップ方法
JP5284144B2 (ja) * 2009-03-11 2013-09-11 芝浦メカトロニクス株式会社 半導体チップのピックアップ装置及びピックアップ方法
KR101562021B1 (ko) * 2009-08-11 2015-10-20 삼성전자주식회사 반도체 칩 부착 장치 및 반도체 칩 부착 방법
JP5813432B2 (ja) * 2011-09-19 2015-11-17 ファスフォードテクノロジ株式会社 ダイボンダ及びボンディング方法
JP6349496B2 (ja) * 2014-02-24 2018-07-04 株式会社新川 半導体ダイのピックアップ装置及びピックアップ方法
DE102014107729B4 (de) * 2014-06-02 2022-05-12 Infineon Technologies Ag Dreidimensionaler Stapel einer mit Anschlüssen versehenen Packung und eines elektronischen Elements sowie Verfahren zur Herstellung eines solchen Stapels
JP6018670B2 (ja) * 2015-06-15 2016-11-02 株式会社東芝 ダイボンディング装置、および、ダイボンディング方法
WO2017129171A1 (de) * 2016-01-29 2017-08-03 Jenoptik Optical Systems Gmbh Verfahren und vorrichtung zum herauslösen eines mikro-chips aus einem wafer und aufbringen des mikro-chips auf ein substrat
JP6621771B2 (ja) * 2017-01-25 2019-12-18 ファスフォードテクノロジ株式会社 半導体製造装置および半導体装置の製造方法
JP6653273B2 (ja) * 2017-01-26 2020-02-26 ファスフォードテクノロジ株式会社 半導体製造装置および半導体装置の製造方法
JP6941513B2 (ja) * 2017-09-07 2021-09-29 ファスフォードテクノロジ株式会社 半導体製造装置および半導体装置の製造方法
JP6967411B2 (ja) * 2017-09-19 2021-11-17 ファスフォードテクノロジ株式会社 半導体製造装置、半導体装置の製造方法およびコレット

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005243834A (ja) * 2004-02-25 2005-09-08 Nitto Denko Corp コレット及びそれを用いたチップのピックアップ方法
JP2008270417A (ja) * 2007-04-18 2008-11-06 Canon Machinery Inc 半導体装置の製造装置及び製造方法
KR101385443B1 (ko) 2013-09-13 2014-04-16 이향이 반도체 칩 픽업 이송용 콜렛

Also Published As

Publication number Publication date
TW202113992A (zh) 2021-04-01
JP7377654B2 (ja) 2023-11-10
CN112530834B (zh) 2024-03-08
KR20210032893A (ko) 2021-03-25
CN112530834A (zh) 2021-03-19
TWI719896B (zh) 2021-02-21
JP2021048201A (ja) 2021-03-25

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