CN112530834B - 芯片贴装装置、剥离单元、筒夹及半导体器件的制造方法 - Google Patents

芯片贴装装置、剥离单元、筒夹及半导体器件的制造方法 Download PDF

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Publication number
CN112530834B
CN112530834B CN202010770198.7A CN202010770198A CN112530834B CN 112530834 B CN112530834 B CN 112530834B CN 202010770198 A CN202010770198 A CN 202010770198A CN 112530834 B CN112530834 B CN 112530834B
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China
Prior art keywords
bare chip
dicing tape
collet
movable table
die
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CN202010770198.7A
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Chinese (zh)
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CN112530834A (zh
Inventor
牧浩
齐藤明
横森刚
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Fasford Technology Co Ltd
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Fasford Technology Co Ltd
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0442—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0438—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0446—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3302—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7402—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/744—Details of chemical or physical process used for separating the auxiliary support from a device or a wafer
    • H10P72/7442—Separation by peeling
    • H10P72/7444—Separation by peeling using a peeling wedge, a knife or a bar
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/78—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using vacuum or suction, e.g. Bernoulli chucks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting

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  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Die Bonding (AREA)
CN202010770198.7A 2019-09-17 2020-08-04 芯片贴装装置、剥离单元、筒夹及半导体器件的制造方法 Active CN112530834B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019-168865 2019-09-17
JP2019168865A JP7377654B2 (ja) 2019-09-17 2019-09-17 ダイボンディング装置、剥離ユニット、コレットおよび半導体装置の製造方法

Publications (2)

Publication Number Publication Date
CN112530834A CN112530834A (zh) 2021-03-19
CN112530834B true CN112530834B (zh) 2024-03-08

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CN202010770198.7A Active CN112530834B (zh) 2019-09-17 2020-08-04 芯片贴装装置、剥离单元、筒夹及半导体器件的制造方法

Country Status (4)

Country Link
JP (1) JP7377654B2 (https=)
KR (1) KR102430326B1 (https=)
CN (1) CN112530834B (https=)
TW (1) TWI719896B (https=)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7658778B2 (ja) * 2021-03-29 2025-04-08 芝浦メカトロニクス株式会社 実装装置
JP2024024567A (ja) * 2022-08-09 2024-02-22 ファスフォードテクノロジ株式会社 半導体製造装置および半導体装置の製造方法
US12456709B2 (en) 2022-12-28 2025-10-28 International Business Machines Corporation Structures and processes for void-free hybrid bonding
JP7497920B1 (ja) * 2023-08-09 2024-06-11 株式会社新川 ピックアップユニット、実装装置、およびピックアップ方法
JP2025074826A (ja) 2023-10-30 2025-05-14 リンテック株式会社 移載装置および移載方法

Citations (8)

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JP2005243834A (ja) * 2004-02-25 2005-09-08 Nitto Denko Corp コレット及びそれを用いたチップのピックアップ方法
JP2008270417A (ja) * 2007-04-18 2008-11-06 Canon Machinery Inc 半導体装置の製造装置及び製造方法
US20100055878A1 (en) * 2006-05-23 2010-03-04 Renesas Technology Corp. Fabrication Method of Semiconductor Device
CN103000562A (zh) * 2011-09-19 2013-03-27 株式会社日立高新技术仪器 芯片接合机及接合方法
CN107251212A (zh) * 2016-01-29 2017-10-13 业纳光学系统有限公司 用于从晶片中取出微芯片并且将微芯片施装到基底上的方法和设备
JP2018120938A (ja) * 2017-01-25 2018-08-02 ファスフォードテクノロジ株式会社 半導体製造装置および半導体装置の製造方法
JP2019047089A (ja) * 2017-09-07 2019-03-22 ファスフォードテクノロジ株式会社 半導体製造装置および半導体装置の製造方法
CN109524313A (zh) * 2017-09-19 2019-03-26 捷进科技有限公司 半导体制造装置、半导体器件的制造方法及筒夹

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KR100526193B1 (ko) * 2003-10-15 2005-11-03 삼성전자주식회사 다이 본더 설비 및 이를 이용한 반도체 칩 부착방법
JP2005322815A (ja) * 2004-05-11 2005-11-17 Matsushita Electric Ind Co Ltd 半導体製造装置および半導体装置の製造方法
JP4664150B2 (ja) * 2005-08-05 2011-04-06 ルネサスエレクトロニクス株式会社 半導体装置の製造方法および半導体製造装置
JP4397429B1 (ja) * 2009-03-05 2010-01-13 株式会社新川 半導体ダイのピックアップ装置及びピックアップ方法
JP5284144B2 (ja) * 2009-03-11 2013-09-11 芝浦メカトロニクス株式会社 半導体チップのピックアップ装置及びピックアップ方法
KR101562021B1 (ko) * 2009-08-11 2015-10-20 삼성전자주식회사 반도체 칩 부착 장치 및 반도체 칩 부착 방법
KR101385443B1 (ko) 2013-09-13 2014-04-16 이향이 반도체 칩 픽업 이송용 콜렛
JP6349496B2 (ja) * 2014-02-24 2018-07-04 株式会社新川 半導体ダイのピックアップ装置及びピックアップ方法
DE102014107729B4 (de) * 2014-06-02 2022-05-12 Infineon Technologies Ag Dreidimensionaler Stapel einer mit Anschlüssen versehenen Packung und eines elektronischen Elements sowie Verfahren zur Herstellung eines solchen Stapels
JP6018670B2 (ja) * 2015-06-15 2016-11-02 株式会社東芝 ダイボンディング装置、および、ダイボンディング方法
JP6653273B2 (ja) * 2017-01-26 2020-02-26 ファスフォードテクノロジ株式会社 半導体製造装置および半導体装置の製造方法

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005243834A (ja) * 2004-02-25 2005-09-08 Nitto Denko Corp コレット及びそれを用いたチップのピックアップ方法
US20100055878A1 (en) * 2006-05-23 2010-03-04 Renesas Technology Corp. Fabrication Method of Semiconductor Device
JP2008270417A (ja) * 2007-04-18 2008-11-06 Canon Machinery Inc 半導体装置の製造装置及び製造方法
CN103000562A (zh) * 2011-09-19 2013-03-27 株式会社日立高新技术仪器 芯片接合机及接合方法
CN107251212A (zh) * 2016-01-29 2017-10-13 业纳光学系统有限公司 用于从晶片中取出微芯片并且将微芯片施装到基底上的方法和设备
JP2018120938A (ja) * 2017-01-25 2018-08-02 ファスフォードテクノロジ株式会社 半導体製造装置および半導体装置の製造方法
JP2019047089A (ja) * 2017-09-07 2019-03-22 ファスフォードテクノロジ株式会社 半導体製造装置および半導体装置の製造方法
CN109524313A (zh) * 2017-09-19 2019-03-26 捷进科技有限公司 半导体制造装置、半导体器件的制造方法及筒夹

Also Published As

Publication number Publication date
TW202113992A (zh) 2021-04-01
KR102430326B1 (ko) 2022-08-08
JP7377654B2 (ja) 2023-11-10
KR20210032893A (ko) 2021-03-25
CN112530834A (zh) 2021-03-19
TWI719896B (zh) 2021-02-21
JP2021048201A (ja) 2021-03-25

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